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2009-12-18 TSMC unveils BCD process for LED drivers
The new technologies feature a voltage spectrum running from 12V to 60V to support multiple LED applications.
2010-04-15 TSMC skips 22nm, leaps to 20nm half-node
Taiwan Semiconductor Manufacturing Co. Ltd announced plans to skip the 22nm "full node" after the 28nm node and move directly to the 20nm "half node."
2005-09-21 TSMC promises MEMS platform in '06
After three years of research and development, foundry Taiwan Semiconductor Manufacturing Co. believes 2006 will be the year it begins to see results from its efforts to merge IC process technology with microelectromechanical systems (MEMS).
2004-11-26 TSMC moves 40V 0.18?m process to volume production
Taiwan Semiconductor Mfg Co. Ltd said Tuesday (Nov. 23) that it has a 40V, 0.18?m, manufacturing process in volume production.
2003-06-04 TSMC latest reference flow adopts Cadence platform
TSMC has selected Cadence Design Systems Inc.'s Encounter digital IC design platform as an integral part of TSMC's latest Reference Flow 4.0.
2009-03-03 TSMC details litho roadmap, taps maskless
Taiwan Semiconductor Manufacturing Co. Ltd has detailed it lithography roadmap and said it is still backing maskless technology at the SPIE Advanced Lithography conference.
2008-10-03 TSMC delays high-k offering to 28nm
Taiwan Semiconductor Manufacturing Co. Ltd has rolled out its 28nm process and disclosed it will push out its initial high-k/metal-gate offering until 28nm, putting it slightly behind its rivals in Chartered, IBM and Samsung.
2012-10-30 Triple-play graphics cores accelerate auto apps
Learn about the triple-play GPUs featured in the i.MX6 devices and the advantages that result from using three specialized graphics engines.
2009-01-14 Trio works on e-beam solutions
Vistec Electron Beam Lithography Group, CEA/Leti and D2S Inc. have announced a collaboration focused on refining and validating advanced design-for-e-beam (DFEB) solutions for the 45nm and 32nm nodes.
2015-04-23 Trickle-down tech: It's not just the Pi
.The Raspberry Pi may be the most visible example of trickle-down technology, but there are over 100 board vendors embracing semiconductor innovation and bringing it to the wider world of embedded boards for diverse, long-life, and ruggedised applications.
2013-12-02 Transphorm, Fujitsu to merge GaN power device biz
Fujitsu will establish a new company in Japan for the GaN power device business, where it will transfer its combined design and development assets as well as IP rights in GaN power devices.
2005-05-16 Trailblazing trends in manufacturing services
Finding the company's niche of expertise will push business to a higher level.
2011-06-15 TowerJazz joins R&D project in Argentina
TowerJazz signed an agreement with Tecnopolis del Sur to promote the economic and technological development in Argentina.
2002-03-14 Tower yields first 0.18?m wafer output
Israel wafer manufacturer Tower Semiconductor Ltd has produced its first 0.18?m wafer output from its Fab 2 pilot line with higher-than-expected yields.
2002-08-22 Tower Semiconductor adopts PDF Solution technology
PDF Solutions Inc. has partnered with Tower Semiconductor Ltd on a program to enhance the yield and performance of 0.185m CMOS process technology at Tower's Fab 2.
2002-09-30 Tower licenses Motorola CMOS technology
Tower Semiconductor Ltd and Motorola's Semiconductor Products Sector have entered into an agreement for the technology transfer and licensing of 0.135m CMOS process technology.
2009-11-03 Touch sense MCUs offer wake-on-touch capability
The MCUs feature a capacitance-to-digital converter that enables best-in-class touch sensing in end products.
2010-07-06 Touch MCUs with LDO operate at 150?A/MHz
Silicon Laboratories Inc. touts the lowest power touch-sense microcontrollers maintaining a 150?A/MHz operation by virtue of an integrated low-dropout (LDO) regulator.
2015-01-13 Total IP sol'n for MIPI SoundWire aimed at mobile devices
Arasan's MIPI SoundWire IP solution is fully configurable for a number of options such as data ports, SoundWire bus lanes and audio sample widths to meet a range of audio applications.
2002-12-17 Tosoh launches two contract manufacturers
Tosoh Corp. has officially launched manufacturing operations at Tosoh TCM Inc. and Tosoh de Mexico, its contract manufacturers of high precision components.
2015-12-22 Top 10 innovative products of 2015
Many companies have introduced products in preparation for the growing IoT. There are also innovations in computing devices, where chips have not only become smaller but more powerful as well.
2005-03-07 Toolbox enables fixed-point design directly in MATLAB
The MathWorks announced the availability of the new Fixed-Point Toolbox and Simulink Fixed Point, bringing fixed-point design capabilities to MATLAB and enhanced fixed-point simulation in Simulink.
2006-03-27 Tool suite to support eclipse 3.1 platform
Accelerated Technology, a Mentor Graphics division, announced a new version of its EDGE Tool Suite which supports Eclipse 3.1, the latest version of the open framework.
2006-11-16 Tool makes ADI chip evaluation easier
Analog Devices Inc. has developed a Web-based evaluation tool for direct digital synthesis (DDS) ICs sold by the company.
2010-06-24 Tips on reducing debug efforts
Debug will get your attention one way or another. If you give it attention early in the development cycle, it will reduce the amount of time spent on debug later and in future designs.
2007-09-03 Tips for successful structured ASIC designs
The use of structured ASIC for custom IC design is an increasingly attractive option. This article provides useful tips for structured ASIC designs.
2008-07-30 Tiny comparators draw ultralow power
Maxim Integrated Products introduces the MAX9060-MAX9065 ultralow-power, low-voltage comparators.
2002-08-28 TI, MathWorks codevelop DSP development tools
Texas Instruments Inc. and MathWorks have collaborated on two new tools designed to simplify development and speed time to market for DSP-based systems.
2004-11-18 TI unveils 11bit, 65MSPS ADC for China market
TI released what it claims as the highest performing, lowest-powered, high IF application, 11bit, 65MSPS CMOS pipeline ADC for export to China.
2014-09-12 TI rolls ecosystem for digital power tool designers
The third-party ecosystem of digital power hardware and software tools allow digital power design engineers who use TI's portfolio of C2000 MCUs to develop their systems quickly and easily.
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