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2002-05-01 Zeevo's BlueStamp reference design corners Bluetooth qualification
Zeevo Inc. has announced the Bluetooth qualification of its reference design, the BlueStamp. The reference design is a complete Bluetooth solution based on the TC2000 Bluetooth IC.
2007-06-08 Xilinx marks production qualification milestone of Virtex-5 devices
Xilinx has announced production qualification of its LX50 and LX50T FPGAs, the first two devices in the Virtex-5 65nm series.
2002-08-19 UMC deploys Numerical mask qualification products
UMC has deployed Numerical Technologies Inc.'s simulation-based mask qualification products, specifically the Virtual Stepper and i-Virtual Stepper, in its Taiwan facilities.
2015-11-27 Place and route sol'n passes Samsung's 10nm qualification
Synopsys announced that its IC Compiler II has been qualified for Samsung Foundry's latest 10nm process, promising significant improvement in throughput and designer productivity.
2004-12-22 Nortel softswitch gains Euro-PacketCable qualification
Nortel's softswitch has achieved Euro-PacketCable qualification, one of the first such switches to gain such approval from the Euro-Cable Certification Board (ECB), a consortium of 12 major European cable operators.
2001-09-21 ISR qualification process
This application note explains the rigorous qualification processes that the Power Trends ISRs (integrated switching regulators) go through before they are introduced into production.
2005-09-23 Innotech earns Alien Tech RFID label converter qualification
Innotech Resources Pte Ltd, a label manufacturer and converter in Singapore has succeeded in Alien Technology's RFID label converter qualification program
2005-10-26 IC Interconnect announces Ni/Au process qualification
Wafer bumping service company, IC Interconnect has announced the qualification of its Ni/Au pad resurfacing process for high-temperature wire bond applications. The new process produces high-temperature stable bonds with a thinner gold layer. These wire bonds can be used in avionics and automotive apps, and does not require additional lead time for production.
2011-08-09 GENIVI specs simplify development, qualification process
Linux-based GENIVI specifications promise simplified development and qualification processes in IVI systems as well as compatibility across the industry.
2001-09-21 Excelics wafer qualification procedure
This application note presents a flowchart of Excelics' wafer qualification procedures.
2014-12-11 Cypress BLE sol'ns achieve Bluetooth 4.1 qualification
The Bluetooth Low Energy solutions integrate a Bluetooth Smart radio, a 32bit ARM Cortex-M0 core with ultra-low-power modes, programmable analogue blocks and CapSense capacitive touch-sensing.
2012-01-16 Audio devices get Bluetooth 4 qualification
The CSR8600TM wireless audio platform now claims to deliver ultra low-power connectivity and simple data transfer for a range of wireless accessories.
2006-07-28 Atmel MCU meets 150C automotive qualification
Atmel has unveiled the ATmega88 AVR microcontroller that is now capable of withstanding automotive temperature extremes.
2015-02-18 Understand product failures through bathtub curves
The likelihood of a component failing to properly function over time can be described by the bathtub curve. Read this article to learn more about this concept.
2003-01-22 UMC extends licensing deal with Numerical Tech
United Microelectronics Corp. has extended its phase-shifting technology licensing agreement with Numerical Technologies Inc. as UMC migrates to the 90nm process-generation.
2010-01-25 Ultrafast high-voltage rectifiers are DSCC-qualified
Microsemi Corp. announced that its 200-, 400- and 600V family of MIL-PRF-19500/590 ultrafast rectifiers in a compact thermally matched glass package are now DSCC-qualified.
2009-12-04 TSMC launches auto-grade IC manufacturing spec
The automotive process qualification specification was first proposed at the Automotive Electronic Council in 2008.
2005-08-01 Testing and qualifying a Bluetooth design
Avoid pitfalls in adding Bluetooth functionality to an existing design by minding these guidelines that help engineers prevent time-to-market delays
2011-05-16 Springsoft software adds advanced verification tech
Springsoft has integrated an advanced technology platform to its Certitude Functional Qualification System that will enable broader deployment of verification qualification methodologies.
2012-12-06 Speed up time-to-market by cutting ESD test time
To reduce test times, increase qualification speed and preserve accuracy, an intelligent sampling method can be applied to groups of pins that share the same applications.
2014-10-02 Soldering requirements for BQFN packages
Learn about the soldering requirements, reflow profile, surface-mount soldering qualification, MSL compliance, visual inspection as well as removal and rework with regard to BQFN packages.
2004-10-26 Ramtron FRAM memory achieves AEC Q100 standard
Ramtron Int. Corp., a supplier of nonvolatile ferroelectric semiconductor products, has disclosed that it's FM25640 64Kb serial SPI FRAM product is now qualified under the Automotive Electronic Council's Stress Test Qualification for ICs (AEC Q100).
2001-09-11 MIL-PRF-19500 Qual chips versus MIL-PRF-38534 Qual chips
This application note defines two qualification levels in purchasing discrete chips for use in highly reliable hybrid and MCM systems.
2002-10-09 Microsoft selects Silicon Wave components to test XP compatibility
Microsoft Corp. has authorized Silicon Wave Inc.'s Bluetooth radio modem, baseband processor, and protocol software, for the testing of Bluetooth wireless capabilities of products using the Windows XP OS.
2003-05-28 KLA-Tencor PWQ accelerates reticle design verification
The Process Window Qualification of KLA-Tencor is claimed to be the industry's first solution for sub-100nm design lithographers.
2011-01-17 Fujitsu auto electronics adopts Springsoft system
SpringSoft's Certitude System is to be used by Fujitsu's automotive business unit to raise the quality of verification environments and I) design components required to develop automotive MCU solutions.
2000-03-01 Deep acquisition memory solves debug problems
Use deep acquisition memory in logic analyzers to increase the viewable window of time around the trigger, increase the sampling resolution in a given block of time, and/or simplify trigger definition.
2007-08-03 CSR qualifies Bluetooth firmware to v2.1
CSR announces that it has qualified its Bluetooth firmware to v2.1 of the Bluetooth specification.
2002-09-09 Amkor to render manufacturing services to Agilent
Amkor Technology Inc. has formed a technology development alliance and manufacturing services agreement with Agilent Technologies Inc.
2003-04-01 Xilinx qualifies for 300mm production at UMC
Xilinx Inc. has announced production qualification for its 130nm Virtex-II Pro on 300mm wafers with fab partner United Microelectronics Corp. at the latter's manufacturing facility, Fab12a, in Taiwan.
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