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What is DRAM?
Dynamic random access memory (DRAM) is a type of random access memory that stores each bit of data in a separate capacitor within an IC. Since real capacitors leak charge, the information eventually fades unless the capacitor charge is refreshed periodically. Because of this refresh requirement, it is a dynamic memory as opposed to SRAM and other static memory. And unlike non-volatile firmware chips, both DRAM and SRAM lose their content when the power is turned off.
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2003-02-28 Silicon collaboration to develop next-gen RDRAM chipset
Silicon Integrated Systems Corp. has collaborated with Samsung Electronics Co. Ltd, ASUSTeK Computer Inc., and Rambus Inc., on the development of a next-generation RDRAM-based chipset - the SiSR659.
2002-07-09 Samsung RDRAM module operates at 4.2GBps
Samsung Electronics Co. Ltd has announced the release of a 32-bit RIMM4200 RDRAM module that operates at 4.2GBps.
2001-08-24 RDRAM thermal interface material specification
This application note specifies the thermal interface material properties for robust thermal/mechanical performance of the RIMM assembly. It applies to RIMMs with cover assemblies over the RDRAM components
2002-07-01 Juniper integrates Rambus RDRAM in its Internet routers
Rambus Inc.'s RDRAM technology has been incorporated into Juniper Networks' T-series Internet routing family, including the T640 Internet Routing Node.
2002-09-12 Intel to support faster RDRAM technology
Intel Corp. has put its stamp of approval on the 1,066MHz RDRAM and will support the faster memory speed grade through a memory controller in a future chipset.
2001-08-24 How to measure RDRAM system clock jitter
This application note is intended to document a "best known method" (BKM) for making repeatable and accurate timing measurements for the Direct Rambus Clock Generator (DRCG) and derivative devices.
2003-01-30 Elpida RDRAM operates to 1.066GHz
Elpida Memory has announced the availability of its 288Mb Rambus DRAM devices that operate at speeds of up to 1.066GHz.
2001-08-27 Direct RDRAM thermal design methodology: Determining plate temperature based on die test temperature and device power
This application note establishes a methodology that a module vendor can follow to define the maximum allowable plate temperature, based on the following options they have in designing their module: device power; thermal interface material; module cover (or heat spreader); and maximum allowable device temperature.
2002-02-01 Suppliers' support for Rambus varies
Samsung says yes. Infineon says no. Elpida says maybe. Such are the mixed messages that DRAM makers are giving on whether they will continue to deliver faster and denser versions of Rambus DRAM.
2002-05-03 Rambus memory module delivers 4.2GBps bandwidth
The RIMM 4200 memory module from Rambus Inc. integrates two RDRAM memory channels to deliver 4.2GBps of memory bandwidth from a single module.
2002-01-15 Rambus feels effects of declining prices
Rambus Inc. said its revenues fell to $24.9 million in the quarter ended Dec. 31, an 11 percent drop from the previous quarter.
2002-01-30 Kingston ships high-density RIMMs
Kingston Technology announced the availability of a new line of SO-RIMMs utilizing 288Mb and 256Mb high-density RDRAMs.
2006-02-01 How memory architectures affect system performance
While peak data rate remains important, other architectural parameters significantly affect the memory system performance.
2002-04-24 Elpida SO-RIMM provides 1.6GBps memory bandwidth
Elpida Memory Inc.'s line of SO-RIMM modules integrate an 800MHz RDRAM device that features an access time of 40ns and deliver up to 1.6GBps of memory bandwidth, making the modules suitable for use in networking and telecommunication devices.
2002-05-29 Elpida RIMMs deliver 3.2GBps throughput
Elpida Memory Inc.'s 32-bit RIMMs incorporate two independent 16-bit RDRAM (18-bit for ECC) channels to deliver 3.2GBps throughput within the same space as single-channel RIMMs.
2002-10-18 DRAM makers begin march toward DDR-2
Prepping for the high-end systems that should appear in 2004, chip vendors are laying the groundwork for next-generation DDR DRAM.
2001-04-15 DRAM flavors shift for post-PC future
A constant momentum has forced the DRAM community to accommodate many architectural changes. When PC required a memory solution that had higher density, was faster and consumed low voltage, the industry responded by developing the SDR SDRAM.
1999-11-30 Designing a multimedia subsystem with Rambus DRAMs
Direct RDRAMs have three features that make them very efficient for graphics operations: zero delay between reads and writes, independent row and column resources, and pipelined write capability.
2000-03-10 CSP die shrink solution for memory devices
This application note shows the effectiveness of die shrink as a package solution for memory devices. In the case of the 8-by-10mm Direct Rambus DRAM device, about 350 dies can be obtained from a single 203.2mm wafer. The 85 percent linear shrink allows an addition of 150 dice from the same size wafer.
2001-07-02 1066 MHz Rambus DRAM For OC-192 Line Card Applications
This paper examines the architecture of a modern line card and presents an optimum packet buffer design using 1,066MHz 4i Rambus DRAM (RDRAM) for the local storage packet buffer.
2001-07-16 Comparing emerging RAM technologies
New memory technologies force us to challenge past design assumptions. Read this introduction to FRAM, DDR SDRAM, and RDRAM before starting your next project.
2003-11-12 ASUS releases motherboard for Pentium 4 architecture
Claimed by ASUSTeK Computer Inc. (ASUS) as the world's fastest motherboard for PC apps, the P4S13G PC motherboard features four channels of RDRAM devices.
2005-01-31 Samsung rolls out XDR DRAM with 8GBps transfer speed
Samsung announced that it has begun mass producing 256Mb XDR DRAM, its next-generation memory device for multimedia apps.
2015-08-19 Rambus goes fabless with DDR4 server memory chipset
Rambus said its new DDR4 RDIMM and LRDIMM chipset make a big difference in server-based memory performance by delivering increased speed, reliability and power efficiency.
2006-06-05 Micron, Hynix e-mails indicate price fixing scheme
Online reports said Micron and Hynix exchanged e-mails that suggest the companies colluded to fix memory chip prices in an effort to hurt Rambus.
2002-12-19 Memory sector drives semiconductor market in '02
Worldwide DRAM revenue reached $16.2 billion in 2002, a 36.7 percent increase from 2001, according to preliminary statistic released by Dataquest Inc.
2014-05-15 Jedec to re-accept Rambus after 20-year hiatus
Jedec memory standards group is poised to accept Rambus again in the alliance after it resolved lawsuits involving as many as 15 chipmakers that were also members.
2002-10-14 Intel chipsets support HyperThreading technology
Intel Corp. has delivered four new desktop chipsets that support the company's HyperThreading Technology.
2003-12-19 IDC sees near-term growth for DRAM market
Recovering demand and controlled bit supply will boost the worldwide DRAM market for the next two years, according to IDC's latest DRAM market forecast. However, the report also reveals that oversupply due to expanding production by 12-inch fabs will pull the market down after 2005, leading to a correction in the middle of the forecast period. Despite this correction, IDC predicts that the DRAM market will grow from $16.5 billion in revenue in 2003 to $24.7 billion in 2007.
2003-10-23 GDA rolls out design kit for Intel processors
GDA Technologies Inc. has released its Reference Design Kit for Intel's IXP2400 and IXP2800 network processors.
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