Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > retention pins

retention pins Search results

?
?
total search26 articles
2006-10-26 Q2 connector system adds Retention Pin option
Samtec has added to the features of its Q2 second-generation, high-speed connector system a standard Retention Pin option that can as much as double the unmating forces in typical applications up to 100 cycles
2007-01-11 Samtec adds new options to connector systems
Samtec has added new options to its Q2 second-generation high-speed connector system: integrated power pins, RF connectors and retention pins for increased unmating force.
2012-12-17 Mill-Max USB 3.0 boasts 5Gbit/s data transfer rate
SuperSpeed USB is a Sync-N-Go technology that minimises user wait time and provides optimised power efficiency.
2003-05-27 Amphenol connectors provide secure mating
Amphenol Industrial Operations has introduced the GTM-C series of rear-release connectors that features a metal clip contact retention system
2002-05-08 STMicro ships 4Mb DSP Flash memory
Designed specifically for Analog Devices Inc.'s ADSP-2153x series of DSPs, the DSM2150F5 4Mb Flash memory provides two independent Flash memory arrays, 120ns access time, and 15-year data retention capability
2007-10-18 Right-angle, edge-mount high-speed connectors roll
Samtec Inc. has grown its Q2 second-generation Q Series high-speed connector system, the QMS and QFS series, with right-angle and edge-mount connectors for perpendicular and co-planar board mating applications.
2006-09-15 STMicro unveils 8/16Mbit serial Flash in SO8N package
STMicroelectronics has introduced new high-speed 8Mbit and 16Mbit serial Flash memories in SO8N, said to be the smallest package for these densities.
2002-05-14 STMicro offers 4Mb, 8Mb serial Flash devices
STMicroelectronics has announced the release of the M25P40 (4Mb) and M25P80 (8Mb) serial Flash memories targeted for serial code-download in HDDs, DVD players, graphics cards, WLANs, and STBs.
2002-06-13 STMicro Flash memories target LPC bus interface
STMicroelectronics has introduced a family of Flash memories targeted at the industry-standard low pin-count bus interface used in computer motherboard architectures.
2014-04-01 Selecting housing materials for DDR4 memory module
The design and type of connector determines the set of materials that can be considered for the housing.
2006-11-22 Power modules enable compact, reliable systems
ERNI said it MicroSpeed Power Modules fulfill the need for miniaturized and high-reliability power systems and offers a large number of options for mezzanine applications.
2006-11-24 Page-erasable serial flash targets PC BIOS apps
STMicroelectronics' new 16Mbit serial flash memory chip is targeted at PC BIOS applications as well as optical disk drives, digital voice recorders, networking products and STBs.
2014-04-14 Overcome challenges in FPGA-based prototyping
Here's a look at FPGA-based prototyping challenges and an innovative methodology unifying the benefits of gate-level partitioning and RTL partitioning, providing a short, automated, and predictable path to prototype.
2003-08-26 Molex miniSD card connectors save memory space
Molex Inc.'s series of miniSD card connectors and adapters is claimed by the company to be the smallest memory card solution for mobile phone apps.
2002-04-22 Kycon USB connector is 25 percent smaller
Intended for high-speed data transfer between desktop PCs and external peripherals such as printers and scanners, the A-type USB connector from Kycon Inc. offers a footprint 25 percent smaller than previous devices, thereby saving on PCB space.
2007-03-05 Is MRAM right for your consumer embedded device application?
Available memories on the market have inherent limitations that prevent them from offering the best memory features. However, with further refinement, MRAM could someday be hailed as the universal memory.
2013-01-28 Fit in large-capacity memory in advanced-node SoCs
Using large-capacity SRAMs can dramatically reduce leakage and deliver higher system performance while keeping mask costs in check.
2014-09-02 Enable low-cost isoSPI coupling for battery systems
By using an AC-coupling method, we can eliminate the double insulation requirement, and therefore mitigate the cost impact of high voltage isoSPI systems.
2012-10-19 Employ hierarchical methods for power intent specification
Here's a guide to using a hierarchical low-power design methodology.
2009-12-03 Driving reliable automotive system design with FPGAs
For FPGAs to be part of an ultra-reliable design, designers must protect the valid FPGA configuration used for initialization and prevent SRAM corruption during device operation.
2009-01-27 Driving reliable automotive designs
For FPGAs to be part of an ultra-reliable design, designers must protect the valid FPGA configuration used for initialization and prevent SRAM corruption during device operation
2011-12-08 Designing 3D-ICs (Part 2)
Here's the second instalment of this series that tackles the tools that can be used to handle a complete backend flow, and enable true 3D design partitioning, synthesis, placement, and routing.
2005-11-08 D-sub connectors tolerate harsh conditions
ITT Electronic Components offers Cannon Grommet D range of D-subminiature connectors.
2008-11-05 Building ultra-reliable automotive systemsPart 2
With increasing frequency, automotive manufacturers regularly inquire about using FPGAs in high-reliability systems. In this continuation posting, I will highlight solutions that mitigate potential SRAM corruption issues.
2006-10-06 ARM7 Flash MCUs feature 54MIPS, low-power modes
ST's STR7 family promises 54MIPS (at 60MHz) performance while providing outstanding low power modes.
2008-07-08 1Mbit serial EEPROM completes data transfer in 1sec
STMicroelectronics has launched 1MHz two-wire serial EEPROMs in 256Kbit, 512Kbit and 1Mbit densities, compatible with I?C Fast-Mode-Plus allowing data rates up to 2.5x faster than the I?C Fast-mode.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top