Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > rf chipset

rf chipset Search results

?
?
total search367 articles
2005-04-25 Fujitsu, SiGe Semi collaborate on WiMAX design
Fujitsu Microelectronics America Inc. and SiGe Semiconductor Inc. have announced the availability of a complete reference design for developing WiMAX-capable broadband wireless access systems.
2006-11-30 Frontier Silicon unrolls 'smallest' DAB radio module
Frontier Silicon has launched the Capri FS3010, a DAB digital radio module touted to be the industry's smallest and lowest-cost.
2006-08-03 Freescale cuts die area, thickness with new chip packaging tech
Freescale's proprietary redistributed chip packaging technique delivers about a 30 percent reduction in packaged-die area and thickness.
2002-10-23 Ethertronics, Magnolia Broadband co-design CDMA solution
Ethertronics Inc. has entered a product integration deal with Magnolia Broadband Inc.
2008-12-18 Enabling next-generation mobile TV handsets
Designers faced with making ubiquitous mobile TV a reality have a fair number of challenges in front of them, including battery life, reception, range, screen size, and picture quality
2014-01-14 Ecrio, GCT to integrate VoLTE into 4G chipsets
The companies expanded their collaboration to integrate Ecrio FlexIMS based VoLTE on GCT's 4G LTE chipsets.
2002-10-18 DRAM makers begin march toward DDR-2
Prepping for the high-end systems that should appear in 2004, chip vendors are laying the groundwork for next-generation DDR DRAM.
2000-05-03 Designing 802.11-compliant digital spread spectrum applications
This paper presents a 802.11-compliant transceiver chipset designed for Digital Spread Spectrum communication in the 2.4GHz ISM band. The chipset utilizes a single conversion architecture to optimize the system performance/cost tradeoff and supports multiple modulation schemes, including BPSK, QPSK, FSK and CCK
2002-06-28 DBTEL ramps mobile phone production
Asian handset maker DBTEL has begun full-scale production of its next-generation mobile phones and platform designs based on Royal Philips Electronics' innovative semiconductor technology and full software stack.
2003-03-17 Compact wireless modules bring benefits
Manufacturers are seeking to incorporate cellular technology into existing products, or to develop niche products for comparatively small markets.
2008-04-02 Commercial deployment commences for TD-SCDMA
China Mobile has announced the commercial deployment of TD-SCDMA technology in China beginning April, according to wireless baseband chipset provider Spreadtrum Communications
2006-03-01 Chipsets roll early for 802.11n
Broadcom announced sampling of an Intensi-fi chipset for 802.11n. Analysts were again taken aback three days later, when Atheros announced its XSpan AR5008 family for the same standard
2007-06-29 Chip receives digital video broadcast in cars
STMicroelectronics has announced it is providing the digital broadcasting chipset for Sirius Backseat TV service that delivers live TV directly to vehicles
2008-06-27 Chip networks home via UWB, coax, Ethernet
Sigma Designs has developed a second-generation UWB chip set for home networks that can simultaneously run UWB over wireless and coax at rates up to 370Mbit/s while maintaining a GbE link.
2006-01-24 Broadcom faces skepticism over early launch
Broadcom encountered skepticism from financial analysts when it announced sampling of an Intensi-fi 802.11n chipsetless than 24 hours after the IEEE announced a compromise draft proposal
2011-02-16 Atmel, Nvidia design kit enables next-gen mobile devices
Nvidia's Tegra 2 ARM-based processor and Atmel's mXT1386 touch-screen chipset will help OEMs fast-track development of Android-based smartphones, tablet PCs and other mobile Internet devices
2005-05-05 Atmel, KETI expand cooperation on digital broadcast standards
Atmel and the Korea Electronics Technology Institute have signed a letter of interest planning to further cooperate on digital broadcasting standards such as DAB, DMB and DRM.
2002-08-06 ALi to spin-off wireless IC design division
ALi Corp. has disclosed plans to separate its wireless telecom IC design division to form a subsidiary by the end of this year.
2003-10-06 Agilent unit invests in TelASIC
Agilent Technologies announced that Agilent Ventures has participated in the Series C Preferred Stock funding round for TelASIC Communications.
2006-02-17 Accelerated Tech, VIA Telecom extend licensing agreement
Accelerated Technology announced that VIA Telecom has extended its license agreement for the Nucleus RTOS to support VIA's CDMA baseband processors.
2005-02-01 3G integration not a linear progression
The road map toward 3G integration has been set; the tough ride to progress begins.
2006-02-24 South Korean firm offers T-DMB system-in-package
Integrant Technologies said it has developed a package-level decoder chipset that operates to Korea's mobile TV broadcasting standard called DMB
2000-06-09 RFIC Components for Cordless Phones
This technical note discusses a highly integrated two-device chipset that has been designed for cordless phones operating in the 915MHz ISM-band using direct-sequence spread-spectrum modulation
2007-11-16 Qulacomm 45nm chips target mass-market smart phones
Qualcomm has unveiled three new 45nm single-chip solutions designed to enable mass-market smart phones with an unsurpassed range of capabilities.
2003-01-09 Philips, GA to co-develop ultra-wideband chips
Royal Philips Electronics and General Atomics have signed an MOU to jointly develop Ultra-Wideband wireless communication chipsets and support the standardization process.
2007-03-16 Omap gets break in Moto design win
Motorola and TI recently inked a deal to expand their 3G and WiMAX collaborations?a move that should resuscitate TI's Omap baseband processor family.
2011-05-24 Multimedia chips target low-end mobile phones
Spreadtrum Communications released two new multimedia chipsets for low-end mobile phones. The chips offer a competitive cost structure for GSM/GPRS multimedia-rich mobile phones.
2002-12-04 Motorola, SiRF to co-develop "location-aware" chips
SiRF Technology Inc. will integrate its SiRFstarII GPS core technology into Motorola's wireless baseband and applications processors to location-enable a line of the latter's SPS chipsets for mobile devices.
2003-01-07 Low-cost China pushes Taiwan to consider alternatives
As the distinction blurs between Made in Taiwan and Made in China, a slogan has risen in Taiwan that captures the challenge of its future: innovalue.
2002-12-04 GPS receiver hardware design
This application note shows how to construct a complete 12-channel GPS receiver engine using the GP2000 chipset
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

?
?
Back to Top