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2014-08-05 WattUp takes RF approach to wire-free wearables charging
The RF platform developed by U.S.-based start-up Energous utilises 2.4GHz to 2.5GHz as well as 5.7GHz to 5.8GHz frequencies to power wearable devices and accessories up to 10W
2003-05-30 Visa, Philips team to promote 'contactless' credit card
Visa Int. and Royal Philips Electronics have formed an exclusive partnership agreement under which the two companies will jointly develop and promote the application of contactless chip technology for payment transactions.
2008-06-13 Virtualization spec brings PCIe to wider systems
The PCI-SIG recently released a set of standards that extends PCIe for a wide range of computer and communication systems. The I/O Virtualization specifications open the door to new ways to roll out shared networking capabilities for servers, and communications gear.
2006-08-01 Viiv to coexist with STBs
Intel Corp. is softening its stance on the central role of Viiv in the home, acknowledging that set-top boxes will continue to play a key part
2012-07-12 Ultracompact vehicles to roll in Japan
According to the transport ministry, the size and seating capacity of ultracompact cars will be less than that of minicars but greater than that of category-1 motorized vehicles of 50cc displacement or less
2004-11-30 U.K. broadband scales back wireless roll-out
The U.K. broadband has denied reports that it has abandoned a nationwide roll-out of its wireless broadband service using the 3.4GHz spectrum it mostly won in an auction in June 2003
2012-02-06 TSMC to roll 3D IC assembly service next year
The company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS, the technology standing for chip on wafer on substrate
2010-04-15 TSMC skips 22nm, leaps to 20nm half-node
Taiwan Semiconductor Manufacturing Co. Ltd announced plans to skip the 22nm "full node" after the 28nm node and move directly to the 20nm "half node
2008-01-07 Top 10 stories to keep track this year
ChannelWeb assembled a panel of industry experts comprising vendors, analysts and solution providers to discuss what they think will be the most important chip stories to watch in 2008
2008-03-26 TMSC unveils 40nm 'half-node' step to 32nm
TSMC has unveiled an interim, 'half-node' step toward 32nm, which the foundry giant expects to ramp starting late next year
2005-09-05 Thales set to roll out Rapid IO multi-processor system
Thales Computers is about to roll out its first serial Rapid IO system for embedded computing applications, which will combine both PowerPC and Pentium-M processors.
2002-07-16 TEL to roll out next-gen processing systems for 300mm wafers
Tokyo Electron Ltd is developing a next-generation process coater/developer for use in 300mm wafers.
2013-04-10 Tech giants to develop open source code for SDNs
A consortium of large communications and software giants to provide open source code for software defined networks
2004-02-02 Synopsys, Cadence give nod to SystemVerilog changes
Enhancements based on feedbacks from vendors and users spotlighting some shortcomings in the current ver 3.1, will be implemented in SystemVerilog 3.1a.
2010-06-11 STT-RAM geared to displace DRAM, flash
Grandis Inc. has updated its STT-RAM roadmap with some ambitious efforts in mind: It hopes to replace DRAM, and eventually, NAND, with its next-generation MRAM
2004-12-23 STMicro to define interface standard for portable, disk drives
STMicroelectronics has joined the CE-ATA initiative, a consortium of companies formed in September to define a standard interface for small form-factor disk drives that meets the needs of handheld and consumer electronic products
2001-04-01 Startup set to roll Bluetooth module-on-a-chip
A CMOS device said to pack nearly all the components needed to build a Bluetooth module has been launched by a year-old Silicon Valley startup
2012-12-13 ST ready to roll out 28nm FDSOI
ST boasted that the FDSOI planar process holds advantages over other manufacturing process variants in terms of trade-offs between performance, power consumption and manufacturability.
2014-02-24 Spreadtrum, Mozilla to roll out $25 Firefox smartphone
Spreadtrum integrated its chipsets with reference designs for Mozilla's Firefox OS aims to bring Open Web Devices to the entry-level smartphone market
2007-10-03 Sony to roll out OLED TV in time for Christmas
Sony announced it will debut the XEL-1, claimed to be the world's first OLED TV, on December 1
2016-02-22 SMIC, Leadcore to roll out smartphone SoC in HKMG process
Based on SMIC's 28nm HKMG process platform, the smartphone SoC launched by Leadcore promises better performance, higher speed and lower power consumption, and 1.6GHz CPU performance.
2015-06-17 Smart grid tech in Thailand to benefit consumers, utilities
Accenture found that more opportunities await Thailand when it rolls out smart grids, including distributed energy resources such as solar power and energy storage technologies to cut its electricity costs
2014-10-27 Smart cities? Singapore plans to become a smart nation
The government introduced a slew of initiatives, including the construction of the enabling infrastructure that will facilitate greater connectivityall to improve the quality of life for individuals and create business opportunities for enterprises
2012-03-06 Skilled workforce: Key to U.S. manufacturing success
What the U.S. manufacturing base needs is a revival of flexible, design-driven manufacturing and a new, modular approach to training the next generation of workforce
2014-02-03 Sigfox to expand IoT network infrastructure outside France
Together with Worldsensing, the company has announced the rollout of what it claims to be the world's largest intelligent parking in Moscow, Fastprk
2007-09-11 Siemens, Microsoft to put computers in cars
Microsoft and German engineering giant Siemens are partnering to build computer systems for cars and trucks
2010-03-04 SanDisk, Toshiba aim to reclaim NAND process lead
The team of SanDisk Corp. and Toshiba Corp. is set to roll out a 24nm NAND flash part in 2H 10 to regain the lead from the Intel-Micron duo.
2010-11-12 Samsung's 32nm HKMG process ready to roll
Samsung Electronics Co. Ltd reports on the readiness of the process and designs for its 32nm low-power process with a high-k/metal-gate technology which was qualified in June.
2011-06-09 Samsung's 28nm low-power process ready to roll
Enabling power reduction and performance boost, Samsung's 28nm LP and LPH processes offer designers solutions to address exploding bandwidth, advanced integrated functionality and low-power constraints
2007-04-13 Samsung to roll out LED-backlit LCD panels
Samsung disclosed it would begin producing a 24-inch LCD panel with an LED backlight that enables computer monitors to deliver color quality resembling that of today's high-quality TVs
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