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2001-05-16 U.S.-based Indian engineers head home
Two Indian electronics engineers share experiences at college and work in the United States. Read what they have to say to engineering graduates in India.
2011-06-07 U.S., Russia collaborate on a smart grid program
U.S. and Russia have entered into a partnership program, which aims to deepen its collaboration on energy efficiency, smart grid technology, and clean energy.
2006-07-20 U.S. seeks to change rules on China exports
The U.S. Department of Commerce is seeking to change the rules regarding high-tech exports to China, some of which are intended to make it easier to sell semiconductor equipment into its growing IC market.
2007-09-28 U.S. court orders TSMC to pay UniRAM $30.5M
The U.S. District Court for the Northern District of California has awarded UniRAM Technology $30.5 million in a decision asserting that TSMC had misused UniRAM's trade secrets.
2006-05-26 Tzero, Tektronix establish UWB testing gold standard
Tzero Technologies announced that it is working with Tektronix to establish a gold standard for ultrawideband testing.
2008-04-03 Two ICs inside HP scientific calculator
While not the sexiest consumer product out there, our engineering audience will likely see the appeal that Hewlett-Packard's latest scientific calculator.
2008-06-09 Two FPGA vendors disclose mass layoffs
Two FPGA vendors such as Xilinx Inc. and QuickLogic Corp. separately reported layoffs. Xilinx said approximately 250 positions will be vacated, or about 7 percent of the company's workforce. Meanwhile, QuickLogic reduced its headcount by 17 percent.
2006-11-01 Turning science-fiction idea into fact
David Schurig sat down with EE Times to describe how the cloaking device works and what electronic engineers can do to turn the science fiction idea into fact.
2011-02-22 TSMC, Taiwan university create multi-angle 3D chip
The 3D TV chip allows TV viewers to see an object in stereo from various angles. It also comes with traditional HDTV and 3DTV functions.
2007-04-25 TSMC's IP moves stir up concern among providers
TSMC's move to broaden its portfolios of internally developed semiconductor IP and third-party IP has some observers asking whether the company is migrating to a more ASIC-like business model.
2003-04-30 TSMC takes wraps off 65nm plans
In the face of stiff competition and a few lost customers, Taiwan Semiconductor Mfg Co. Ltd has become more aggressive in making its case as a technology leader.
2014-10-07 TSMC takes lead over Samsung in FinFET race
TSMC's 16nm pilot line is gaining incremental confidence among prospective customers, leaving behind Samsung, whose foundry has experienced a setback with its 14nm FinFET project.
2014-04-25 TSMC fleshes out IC line-up with shrunk TSVs
Based on its work on chip stacks, TSMC will launch in July an enhanced version of the 16nm FinFET technology with up to 18 per cent faster data rates and lower leakage, in addition to a planned 10mm and 7mm processes.
2011-03-04 TSMC details 450mm fab plans
TSMC will install a 450mm pilot line in Fab 12 in Hsinchu then bring the line up in Taichung to process devices at the 14nm node. It aims to produce 14nm FinFETs at its Taichung fab by 2015 or 2016.
2011-04-08 TSMC chief tackles 7 points in keynote
Morris Chang discusses key points concerning TSMC and the industry, among them, the Japan quake's impact on the IC business, industry growth drivers, and TSMC's 28nm, 3D chip and 450mm efforts.
2012-10-05 Troubleshoot, verify 8b/10b encoded signals with real-time scope
Test equipment with features designed for serial bus test can dramatically improve productivity and lead to more reliable, higher performing designs.
2006-06-19 TriQuint unveils multiport GaAs switches
TriQuint's new multiport switches are targeted at high-reliability applications such as electronic warfare signal receivers and wideband communications systems.
2008-12-19 Trio develops 'world's smallest' FinFET SRAM cell
Toshiba, IBM and AMD have jointly developed an SRAM cell that has an area of only 0.128?m?, the world's smallest functional SRAM cell that makes use of fin-shaped Field Effect Transistors (FinFETs).
2005-01-06 Transmeta to focus on IP, evaluates processor business
In what portends a possible move to exit from its x86-based microprocessor products business, troubled Transmeta Corp. on Tuesday (Jan. 4) announced that it will increase its focus on the licensing of its intellectual property (IP) and advanced technologies in 2005.
2015-12-01 TowerJazz inks deal to buy Maxim's wafer fab
The agreement is expected to boost TowerJazz's global wafer manufacturing capacity, cost-effectively increasing production by nearly 28,000 wafers per month.
2008-08-15 Toshiba-Wave Systems tandem eyes mobile PC encryption
Toshiba Storage Device Division (SDD) and Wave Systems Corp. will be working together to develop a robust standards-based solution for the secure encryption of data on mobile computing platforms, such as laptop PCs.
2004-04-01 Toshiba unveils serial link cell agreement with Rambus
Toshiba Corp. has signed an agreement with Rambus Inc. to incorporate the RaSer serial link cell technology from Rambus into the Toshiba 90nm process technology library.
2003-04-02 Toshiba SFP optical transceivers eye multi-range apps
Toshiba Corp. has launched a series of 2.5Gbps SFP optical transceivers that are intended for use in short-, intermediate-, and long range optical networks.
2012-05-16 Toshiba invests in LED tech developer
Bridgelux has revealed that that Japan's Toshiba has made an equity investment in the firm.
2003-11-25 Toshiba designer takes path of upward mobility
Delving into 'new transistor technology' is all in a day's work for Toshiba's Shinichi Takagi.
2016-01-04 Top 15 deals that influenced analogue, sensors in 2015
Here are some of the biggest and most important business deals and synergies in 2015 that had a huge impact on analogue, MEMS, sensors and the semiconductor industry as a whole.
2009-01-06 Top 15 challenges to conquer for 22nm
What are the big challenges involved at the 22nm node?
2009-07-09 Top 10 industry issues
Here are the top 10 looming issues that the semiconductor capital equipment industry is facing.
2005-03-11 Tool offers interconnectivity
Accelerated Tech announced an application-level tool that enables high-speed communications between two or more processors running on the same chip, computer or over a network.
2007-06-08 Time apt for cars' electronic makeover, says GM exec
Time is ripe to reinvent the automobile. So says the man who heads the R&D efforts over at General Motors.
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