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2002-03-27 Self-assembly technique yields flexible ceramic
An atomic self-assembly technique devised at Cornell University uses carbon polymers to create a new type of hybrid material that has the flexibility of polymers and the strength of ceramics.
2003-08-08 Nanolitho effort harnesses self-assembly
Nanoscale patterning of silicon substrates could enable manufacturable nanoscale chips within the decade.
2011-03-04 JSR, IBM launch self-assembly litho structure
Targeted at the sub-20nm half-pitch node, the new DSA technology enables phase separation, resulting in good profiles and more flexible use in both logic and memory applications.
2012-02-14 Imec rolls 300mm directed self-assembly process line
The fab-compatible patterning solution can pave the way for scaling EUV lithography to production level, pushing the boundaries of 193nm tech.
2011-03-07 Directed self-assembly gains steam
Despite its inherent defects, DSA could have applications in areas such as flash memory production where the regular structure of circuits and cost sensitivity of the market may make it attractive.
2005-05-16 Self-assembling organic semiconductors reported
Israeli researchers have taken a page from nature's book to create self-assembling organic semiconductors.
2012-11-16 Disc storage capacity boosted self-assembling polymers
Researchers at the University of Texas-Austin claim to have developed a method of directed self-assembly that could boost hard drive capacity fivefold.
2013-05-28 Annular electrodes as PCM solution (Part 2)
Learn about the possible advantages and limitations offered by nanotechnology and self-assembly techniques.
2008-08-28 Virus enables nanoscale battery development
Massachusetts Institute of Technology researchers claimed to have fabricated micron-scale batteries by combining microcontact printing and virus-based self-assembly.
2004-01-12 Protein recognition tapped to build nanotube FETs
Molecular self-assembly assisted by DNA and protein recognition might provide a route to complex logic and memory circuits built with nanotubes, a project in Haifa, Israel, suggests.
2005-12-08 Japanese researchers unveil 3-D stack for chip integration
Japanese researchers have come up with a new three-dimensional integration technology called Super-Smart-Stack that uses a self-assembly technique to maintain chip alignment accuracy to within 1?m.
2015-02-20 Imec improves defectivity to near single-digit values
imec and partners, Merck & Co Inc. and Tokyo Electron, have improved directed self-assembly defectivity, approaching single-digit values. Results will be reported at the SPIE Advanced Lithography conference next week.
2014-03-04 DSA technique pushes chip fabrication below 20nm
The MIT researchers' directed self-assembly technique utilises block copolymer self-assembly that facilitates the reduction of pattern sizes in photolithography and electron-beam photolithography.
2008-06-06 Will 3D through-silicon vias break into mainstream?
The 3D technology based on through-silicon vias technology took center stage at the IEEE 2008 International Interconnect Technology Conference but there is still no consensus just how the industry will bring the long-awaited technology into the mainstream.
2014-12-18 What's hot at IEDM 2014?
The 2014 International Electron Devices Meeting proved that Moore's Law is still alive. The event was a victory lap for Intel, which gave more details on the 14nm finFET process.
2016-03-21 TSMC unveils silicon plans
TSMC will enable silicon interposers larger than 1,200mm2!1.5x the reticle size!at 7nm to enable giant 2.5-D stacks of logic and memory for the next gen of Cowos- chip on wafer on substrate.
2015-07-08 Trends, challenges for EUV lithography
Imec said cutting costs per transistor at the next-generation, the 10nm node, will be tricky, and even more challenging will be getting extreme ultraviolet lithography ready to enable a full 7nm node.
2012-02-17 TEL joins DSA, maskless litho projects
Japan's Tokyo Electron Ltd (TEL) is working with on two collaborative lithography research projects spearheaded by the CEA-Leti research institute.
2008-09-30 Tech groups explore co-polymer lithography
Several entities including IBM Corp. and Intel Corp. are looking into a new technology called co-polymer lithography in an effort to extend Moore's Law.
2005-04-12 SUSS' new tool replaces traditional optical lithography
SUSS MicroTec announced last week a next-generation lithography tool that will replace traditional optical lithography for the production of nano-scale devices.
2008-04-04 Superconductors enable magnetic flux pinning for spacecraft
Cornell University researchers propose that superconductors paired with permanent magnets could enable spacecraft to hover unpowered above the ground in the same way Luke Skywalker's space racer hovered in the seminal Star Wars movie.
2007-07-19 Startup brews 'perfect storm' for R&D
Intermolecular has unveiled a new platform of "fab in a lab" technologies, which it claims will facilitate R&D of IC materials, processes and device structures.
2010-03-02 SPIE Litho wraps with delays, double-patterning
The themes of this year's SPIE Advanced Lithography event were clear: D and D!delays and double-patterning. Indeed, EUV is delayed. So is maskless. And nanoimprint is still stuck in R&D.
2015-03-25 Semicon manufacturing welcomes EUV lithography progress
The recent SPIE Advanced Lithography conference showcased a number of headway in extreme ultraviolet lithography that could possibly redefine how the process is being conducted.
2010-06-01 Self-assembling protein to enable faster computing
A protein found in every cell of the human body, could become a self-assembler of future information processing systems that are smaller, faster and cheaper than today's computer circuitry.
2014-03-20 Samsung announces prod'n of 20nm-based 4Gb DDR3 memory
A key element of the latest design and manufacturing technology by Samsung is a modified double patterning and atomic layer deposition that allows for continued scaling.
2009-04-07 Researchers tap viruses for 'green' batteries
Massachusetts Institute of Technology (MIT) researchers claim that genetically-engineered viruses can be used to assemble tiny batteries that can then be printed on plastic films.
2002-06-06 Researchers demo self-assembling nanowires
Researchers at Aarhus University here have demonstrated a nanometer-scale fabrication technique that self-assembles tiny wires atop substrates, with an eye toward interconnecting molecular electronic circuits in the future.
2010-04-20 Researchers demo light twisting nanoparticle ribbons
University of Michigan engineers and their collaborators have demonstrated that light can twist ribbons of nanoparticles.
2010-04-07 Quest for the right road to lithography
The industry has long known that without a viable NGL solution!which most assumed would be EUV!Moore's Law scaling would slow and the secular growth rate of the IC industry would decline.
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