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2005-03-29 TSMC to open design center in Shanghai, says report
Taiwan Semiconductor Mfg Co. Ltd the world's largest foundry chip supplier, is planning to open a design-service center at its mainland Chinese factory in Shanghai, according to a Taiwan Economic News report, citing un-named executives at the wafer fab as sources.
2002-04-16 TSMC to offer SoC design-to-manufacturing services
Taiwan Semiconductor Manufacturing Co. Ltd is moving to better coordinate the design and manufacturing flow for SoC customers with the introduction of a development architecture called Nexsys.
2008-06-12 TSMC targets to unify 32nm design flow
Facing the 32nm challenge, Taiwan Semiconductor Manufacturing Co. Ltd is putting the pedal to the metal with a new design-for-manufacturing scheme.
2007-11-27 TSMC taps Synopsys' design-to-mask data processing software
TSMC has successfully implemented Synopsys' new PCX technology to reduce design-to-mask cycle-time for its advanced process technologies
2005-06-13 TSMC releases reference design flow for 65nm processes
Taiwan Semiconductor Mfg Co. Ltd has released version 6.0 of its reference flow, the sequence of EDA tools that the world's largest foundry recommends for its 65nm manufacturing processes
2007-07-16 TSMC pulls curtains off 45nm design process
Taiwan Semiconductor Manufacturing Co. Ltd unveiled its latest and most ambitious design methodology for IC production at the challenging 45nm node.
2006-08-11 TSMC increases investments in local design house, sensor foundry
Taiwan Semiconductor Manufacturing Co. Ltd has separately increased its investments in two Taiwanese companiesGlobal Unichip Corp. and VisEra Technologies Co. Ltd
2008-04-30 TSMC IC design collaboration strategy stirs controversy
TSMC has unveiled a new and possibly controversial strategy that involves more collaboration in the early stages of the IC design process
2007-06-07 TSMC channels 'Flow' to deal with 45nm design challenges
Foundry titan Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) claims that its latest design methodology increases yields, lowers risks and improves design margins. Reference Flow 8.0 supports the company's 45nm process technology with advanced standard cell, standard I/O, and SRAM compiler.
2005-10-06 TSMC approves X Architecture design
Taiwan Semiconductor Manufacturing Company (TSMC) disclosed on Oct. 4 that they are ready to accept 90nm X Architecture designs
2002-05-30 TSMC adopts Cadence's signal analysis for reference design flow
Taiwan Semiconductor Mfg Co. has adopted Cadence Design System Inc.'s CeltIC signal-integrity analysis solution for its 0.135m reference design flow.
2003-07-11 Triquint, Agilent design kit to speed IC design
TriQuint Semiconductor and Agilent Technologies Inc. have introduced a next-gen design kit, which accelerates IC design and simulation.
2004-06-15 Transition to 90nm raising tough design issues
Experts delving into 90nm design and process development explored a crucial question: How will the average design team handle 90nm design
2012-05-23 Transformations of board design landscape beyond 10G
As systems demand interfaces capable of handling four-channel and 10-channel paths to 40/100G Ethernet, universal adoption of 10GBase-KR seems plausible.
2002-11-07 Tower Semiconductor supports OCP Partnership
Tower Semiconductor Ltd has taken part of the Open Core Protocol International Partnership
2005-01-27 Tower Semiconductor strengthens design center program
Tower Semiconductor Ltd announced a major expansion of the Tower Authorized Design Center (TADC) program, naming Cadence Design Systems Inc., QThink, QualCore Logic and SliceX as design center partners.
2003-12-10 Tower Semiconductor standardizes on TriCN interface IP
IC wafer-manufacturing foundry Tower Semiconductor has selected TriCN's base I/O library and a suite of interface IP for use in their 0.18&3181;m process. Tower will make this IP available to customers designing high-performance chips for production at its Fab 2 facility
2002-08-22 Tower Semiconductor adopts PDF Solution technology
PDF Solutions Inc. has partnered with Tower Semiconductor Ltd on a program to enhance the yield and performance of 0.185m CMOS process technology at Tower's Fab 2
2002-12-19 Tower Semi adopts Artisan design platforms
Chipmaker Tower Semiconductor Ltd has enhanced its Fab 2 IP portfolio by licensing design platforms from Artisan Components Inc.
2003-06-27 Tower PDKs simplify design environments
Tower Semiconductor Ltd. and Cadence Design Systems have announced the availability of the TSL018 and TSL035 foundry-level Process Design Kits that eliminate the need for users to create their own "views" of the Tower technologies in their design environments.
2008-01-31 Toshiba, Cadence collaborate on 65nm design
Cadence Design announced that Toshiba has deployed Cadence Virtuoso simulation technology to provide its analog and mixed-signal chip designers an easy-to-use and accurate reliability analysis flow
2004-12-17 Toshiba uses Forte synthesis for next-gen design flow
Toshiba Corp. has chosen Forte Design Systems' Cynthesizer SystemC behavioral synthesis product for use in their SystemC design flow
2004-06-22 Toshiba to transfer part of semiconductor business
Mitsubishi Electric Corp. and Toshiba Corp. have agreed in principle to transfer a majority of Toshiba's high capacity power module business, which accounts for a small portion of its power transistor business, over to Mitsubishi Electric.
2008-09-30 Toshiba taps Agilent for RFIC design, evaluation
Toshiba has selected Agilent's GoldenGate EDA software for its RFIC design and evaluation
2002-06-18 Toshiba Semiconductor, TAEC to implement TiVo DVR technology
TiVo has identified Toshiba Semiconductor Co. and Toshiba America Electronic Components Inc. as its latest technology licensees of TiVo's digital video recorder technology
2002-11-28 Toshiba opens second design center for 2002
Toshiba America Electronic Components Inc. has opened its seventh U.S.-based design center located in San Diego, California, which also is the second design center to be launched by the company this year
2005-01-26 Toshiba obtains power-efficient design using Synopsys Galaxy
Toshiba Corp. has achieved a 40 percent power reduction on its latest 90nm media embedded processor (MeP) system-on-chip (SoC) design using the Synopsys Inc
2006-08-30 Toshiba adopts Cadence solution for 65nm design
Cadence Design Systems announced that Toshiba has adopted Cadence QRC Extraction for its most advanced 65nm design flows
2005-06-29 Toppan to expand semiconductor plant in Ichon
Toppan Photomasks Inc. plans to expand its Ichon, South Korea, facility.
2007-06-20 Tool provides complete design for bright LEDs
Cypress Semiconductor Corp. introduces a complete design solution for high-brightness (HB) LED intelligent lighting systems that offers high ease-of-use and performance.
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