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2005-07-12 Vitesse solution enables deployment of IEEE-compliant GE-PONs
Vitesse Semiconductor unveiled its VSC7716 burst mode transimpedance amplifier and VSC7966 laser driver and limiting amplifier designed for Gigabit Ethernet passive optical networks.
2014-12-26 UV curable system touts up to 7,000psi tensile strength
The Master Bond UV15X-2 combines a high performance physical profile with very low shrinkage upon curing, and targets fibre optic, optical, electronic, microelectronic and laser applications
2013-05-06 Transparent thin film metrology system for 28nm node
The latest member of the S3000 family uses focused beam ellipsometry and newly-designed small site measurement optics to measure the thickness of single layer and multi-layer films on product wafers.
2005-07-18 Technology shrinks will continue, panelists say
Despite daunting economic and technical challenges, the semiconductor industry will continue to aggressively shrink the line widths of leading-edge devices for the foreseeable future, according the majority of semiconductor equipment executives who took part in a panel discussion at the Semicon West tradeshow here
2010-10-08 TearDown: Inside a 3D desktop scanner
The desktop NextEngine 3D Scanner competes with more expensive scanners by creating mesh files of 3D objects for industrial design, reverse engineering, CGI and content creation. Here's a look inside.
2002-10-24 TDI to sample breakthrough p-type GaN substrates
Technologies and Devices Int. Inc. has announced a breakthrough in GaN compound semiconductor material growth technology, by demonstrating 2-inch diameter GaN templates with p-type electrical conductivity
2005-07-14 Sweden's photomask tool supplier extends reach in Asia
Micronic Laser Systems AB, a supplier of laser pattern generators for photomasks, has opened its Asia Technical and Applications Center in Tokyo, Japan
2006-03-20 Sunext, Philips ink optical drive licensing agreement
Sunext Technology and Royal Philips Electronics announced that both have completed an agreement relating to the transfer of Philips' optical disc drive semicon technology and licensing of related patents.
2002-12-26 Startup taps digital holography for wafer inspection
A metrology startup is pitching the use of digital holography to peer into the narrow and deep spaces, such as contacts and trench capacitors, on semiconductor wafers
2011-02-16 ST, bTendo partner on smartphone pico projector
STMicroelectronics and bTendo Ltd have inked a development and license agreement for what is billed as the "the world's smallest pico projector" for smartphones and other portable consumer-electronics devices.
2003-10-30 Spire method obtains U.S. patent
Spire Corp. announced that they have secured a U.S. Patent on a method for implanting aluminum oxide in GaAs and other III-V semiconductor wafers
2002-05-06 Shandong Huaguang wins certification for R&D project
Shandong Huaguang Optoelectronics Corp. Ltd has received a certification from the Shandong government for its "Semiconductor LED Epitaxy Process and Die Technology" project
2008-04-24 Seoul Semi, Everlight settle patent suit with Columbia U prof
Seoul Semiconductor and Everlight Electronics have signed settlement agreements in a patent case brought before the U.S. ITC by Gertrude Neumark Rothschild, a professor emerita at Columbia University
2002-10-03 SEMI's Oasis provides respite from GDSII
SEMI has rolled out the Open Artwork System Interchange Standard as a replacement for the GDSII file format, and said it promises a tenfold reduction in design data compared to GDSII.
2005-06-20 Scintera offers an alternative to DCF, amplification equipment
Scintera announced an alternative to dispersion compensation fiber and amplification equipment for service providers.
2003-03-20 Richardson to distribute Celeritek RF line globally
Celeritek Inc. has named Richardson Electronics Ltd as the sole worldwide distributor for its complete line of RF semiconductor products
2005-02-25 Retimer chips achieve new levels of integration for CX4, LX4 apps
Mysticom introduced a pair of new retimer chips for Xenpak, X2 and XFP modules that incorporates its third generation 10GbE transceiver technology.
2013-10-09 Researchers unravel new source of extreme UV light
Scientists blasted a 30?m droplet of tin with a high-powered laser 6,000 times a second and found that 30 per cent of the EUV emission came from behind the part of the droplet that was struck by the laser
2003-09-11 Researchers reflect on maskless lithos
An invitation-only workshop has kicked off last September 8, to explore a form of maskless lithography based on arrays of micromirrors.
2012-10-03 Researchers from Cornell advance lithography with LSA tech
Laser-spike annealing has the potential to shorten processing time while also improving image quality of semiconductor lithography.
2003-06-25 Researchers demostrate Schottky barrier, aim for ferroelectric
Researchers are creating a Schottky barrier model in the hopes of finding that missing link for smaller, faster computers.
2005-03-15 PON driver touts integration
Vitesse's VSC7965 pairs a limiting amp with a driver and is designed to be integrated into low-cost transmit optical subassemblies for residential PONs.
2005-01-21 Photonic adds Panasonic aspherical glass lenses to portfolio
Photonic announced that it has added Panasonic's range of aspherical glass lenses to its portfolio of optoelectronic components.
2013-01-31 Philips returns to lighting roots, drop CE business
Philips has exited the consumer electronics market choosing to focus instead on segments such as LED lighting and control systems.
2004-06-22 Panel urges U.S. strategy to counter China's tech rise
A panel tracking Chinese technology developments and its implications for U.S. national security said the government needs a coordinated national strategy to meet China's challenge to U.S. scientific and technology leadership.
2003-04-09 Osram expands opto manufacturing in Germany
Osram Opto Semiconductors Sdn. Bhd has begun operations at its new optoelectronics chip factory in Regensburg, Germany.
2002-07-09 ON Semi delivers 10Gbps variable swing SiGe driver/receiver
ON Semiconductor has introduced the NBSG16VS 2.5V/3.3V SiGe differential driver/receiver with a variable output swing that can be programmed to provide output amplitudes ranging between 100mVpp to 700mVpp
2006-12-19 Nintendo Wii woos casual gamers
Nintendo has built the Wii to be a more intuitive videogame console designed to attract new and casual gamers.
2006-03-16 New controller-monitor reduces component count, layout area
Dallas Semiconductor introduces the DS1862, touted the industry's first integrated XFP controller-monitor that greatly simplifies the design of 10G XFP optical transceiver modules
2002-05-07 NEPCON Korea exhibitors roll out new products
The electronic industry in South Korea received a much needed boost with the celebration of Electronic Week 2002 from April 24 to April 26, 2002.
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