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2002-03-27 Sapphire-based chip trades copper wires for light
A team at Johns Hopkins University in the U.S. has developed a prototype chip which uses light instead of wires as an interface.
2004-05-07 SANYO extends reach with PartnerAlliances partnership
PartnerAlliances has formed a technology licensing partnership with SANYO Electric Co. Ltd's U.S.-based R&D division in a bid to help the company in integrating their expertise and technologies with other U.S. advanced technology companies.
2002-05-08 Sanmina-SCI yields HDI PCBs at Costa Mesa plant
EMS provider Sanmina-SCI Corp. is producing high density interconnect (HDI) multilayer PCBs at its HDI manufacturing and research center in Costa Mesa, California.
2003-02-26 Sanmina-SCI Costa Mesa plant receives certification
Sanmina-SCI Corp. has revealed that its PCB facility in Costa Mesa, California, has completed certification assessment by the Defense Supply Center, Columbus.
2007-04-25 Samsung develops 'first' all-DRAM stacked package using TSV tech
Samsung claims to develop the 'first' all-DRAM stacked memory package using 'through silicon via' technology, which will result in memory packages that are faster, smaller and consume less power.
2009-01-20 Sampling soon: transceivers designed in CMOS
Phyworks has taped out and will soon start sampling a generation of transceivers designed in CMOS instead of the traditionally employed SiGe process technology for optical transceivers.
2012-04-03 Sales of opto, sensor, discrete devices top ICs
Optoelectronics, sensors/actuators and discrete components sales increased 8.4 percent last year, surpassing the 0.4 percent growth in IC sales.
2014-06-23 Robots actuate industrial automation
Technology and artificial intelligence have entrenched on the industrial territory, where automation is no longer an option but a need, recording 179,000 robots sold worldwide in 2013.
2006-11-16 Rival disk-drive tech to race against flash
The disk-drive industry stands at a difficult double crossroads, a place where both its enabling technology and its market drivers are shifting.
2013-07-23 Researchers develop low-cost sol'n polymer LEDs, PV cells
A team of researchers from Ulsan National Institute of Science and Technology created a plasmonic material that claims to improve performance of polymer-based optoelectronic devices.
2013-06-06 Research: Precise tuning of quantum dot emissions
MIT researchers found a way to make quantum dots even more efficient at delivering precisely tuned colours of light that could be used to improve colour displays and biomedical monitoring systems.
2011-12-21 Research reveals silent nanomechanical RF amp
Researchers from Aalto University have achieved a noiseless oscillator performance by cooling it down to -273C.
2010-10-27 Rare earth issues trouble industry
The potential problem of China's monopoly on rare earthsminerals, metals and their oxides C has become reality with the country's move to reduce export quotas for 2H 10.
2006-11-28 Processor enables affordable GbE in the home
Freescale's new PowerQUICC II Pro processor addresses the market demand for inexpensive processors that can securely distribute and process multiple streams of multimedia content throughout the home.
2012-10-15 Plasmonics show promise for optically induced electronics
Rice University researchers are doping graphene with light in a way that could lead to the more efficient design and manufacture of electronics, as well as novel security and cryptography devices.
2014-07-21 Plasmon sensors to put bomb-sniffing canines out of work
The device uses reflectors to bounce the surface plasmons back and forth inside the sensordramatically increasing the sensitivity of the sensor to detect incredibly minute concentrations of explosives.
2007-03-15 Photomask CD measurement system suits 45nm node
Vistec's new SEM-based CD measurement system is designed for the 45nm technology node photomask production and the 32nm process development.
2008-07-07 Panasonic comes up with GaN ICs for millimeter-wave comms
Panasonic has developed Gallium Nitride (GaN) ICs for the receiver in future millimeter-wave communication systems.
2015-06-29 OSATS: Wafer-level packaging limitations hard to dismiss
The recent SEMI Packaging Tech Seminar focused on the need, in terms of under yield and packaging cost pressures, to move from fan-out wafer-level-packaging to fan-out panel-level-packaging.
2007-05-16 Optical transceiver moves data at speed of light
IBM scientists have announced a prototype optical-transceiver chipset that transfers data at a rate eight times faster than currently available components.
2008-04-01 Optical communications migrate to SFP+
Interface chip vendors in growing numbers are tailoring chips to support the migration of datacom and telecom routers and switches to SFP+, the latest pluggable optical module form factor for use in 10Gbit/s Ethernet and 8.5Gbit/s Fibre Channel systems.
2007-01-01 Nintendo woos casual gamers with intuitive Wii
A teardown of Wii shows a comparatively simple design with far fewer major components than its competittion's.
2003-08-07 Nikon latest Nexiv release has better magnification
Nikon Instruments has introduced the VMR-H3030, the latest model in its NEXIV line that provides high resolution and expanded work range.
2011-08-16 New research to enable microwave-based computers
A new microwave technique for performing quantum entanglement was demonstrated by NIST, opening the possibility of microwave-based computers.
2015-03-17 New material tops silicon, graphene in electron mobility
Scientists recently discovered a new material believed to possess electron mobility that is 200 times greater than that of graphene and more than 1,700 times that of crystalline silicon.
2002-11-11 New format of Electronica 2002 reflects technological trends
Organizers of Electronica 2002, the 20th International Trade Fair for Components and Assemblies in Electronics, say more than 2,800 exhibitors have signed up and that 85,000 visitors are expected from Germany and abroad.
2008-05-01 Much deserved accolade for ADI co-founder
According to Raymond Stata of Analog Devices Inc., "Engineers must be able to think about products more deeply, and better understand both the marketplace and their customers."
2000-08-01 Moving to 12-bit embedded control
At the Embedded Systems Conference in 1998, Tremont Mao of Analog Devices was demonstrating his own version of the Rube Goldberg machine.
2013-07-08 MIT researchers develop all-optical transistor
The researchers describe an optical switch controlled by a single photon that allows light to govern the transmission of light intended for new designs for both classical and quantum computers.
2012-04-05 Micro-loop mirror design ups silicon chip performance
Integrated Si/III-V lasers can take advantage of low-loss silicon waveguides, while addressing the problem of low light emission efficiency that silicon devices typically have.
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