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2006-07-06 X-ray analyzer eases advanced chip packaging
Xradia said the MicroXCT is suited for the engineering and failure analysis of next-generation semiconductor packages, including multistacked die and flip-chip architectures
2004-07-14 Two firms apply carbon nanotubes to chip packaging
Carbon Nanotechnologies Inc. (CNI) has agreed with Kostat Inc. to develop and commercialize conductive polymers for module trays, carrier tapes and other semiconductor packaging and chip and die delivery applications.
2010-02-23 Tessera, Nanium ink packaging license deal
Tessera Inc. has signed a technology licensing agreement with Nanium, S.A, formerly known as Qimonda Portugal.
2005-09-21 Spansion, Atheros packaging solution reduces size of mobile phones
Spansion LLC and Atheros Communications Inc. have developed an innovative packaging solution that is designed to reduce the size of dual-mode cellular/wireless LAN (WLAN) mobile phones
2004-08-05 Sharp and Tessera expand packaging agreement
Seeking to broaden its exposure to the consumer electronics market, Tessera Technologies Inc. has expanded an existing agreement to license semiconductor packaging technology to Sharp Corp.
2002-12-24 Semiconductor packaging market to experience growth in '03
The worldwide semiconductor packaging and assembly segment is poised for growth in 2003, according to Dataquest Inc., a unit of Gartner Inc.
2004-03-16 SEMI: Semiconductor packaging materials market to reach $11.7B
The market for semiconductor packaging materials is expected to grow from $7.9 billion in 2003 to $11.7 billion by 2008, according to SEMI and TechSearch International's latest report entitled
2006-01-25 Semi packaging materials to hit $20B in 2010
The market for semiconductor packaging materials is expected to grow from $12B in 2005 to $19.5B by 2010, according to SEMI and TechSearch International.
2005-10-21 Packaging conference to explore 3D, SIP
Building on the first International Wafer-Level Packaging Congress (IWLPC) event, the second IWLPC conference will explore three-dimensional (3D) chip-packaging and other technologies
2002-11-22 Oki brings environment-friendly packaging to its facilities
Oki Electric Ind. Co. Ltd has successfully developed a lead-free solder plating technology for semiconductor package terminals
2013-08-14 NTU, STATS ChipPAC work on advanced wafer level packaging
Singapore's NTU has entered a joint research programme with STATS ChipPAC to advance solutions for next generation semiconductor packaging technologies.
2007-11-08 IBM-led alliance ups investment in 32nm packaging
The Common Platform alliance led by IBM plans to increase its investment in semiconductor packaging technology to pave the way to 32nm devices.
2006-02-01 Green semiconductor packaging: Addressing the environmental concerns of the 21st century
No development can proceed without closely examining the environmental impact of using a product and its compliance with global environmental regulations.
2010-09-24 Fujitsu renews packaging licensing deal with Tessera
Fujitsu renews licensing agreement for Tessera semiconductor packaging solutions
2011-06-17 FCI, Fujikura team up for IC packaging tech
FlipChip International and Fujikura Ltd are collaborating in innovating advanced semiconductor packaging technology.
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles
2003-04-28 Epson licenses Tessera packaging technology
Seiko Epson Corp. has entered a technology license agreement with Tessera Inc. to utilize the latter's semiconductor packaging technology in ASICs and specialty memory products.
2015-07-15 E-band cost, reliability concerns in MMIC packaging
Traditional semiconductor packaging approaches either cost too much or suffer from signal integrity issues. However, new techniques are becoming available that can address these problems.
2013-07-10 Dow Corning boards Imec's 3D IC packaging initiative
Dow Corning has teamed up with Imec to advance enabling technologies for 3D IC semiconductor packaging.
2014-02-13 Ball grid array replaces standard IC packaging
One of the disadvantages of flip-chip BGA packaging is the dissipation of power and data rates on the enclosed product
2007-09-10 ASE, Mitsui collaborate on HMT packaging tech
ASE and Mitsui have entered into a cross-licensing agreement and technical collaboration for Mitsui's Hybrid Manufacturing Technologies (HMT) packaging technology
2005-05-03 ASE, FCI ink wafer level packaging deal
Advanced Semiconductor Engineering Inc. (ASE) and FlipChip International LLC (FCI) have signed an expanded technology licensing agreement
2007-07-19 Amkor, IMEC sign 3D wafer-level packaging pact
Amkor has agreed to develop 3D integration technology with IMEC based on its wafer-level processing techniques.
2012-05-24 Amkor puts up $350M packaging facility
Amkor Technology is set to build a test and packaging facility in South Korea’s Incheon Free Economic Zone that will focus on design, development and production of semiconductor packaging and test services.
2008-11-21 Wafer-level packaging achieves prominence
Wafer-level packaging, the fabrication of the IC package directly on the wafer, is finally getting exposure after many years of promises, according to an expert in the field
2011-11-22 Wafer packaging fab opens in Taiwan
STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility.
2007-01-22 UTAC: China testing, packaging industry yet to mature
Singapore's United Test and Assembly Center said that mainland China's IC testing and packaging industry still lacks market potential despite having Taiwan-based companies transfer their business to the region
2006-12-08 UTAC expands Thailand packaging operations
United Test and Assembly Center Ltd will pump more than $100 million into its Thailand operations over the next three years as it shifts more low-end packaging activities to the country
2003-07-07 TSMC, Amkor partner on flip-chip packaging
Amkor Technology has developed and qualified wirebond and flip-chip packaging for devices manufactured on TSMC's advanced low-k process technologies
2011-04-11 TSMC enters chip-packaging arena
TSMC will soon open a bumping facility and offer silicon interposers and TSV technologies for 3D chips, but will remain focused on the foundry market and will not compete against subcontractors.
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