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2016-01-18 Qualcomm enters $280M joint venture with Chinese province
The joint venture will focus on the design, development and sale of advanced server chipset technology in China, which is the second largest country in the world for server technology sales.
2006-10-16 Qimonda hands 80nm DRAM tech to Winbond
Qimonda and Winbond Electronics have extended their DRAM manufacturing partnership. The new agreement calls for Qimondato transfer its 80nm DRAM trench technology to Winbond's 300mm facility in Taichung, Taiwan.
2003-09-01 Provide a competitive edge
A structured ASIC platform allows manufacturers to offer their customers a shorter, faster track to a final production-ready product while limiting their risk by minimizing up-front costs.
2008-12-16 Practical aspects of touchscreen systems
The need for innovative user interface solutions becomes more essential to device design. Projected-capacitance touchscreens can help designers face this challenge.
2002-04-02 Post acquisition spree, Intel strives for key to comms
Intel Corp. hasn't made heads or tails of the communications industry. As the company bought up startups, it was simply collecting one of everything, with no central strategy for interlocking the pieces.
2011-01-26 PL forecast: communications, 28nm to drive growth
The latest generations of FPGAs have proved to be a cost-effective replacement for ASICs, DSPs and ASSPs. Communications will be a formidable growth area while 28nm will spell revenue opportunities this year.
2004-06-01 Picking the best solution for glue logic
Make a better product by choosing higher integration logic solutions in a single reprogrammable chip that help you make a better product.
2007-10-18 Physical sensors drive MEMS consumerization wave (Part 1)
Benedetto Vigna notes that we are living today in the commercial era of MEMS Consumerization where microphones, motion and pressure sensors are the main actors. He believes this trend will continue for the next five years.
2002-11-01 Photonic integration takes a new shift
Changes in achieving silicon optical bench integration raised the issue whether the integration of electronic and photonic components is still necessary.
2003-01-06 Philips develops EL material that generates red, green light
Researchers at Philips, collaborating with the University of Amsterdam, have developed the first electroluminescent (EL) material that can generate either red or green light.
2011-04-11 PCM progress report no. 2: Review of PCM-related activities in early 2011
In this report, the author explores the PCM-related activities over the first quarter of 2011.
2008-05-01 Partition and package to miniaturize handsets
Designers are turning to system-in-package, 3D IC stacking and wafer-level packaging to enable the acute miniaturization found in handsets, particularly for RF functions.
2012-02-21 P-cap tech opens new possibilities for ITO touch sensing
Zytronic has been able to develop a sensor series that combines the benefits of enhanced optics and volume manufacturing from ITO processing with a p-cap technology.
2003-01-03 Organic displays near critical mass
Organic polymers are expected to play a larger role soon in enabling flexible color displays for computers, comms devices and consumer electronics.
2008-05-29 OmniVision tips backside illumination for CMOS imager
OmniVision touts it has found the answer to shrinking pixel size in CMOS image sensors without degrading performance and image quality through adopting backside illumination (BSI) technology.
2011-06-09 OEMS join touchscreen bandwagon
OEMs are joining the touchscreen bandwagon, creating an instant ecosystem that could vanish just as fast if LCD makers build touchscreens directly onto displays.
2007-11-01 NOR market heats up despite tumultuous times
Unfazed by overcapacity and pricing pressures in the tumultuous market for NOR flash memory, Spansion Inc. has begun limited production in the industry's first 300mm NOR fab.
2008-02-08 Next-gen memory race heats up as bets roll
As the next-generation memory race intensifies with more vendors jumping out of the starting blocks, the question remains if the devices will ever become mainstream parts.
2007-05-01 MPW eases analog/mixed-signal design
By understanding the nature of MPW services and adapting your design methodology to take advantage of them, you can save weeks or months of development time in getting a chip to market.
2015-02-18 Molybdenum disulfide shows silicon-like properties
Graphene is often touted as a replacement for silicon due to its extremely high conductivity and unbeatable thinness, but Penn Researchers revealed that molybdenum disulfide is worth taking a second look.
2002-11-06 Mobilian chipset supports 802.11b, Bluetooth functions
Mobilian Corp. is sampling TrueRadio, a two-piece chipset that supports the simultaneous operation of 802.11b wireless-LAN and Bluetooth radios.
2009-06-03 Micron spins off Aptina Imaging
Micron Technology Inc. has signed an agreement to sell a majority interest in its imaging solutions business, Aptina Imaging Corp., to Riverwood Capital and TPG Capital.
2015-05-04 MEMS looks for its Moore's Law
MEMS provide an alternative route to scaling technology beyond Moore's Law that could have advantages in markets such as the Internet of Things.
2007-01-15 Macronix reworks SONOS for next-gen flash
Macronix is working on a flash memory structure, SONOS, that it believes will dismantle the barriers expected to confront today's floating-gate technology at the 45nm node.
2004-02-27 Korean startup to build OLED plant in Singapore
South Korean startup Ness Display Co. Ltd will spend $40 million to $60 million to build an organic light-emitting diode (OLED) plant here [Singapore] that is expected to produce a peak of 15 million to 20 million display panels a year by 2006.
2005-05-02 It's time to move DFT to a higher level
Today, the 'D' in DFT does not really stand for design. All too often, at the gate level, it stands for do-it-late.
2009-02-18 Is energy harvesting ready to boot batteries?
Energy harvesting is an exciting technology development that could end our battery addiction. Instead of relying on batteries the next generation of wireless devices can be powered by energy that's available in the environment.
2010-02-08 Intel wants top spot in SSD market
Intel Corp. hopes to be the technology and solid-state storage (SSD) leader, but it is not seeking to be the top player in the discrete market.
2014-05-14 Intel sets sights on a foundry goal for innovation
The chip giant has been raising the profile of its foundry business over the last year, mainly in pursuit of growth and profit. It has also expanded its deal with Altera to produce multi-die devices.
2005-11-03 Intel re-spins fab for 300mm, 65nm chips
Preparing for a new and steep ramp of advanced microprocessor lines, Intel Corp. on Wednesday (Nov. 2) is expected to announce the 're-opening' of its wafer fab in Arizona. The newly-converted fab will produce 65nm microprocessors and other products on 300mm substrates.
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