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2009-10-28 Nakaya, Amkor, Toshiba form assembly, test JV
Nakaya, Amkor and Toshiba will create joint venture that will provide semiconductor assembly and final testing services in Japan
2009-06-01 MPI opens test service lab in Taiwan
MJC Probe Inc. (MPI) has opened an advanced characterization, modeling and reliability testing laboratory supporting its collaboration with SUSS MicroTec.
2002-04-16 Mixed-signal test strategies for embedded apps
Learn the basic building blocks of semiconductor mixed signal test techniques, as well as a practical systematic approach to mixed signal testing.
2005-06-30 Mentor Graphics scan test tool in TSMC's Reference Flow 6.0
Mentor Graphics announced that TSMC has added the TestKompress scan test tool to its Reference Flow 6.0
2005-03-08 Mentor Graphics offers TCS with design-for-test tools
Mentor Graphics Corp. announced that Tata Consultancy Services (TCS), an information technology consulting and service provider, has selected Mentor Graphics design-for-test (DFT) tools
2013-03-01 Memory test tip: Characterising PCM
Learn about new techniques involving current limiting and high-speed pulse generators.
2013-02-21 Memory test tip: Alternative NVM options (Part 2
Know the testing challenges associated with another emerging NVM technologyferroelectric memory.
2003-06-16 Melexis purchases LTX test systems
Melexis Microelectronic Integrated Systems, a chip manufacturer specializing in automotive ICs, has purchased multiple Fusion CX systems by LTX Corp.
2002-02-13 Matsushita Electric opens semiconductor plant in Suzhou
Matsushita Electric Ind. Co. Ltd has opened a semiconductor plant in Suzhou, Jiangsu, China, named Suzhou Matsushita Semiconductor Co. Ltd
2003-07-10 Marvell deploys Teradyne test systems
Marvell Technology Group Ltd, a provider of broadband communications technologies, has purchased multiple Tiger systems by Teradyne Inc.
2007-07-23 Linux-based parametric test systems debut
Keithley Instruments' S600 Series Parametric Test Systems migrated to the Linux OS on the embedded control computer within each test system
2005-09-01 Leaky chips test designers' skills
To achieve longer battery life in portable products, the entire IC design chain must chip in and tackle leakage.
2003-07-23 Japan opens joint test line for 90nm designs
Advanced SoC Platform Corp. will begin shuttle services later this year using its 300mm wafer-prototyping line and 90nm process technology.
2003-07-02 Japan opens joint test line for 90nm
A research center funded by the Japan government and the semiconductor industry has opened a 300mm wafer line to test and develop specs for 90nm and finer process technologies.
2015-09-17 IoT not enough to boost semiconductor market
According to Gartner, growth rates for PCs, tablets and smartphones are all down this year, and are expected to rebound somewhat but not strongly in 2016 and beyond.
2002-10-04 inTEST acquires semiconductor ATE company
inTEST Corp. has acquired Intelogic Technologies GmbH.
2006-03-02 Intel to invest $300M in Vietnam to build semiconductor assembly, test facility
Intel announced that it will invest $300 million to build a semiconductor assembly and test facility in Ho Chi Minh City.
1999-11-01 Integrating handling for test, inspection, marking and packing
Deploying individual handling systems for testing, inspection, marking and packing leads to inefficiency, under-utilization of IC test equipment, and can even cause bottlenecks that can slow down related back-end processes. Not only do multi-function automated systems circumvent these problems, they also improve throughput and occupy far less floor space
2007-09-19 Instruments advance chip test productivity
Keithley Instrumnets has expanded its product line for semiconductor characterization and production tests
2003-08-06 Infineon to deploy Agilent test system
Infineon has selected Agilent's 93000 SOC test system for its high-speed wired communications apps
2006-11-10 Infineon test chip avoids vertical interconnect defects
Infineon claimed to be the 'first' to deliver the test chip for avoiding VIA defects in the production of highly integrated semiconductor circuits by a factor of 10.
2003-10-02 Infineon releases test chip for fault localization
Infineon Technologies AG has manufactured a test chip that enhances complex semiconductor design processes.
2010-02-12 IEEE releases 1149.7 on-chip test standard
IEEE 1149.7 test and debug standard offers a flexible, dynamic solution for designers and engineers contending with shifting design paradigms
2005-07-20 Hynix Semiconductor buys new equipment from Nextest
Chipmaker Hynix Semiconductor Inc. has purchased at least 10 Magnum 2,560-pin test systems from equipment manufacturer Nextest Systems Corp.
2002-11-12 Hynix adopts Mirae test handler
Hynix Semiconductor Inc. has selected Mirae Corp. to provide them with its test handlers.
2001-03-22 HOTLink Built-In Self-Test (BIST
This application note describes the Built-In Self-Test (BIST) tool of Cypress Semiconductor's CY7B923 and CY7B933 HOTLink transceivers that sends data from place to place over a high-speed serial transmission link.
2012-03-28 Heterogeneous 3D IC test vehicle uses CoWoS Process
Altera claims to be the first chip company to develop and complete characterization of a heterogeneous test vehicle using TSMC's Chip-on-Wafer-on-Substrate process
2003-03-06 GSMC purchases Credence flash memory test system
Grace Semiconductor Mfg Corp. has placed a multi-system order for Credence Systems Corp.'s Kalos and Personal Kalos memory test systems.
2004-04-14 Global semiconductor equipment sales experienced 10% hike
The worldwide semiconductor manufacturing equipment sales totaled $22.8 billion in 2003, a 10.3 percent increase from 2002 sales, according to Gartner Inc
2015-10-21 Global semiconductor capital spending to fall 1% this year
Gartner predicts that memory makers will switch 10 per cent of capacity investments from DRAM to NAND in late 2015 and 2016 and will cut back on investments in late 2015 and early 2016.
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