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2006-03-06 Arrow, QP Semiconductor ink supply assurance agreement
Arrow/Zeus Electronics has partnered with QP Semiconductor to support the Arrow/Zeus Supply Assurance Program, which guarantees a continued source for Cypress' FLASH370i CPLDs, MAX340 CPLDs and SPLDs product families
2002-09-30 ARM, SMIC to codevelop test IC for China market
ARM Ltd and Semiconductor Mfg Int. Corp. have signed an agreement to develop an ARM7TDMI microprocessor core-based test chip targeted for SMIC's 0.185m CMOS process.
2007-11-22 Applied to acquire PV cell test system provider
Applied Materials announced it will acquire Italy-based supplier of automated metallization and test systems for manufacturing crystalline silicon (c-Si) PV cells Baccini S.p.A for $330 million in cash
2003-06-05 Applied Materials develops 90nm interconnect test chip
The X Initiative, a semiconductor supply-chain consortium, has announced that Applied Materials Inc. has produced a 90nm test chip for X Architecture interconnect designs.
2006-12-11 APAC test equipment market to hit $923M in 2012
The Asia Pacific general purpose test and measurement equipment market is projected to reach $922.9 million in 2012, up from $656.2 million in 2005, reports Frost & Sullivan
2003-08-07 Amkor, UTAC forge test alliance eyeing China
Amkor Technology has announced a business alliance with United Test and Assembly Center Ltd (UTAC), a Singapore-based provider of solutions in assembly and testing of memory and mixed-signal semiconductors
2003-01-14 Amkor to provide TI with wafer assembly, test support
Amkor Technology Inc. will provide Texas Instruments with subcontractor assembly facilities that will give TI substantial additional manufacturing capacity for its DLP technology.
2003-09-19 Amkor to increase test capacity in Taiwan
Amkor Technology has signed an agreement with Ficta Technology Inc. to substantially increase Amkor's final test and wafer probe capacity in Taiwan
2004-04-22 Amkor to assemble, test RF chips for Thine Electronics
Amkor Technology Inc. is providing assembly and test services to Thine Electronics Inc., a rapidly growing fabless semiconductor company based in Tokyo, Japan.
2011-10-04 Amkor buys Toshiba's assembly, test fab
Amkor hopes to grow its semiconductor assembly and testing operations as well as its presence in the power IC market
2015-10-19 AMD drops test, assembly business
AMD sold a majority stake in its test, assembly and packaging facilities in Asia as part of a joint venture with NFME. The move gains AMD nearly $320 million as it continues to fight persistent sales decline
2003-04-11 AIT upgrades assembly, test operations in Indonesia
Advanced Interconnect Technologies Inc. has announced that it will expand operations at its factory in Batam, Indonesia.
2003-08-21 Agilent, Peking University co-build SoC test centers
Agilent Technologies Inc. and the Department of Microelectronics, Peking University (DMEPKU), have announced the opening of the jointly established SoC Engineering Test Center in Beijing, China
2010-09-15 Agilent receives global award in microwave test equipment
Agilent Technologies Inc. announced its receiving the Frost & Sullivan's 2010 Global Award for Product Line Strategy in the Microwave Test Equipment Market
2002-06-18 Aehr Test Systems signs up ZMC as China distributor
U.S.-based Aehr Test Systems, a supplier of test and burn-in equipment to semiconductor manufacturers, has arranged for ZMC Technologies to be its sales representative in China.
2006-11-17 ACE Awards in mainland China to honor outstanding semiconductor companies
The first Annual Creativity in Electronics (ACE) Awards in mainland China provides local engineers an avenue to acknowledge companies that have enabled them to develop more sophisticated electronic products.
2011-04-18 500MHzC8GHz oscilloscopes boast faster test
Tektronix, Inc. releases two versions of its performance oscilloscope families ranging from 500MHzC8GHz, designed to help embedded system design engineers troubleshoot their designs faster.
2007-07-20 Fastest' PCIe digital I/O boards roll from Strategic Test
With up to 32 channels, recording or replay rates of up to 125MHz, and allowing synchronization of up to 127 boards, Strategic Test's new digital I/O boards are said to be the fastest in the industry
2008-06-02 Understand, test OCP SystemC channel models
The OCP Protocol is a high-performance and bus-independent interface protocol between intellectual property cores that provides a standard for Electronic System Level design. It improves IP core reusability, making more predictable and productive SoC designs.
2002-04-26 TSMC to use KLA-Tencor test systems for its Fab 12
Taiwan Semiconductor Mfg Co. (TSMC) has selected KLA-Tencor Corp.'s Klarity Defect automated analysis and defect data management system for its Fab 12, which manufactures advanced ICs on 300mm wafers
2005-11-30 Trio-Tech acquires Chinese test, burn-in facility
Trio-Tech International announced it has entered into a definitive agreement to acquire all of the outstanding shares of Globetronics Shanghai, a semiconductor testing and burn-in business located in Shanghai, China
2010-02-19 Toshiba, Fujitsu form assembly, test JV in China
Toshiba Corp. and Nantong Fujitsu Microelectronics Co. Ltd will form a manufacturing joint venture in China for the semiconductor back-end process
2005-06-10 Philips to offer thermal models of its power semiconductor
Royal Philips Electronics will provide thermal models of its power semiconductors to help customers predict the thermal performance of their devices - in a fraction of the time it takes to build and test prototypes
2002-02-05 National Semiconductor bridge addresses 248 PHY ports
Supporting full bidirectional Utopia, the DS92UT16 Utopia-LVDS bridge features an extended cell support and built-in address translation, enabling the device to address as many as 248 PHY ports.
2003-08-15 MT9122/MT9300 ITU-T G.165 Test Report
This application note provides a report on the performance of the MT9122 and MT9300 with respect to the ITU-T recommendation G.165.
2000-12-11 Measurement of Zener voltage to thermal equilibrium with pulsed test current
This application note discusses the zener voltage correlation problem, which sometimes exists between the manufacturer and the customer's incoming inspection. A method is shown to aid in the correlation of zener voltage between thermal equilibrium and pulse testing.
2002-11-27 Innovative optical imaging method seen to lower IC test costs
A group of physicists led by Dr. Caesar A. Saloma of the National Institute of Physics at the University of the Philippines have developed an inexpensive optical imaging technique to detect IC defects.
2009-04-30 Firms enter LSI assembly, test service JV
Nakaya Microdevices Corp., Amkor Technology Inc. and Toshiba Corp. have signed a non-binding memorandum of understanding expressing their intent to form a joint venture in Japan that will provide system LSI assembly and testing services.
2013-02-20 Controller enables image record to test HD image sensor apps
Cypress' EZ-USB FX3 controller offers USB 3.0 bandwidth and dual image sensor support for advanced 3D inspection equipment.
2002-05-29 August Technology acquires test equipment maker
August Technology Corp. has acquired Semiconductor Technologies and Instruments Inc., a manufacturer of automated micro-defect inspection equipment formerly owned by ASTI Holdings Ltd of Singapore
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