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2000-12-06 Basic semiconductor thermal measurement
This application note provides the reader with a basic understanding of power semiconductor thermal parameters, how they are measured, and how they are used
2014-10-31 Thermal analyser scales down LED testing time
ITRI developed the In-Line Compact Thermal Analyser (ICTA) technology that promises to minimise LED thermal testing time by more than 90 per cent, offering a measurement speed of 12,000 LEDs per hour
2013-08-20 Dealing with SMPS efficiency, thermal behaviour
Find out how to tackle the efficiency and thermal behaviour of SMPS with SPICE technology
2014-04-10 Advances in power converter packaging
Find out how packaging advances are matching semiconductor progress in power converter miniaturisation
2003-01-02 Wireless ICs call on integration
Makers of ICs for Bluetooth and 802.11, or Wi-Fi, WLAN connectivity are readying a new generation of chips for volume delivery in Q1 of 2003.
2015-02-13 Utilising LEDs for LCD backlighting (Part 2)
In Part 2, we will begin with a look at the market trends that have driven the evolution of LED LCDs. This will be followed by an exploration of the optical design techniques used in today's displays.
2011-07-25 Understanding power issues in SDI products (Part 1)
Learn about the considerations to make when designing with analog and mixed-signal serial digital interface components.
2015-02-25 Thin sensors boast high-level gas, chemical detection
UC scientists have built sensors made of molybdenum disulphidesmall, thin and highly sensitive to gases and chemical vapours including ethanol, acetonitrile, toluene, chloroform.
2006-03-16 Rx: New test techniques
New measurement approaches require faster and more efficient and reliable instrumentation and software.
2013-03-04 Probing Voyager spacecraft longevity
The Voyager spacecrafts, operating 32 years beyond their mission and near the edge of the solar system, exemplify the durability and reliability needed for space systems design.
2014-01-23 Optimise CMOS for MEMS-based frequency control
CMEMS fabrication process can be used to fabricate both micro-electromechanical and CMOS electronic devices on a single die.
2013-04-16 Improving digital isolators' quality, reliability
Know how to enhance digital isolators with an extra level of qualification, additional inspections, and even greater test coverage.
2014-12-19 IBM claims PCM non-volatility not necessary
Ron Neale gets down to the nitty-gritty of IBM's invited paper at IEDM 2014. IBM has stated that for PCM, non-volatility/data-retention is no longer needed.
2000-11-01 Extraction critical for RF design
Current CMOS technology is a viable candidate for portable communications devices. Modern deep-submicron MOS transistors have more than enough speed to handle high-frequency or RF signals.
2015-11-16 Examining metal eFuses
Here is a look at two electrically blown fuse structures (eFuse) used in metal gate logic processes. The first eFuse structure that we look at is made by Intel and the second by TSMC.
2005-06-01 Driving 10Gb Serial ATCA backplanes
The Backplane Ethernet Task Force is focused on developing three new PHYs: 1000BASE-KX, 10GBASE-KX4 and 10GBASE-KR
2012-11-07 Choosing the right timing device (Part 2)
Know the other concerns for high performance oscillators: temperature response, frequency control and EMI reduction.
2011-10-13 Benefits of SONOS memory for embedded flash
Here's a discussion on why silicon-oxide-nitride-oxide-silicon memory technology is ideally suited for eFlash.
2014-01-30 Avoiding electrical overstress in electronics
Here are some of the ways in which electrical overstress can cause the failure of integrated circuits and electronic systems.
2014-07-31 3D-IC: Taking the next steps towards broad adoption
Technology firms are applying manufacturing intelligence across test operations to bring the associated costs in line with required levels of profitability.
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