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2009-12-21 VT Silicon, TowerJazz deliver 4G RF front-end IC
VT Silicon has selected TowerJazz for the world's first silicon 4G RF Front End IC capable of meeting the stringent operating requirements of 4G mobile devices
2011-02-16 Silicon die integrates Wi-Fi, Bluetooth
Atheros's XSPAN AR9462 combo solution integrates 2-stream, dual-band 802.11n and Bluetooth 4.0 technologies onto a single die
2002-08-22 LogicVision, SiidTech explore use of silicon fingerprinting
LogicVision Inc. has formed a partnership with SiidTech Inc. to explore the advancement, utilization, and potential of silicon fingerprinting and embedded test in ASIC and SoC technologies
2004-07-05 BIST firm puts an eye in the die
Though the notion of bridging the gap between disparate design and test worlds is rather old, a logic BIST solution provider claims to have revisited the conundrum with an 'eye-in-the-die' approach
2007-07-12 XMOS fields software-defined silicon
XMOS Semiconductor's new processor architecture is based on an event-driven, multi-threaded processor core set to be deployed in two-dimensional arrays in a family of chips due for introduction in 2008.
2008-06-06 Will 3D through-silicon vias break into mainstream
The 3D technology based on through-silicon vias technology took center stage at the IEEE 2008 International Interconnect Technology Conference but there is still no consensus just how the industry will bring the long-awaited technology into the mainstream
2006-01-20 TTPCom 3G modem reduces silicon area
TTPCom and ARM announced that comparative analysis revealed that wireless applications processors that integrate TTPCom's CBEmacro 3G modem occupy less silicon area than current solutions
2002-03-11 Tru-Si, OSE-USA codevelop high-yield stacked die chips
Tru-Si Technologies Inc. has formed a joint development agreement with IC package provider OSE-USA to create an ultra-thin microchip die that can be stacked and interconnected with up to four die per package for volume manufacturing
2012-07-26 Techniques, procedures for die bonding
Here's a look at various techniques for die bonding, a process of connecting die to the package for communication to the outside world
2007-04-10 Spansion bundles NOR, ORNAND, Quad on a die
Spansion plans to combine its MirrorBit NOR, ORNAND and Quad flash memory on a single die, making it the latest flash memory player to rethink its architecture in an effort to offer handset designers a one-stop-shop approach to choosing a memory subsystem
2003-11-18 Silicon Wave, RF Micro IC decreases development time
Silicon Wave and RF Micro Devices have introduced the SiW3500 UltimateBlue IC, a single-chip CMOS Bluetooth solution that helps speed time-to-market
2003-06-18 Silicon Wave Bluetooth die provides high-density integration
Silicon Wave's UltimateBlue 3000 radio processor and the SiW1712 radio modem are available as standalone bare die products.
2008-07-04 Silicon TV tuners speed past the CAN
Until the most recent product announcements, silicon tuners have fallen well short of the performance offered by hand-tuned CAN tuners. But one company in particular seems to have focused on achieving the best possible silicon solutions for fixed TV tuners: XCeive Inc
2008-01-04 Silicon TV tuners clearing hurdles
Although mobile phone and WLAN transceivers made the transition to silicon ICs years ago, solid-state TV tuners have been slower off the starting block. Recently, several companies have started to offer IC-based TV receivers that will replace the traditional "can tuner
2007-07-19 Silicon tuner device is extra small
MaxLinear Inc.'s new silicon tuner IC, the MxL7001 is said to be the world's smallest silicon tuner produced to date for mobile TV applications such as digital TV on cellphones
2013-06-28 Silicon Labs touts single-die alternative to quartz crystals
Silicon Labs joins the scalability and economy of CMOS and the stability of MEMS in its patented single-chip MEMS oscillator, dubbed CMEMS
2010-04-30 Silicon Labs takes over MEMS company
Silicon Laboratories Inc. has acquired Silicon Valley-based MEMS company, Silicon Clocks
2013-04-24 Silicon Labs rolls out digital radio receivers for CEs
The monolithic Si468x receiver ICs bring FM, HD radio and DAB/DAB+ broadcast capabilities to devices such as mobile phones, tablets and personal navigation devices.
2012-11-09 Silicon Labs outs relative humidity sensor
The Si7005 combines a mixed-signal IC manufactured on standard CMOS with a proven technique of measuring humidity using a polymer dielectric film.
2011-04-26 Silicon integration key to lower-cost smartphones
To meet growing demand for lower-cost smartphones, most designers will integrate application and baseband processors, putting such integrated chips into nearly 70 percent of all smartphones by 2014.
2009-09-02 Silicon circuit board trumps ASICs
Startup siXis Inc. has selected foundry SVTC Technologies to fabricate its embedded silicon board computing modules, which claims to bridge the gap between PCB prototypes and ASIC-based designs
2013-04-10 Plessey begins production of GaN-on-silicon LEDs
Plessey Semiconductor has begun sampling LEDs made on GaN) on silicon wafers with a light output of just 2 lumens intended for indicator lamps and back-lighting applications
2010-12-03 PCM die found in mobile phone
UBM TechInsights reports it has found a phase-change memory die inside a Samsung handset
2003-01-21 MoSys' 1T-SRAM-R: silicon-proven on UMC logic process
United Microelectronics Corp. has announced that MoSys Inc.'s 1T-SRAM-R technology incorporating Transparent Error Correction is silicon-proven in its 0.135m logic process
2003-07-25 Monterey Design receives patents on silicon prototyping, physical implementation
Monterey Design Systems has been issued two new U.S. patents entitled 'Method for Design Optimization Using Logical and Physical Information' and 'Method for Designing Large Standard-Cell Based ICs.'
2005-01-28 Marvell obtains silicon success using Magma design solutions
Magma Design Automation Inc. announced that Marvell Technology Group Ltd has achieved silicon success on several designs using Magma's Blast Create and Blast Fusion software
2010-07-29 Intel: Silicon photonics to replace copper
Silicon photonics will replace copper connections in everything from supercomputers to servers to PCs, according to Intel Corp. researchers who demonstrated 50-Gb/s optical transmitter and receiver chips that it plans to scale up to terabit-per-second speeds prior to commercialization
2004-02-13 Intel uses silicon for 1GHz optical modulator
Extending its thrust in silicon-based optical components to modulators, Intel Corp. researchers said they have reached 1GHz speeds with modulators which have on-chip phase-shifting capabilities
2002-03-05 Intel reveals long-term goals for silicon photonics, sensors
Intel Corp. chief technology officer Patrick Gelsinger has revealed several research breakthroughs that extend the reach of silicon devices in his keynote address Thursday (Feb. 28) at the Intel Developer Forum
2007-04-17 IBM advances through-silicon via packaging tech
IBM Corp. announced it has made advances in through-silicon via packaging that will allow it to ship production chips using the new interconnect in 2008
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