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2008-10-21 Affordable silicon ink speeds up RFID tagging
Printing thin-film circuits on flexible substrates may be available in the market with the release of what is believed as silicon ink's first commercial integration.
2007-11-15 'Green' silicon ink prints cheaper RFID tags
Kovio claimed that RFID tags using its 'green' silicon ink will drop Kovio's price from 15 cents today to 5 cents by 2008, when Kovio begins volume production of its inkjet-printed RFID tags.
2005-04-15 Synopsys, Tower ink 180nm silicon library distribution agreement
Synopsys Inc. is making 180nm silicon libraries from Tower Semiconductor available through Synopsys' DesignWare library, the two companies said Wednesday (April 13
2002-11-20 Pre-spec 802.11g silicon raises interoperability fears
Chipset vendors are moving headlong into IEEE 802.11g WLAN silicon before the ink is dry on the standard, hoisting the specter of non-interoperable 802.11g solutions in a market that has depended on interoperability for its very success.
2004-12-09 Plastic Logic, E Ink, team for large area flexible display
Plastic Logic Ltd and E Ink Corp. have reached a nonexclusive agreement to cooperate on the design and fabrication of flexible all-plastic electronic displays, Plastic Logic said Monday (Dec. 6
2011-12-08 MEMS switch created thru ink-jet printing
Researchers from the University of California Berkeley sees the application of the printed MEMS switches in flexible display backplanes.
2006-05-16 Liquid silicon promises 'green' devices
Seiko Epson Corp. and JSR Corp. have jointly developed a liquid-silicon material called cyclopentasilane that promises to deliver environment-friendly electronic devices
2014-07-11 Ink promises shapely future for electronics
Japanese researchers developed an ink that allows charge transfer in order to facilitate printing at room temperature. This broadens options for flexible plastics that can be used to print semiconductor devices
2011-12-05 Graphene ink-jet printing targets flexible electronics
Researchers from the University of Cambridge used the N-methylpyrrolidone as a low-cost way to print thin-film transistors for transparent electronics.
2008-10-28 China Sunergy, HHT ink silicon ingot supply pact
China Sunergy has entered into a multiyear agreement for a supply of high quality 8-inch single crystal silicon ingot with Hitachi High-Technologies
2007-08-24 SunPower, NorSun ink ingot, polysilicon deals
SunPower has signed two agreements with NorSun: One to purchase silicon in ingot or wafer from NorSun, and the other to sell polysilicon to the latter
2003-11-11 STMicro, MobiDiag ink biochip development pact
STMicroelectronics has signed a joint development agreement with MobiDiag to create a complete system for genomic-based detection of infectious diseases based on a silicon MEMS biochip
2005-02-03 SST, Nanotech ink flash memory agreement
Silicon Storage Technology Inc. (SST) and China-based semiconductor foundry Nanotech Corp. have entered into a multi-faceted investment, technology licensing and foundry relationship
2009-12-24 Solar Energy, ITRI Taiwan ink PV deal
Solar Energy Initiatives and the ITRI Taiwan have entered a business and technical collaboration agreement to build, integrate, test and commercialize solar products and solutions.
2002-12-23 Shipley, Therma-Wave ink nano-metrology development deal
Shipley Co. has signed a joint development agreement with Therma-Wave Inc. in which the two companies will co-develop scatterometric methods to better measure 130nm photoresist features for polysilicon gate and shallow trench applications.
2010-06-08 Saxony, Abu Dhabi ink microelectronics R&D MOU
The German state of Saxony and Abu Dhabi's Executive Affairs Authority have signed an MOU to set up opportunities to share and exchange knowledge in microelectronics
2004-12-07 QSound, VIA ink licensing agreement for audio tech
QSound Labs Inc. has signed a licensing agreement with VIA Technologies Inc., a developer of silicon chip technologies and PC platform solutions
2006-08-17 MIPS, Dolby ink audio partnership for home entertainment
MIPS Technologies and Dolby Laboratories announced its recent partnership wherein the two companies will deliver next-generation audio technology across all segments of home entertainment, including the STB, HD DVD and Blu-ray Disc markets.
2002-06-03 ISSI, Signia ink licensing agreement for Bluetooth products
Integrated Silicon Solution Inc. has entered into a product licensing and manufacturing agreement with Signia Technologies, wherein ISSI will manufacture Bluetooth products developed by Signia
2009-08-11 HKSTP, IBM ink PowerPC IP core tie-up
Hong Kong Science and Technology Parks Corp. (HKSTP) and IBM Corp. have signed an agreement to make the latter's PowerPC SoC IP available through HKSTP's new Secure Virtual IP Chamber.
2009-03-24 Gennum, Tundra ink acquisition agreement
Gennum Corp. and Tundra Semiconductor Corp. have entered into a definitive agreement providing for the acquisition by Gennum of all of the issued and outstanding shares of Tundra.
2009-07-21 EVG, Applied ink 3D wafer bonding deal
EV Group (EVG) has partnered with Applied Materials Inc. to develop wafer bonding processes for the manufacture of through-silicon vias (TSVs) in 3D IC packaging applications
2003-12-19 ESS Technology, Hansung Elcomtec ink strategic agreement
ESS Technology Inc., a provider of silicon solutions for digital imaging, video and audio consumer electronics, has entered into a strategic relationship with Hansung Elcomtec Co. Ltd, a consumer electronics manufacturer. The purpose of the agreement is to combine ESS' VGA technology with Hansung's module technology to produce a lower cost, more flexible product offering for camera phone OEMs
2004-04-13 EM, SST ink license pact
EM Microelectronic and Silicon Storage Technology Inc. (SST) have signed a license agreement
2008-09-05 Canadian Solar, GCL ink long-term supply deal
Canadian Solar Inc. and GCL Silicon have signed new long-term supply agreements in which GCL will supply 510MT of high-purity polysilicon feedstock in 2008 and 2009 and approximately 1.8GW of wafers to CSI from 2010 to 2015
2010-05-17 Cadence, Denali ink merger deal
Cadence Design Systems Inc. and Denali Software Inc. have entered into a definitive merger agreement, under which Cadence will acquire Denali for $315 million in cash.
2006-12-12 Cadence, Advantest ink car electronics testing partnership
Cadence Design Systems and Advantest Corp. announced a collaborative partnership to deliver a methodology for zero-defect testing of digital automotive electronics.
2005-05-12 Atmel, WiDeFi ink SiGe foundry partnership
Atmel Corp. has been chosen by fabless semiconductor company WiDeFi Inc. as its foundry partner for WiDeFi's Xtender family of 802.11 repeater chipsets.
2014-09-22 AMD, Synopsys ink IP partnership
The multi-year agreement gives AMD access to various Synopsys DesignWare interface, memory compiler, logic library and analogue IP on advanced 16/14nm and 10nm FinFET process technologies.
2008-11-26 Researchers fuse CMOS circuits, flexible substrates
Researchers claim to have invented a method that combines CMOS circuits on flexible substrates by transferring silicon circuits from a wafer onto the flexible polymer substrate
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