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2010-12-24 Design methods shift to software, part 2
Designing via block level IP integration with virtual platforms shortens the number of steps between design intent and having working hardware and software
2002-10-08 Design firm becomes analog chip provider
Integration Associates Inc. is recasting itself as a fabless analog chip provider
2010-06-23 DAC panelists deliberate on 3D TSV roadmap
Panelists at the Design Automation Conference (DAC) made an attempt to forecast a roadmap for 3D through-silicon-vias interconnects
2006-09-06 DAB baseband receiver IC enables space, cost savings
According to Frontier, the key benefit of its new Chorus 2 IC is the level of integration, which provides up to 40 percent space savings on the board real-estate and 35 percent cost savings on the system BOM
2005-04-15 Cypress, American Semi forge SOI foundry deal
Silicon-on-insulator (SOI) specialist American Semiconductor Inc. (ASI) disclosed a foundry deal with the Silicon Valley Technology Center (SVTC), a division of Cypress Semiconductor Corp
2003-06-24 CSR, SeekerNet partner on Bluetooth monitoring system
Cambridge Silicon Radio and SeekerNet, a developer of wireless technologies, have collaborated to provide a Bluetooth based wireless tracking system
2003-06-25 CSR, Barcoda to Bluetooth-enable Microvision scanner
Cambridge Silicon Radio and Baracoda have signed an exclusive supply agreement with Microvision Inc. that will enable the latter to globally distribute a new Bluetooth-enabled bar code scanner
2003-09-25 CSR Bluetooth to support Symbian OS
Cambridge Silicon Radio has announced that it is making its chipsets available for use with the Symbian OS
2004-04-15 Cortina obtains $20M Series B funding
Cortina Systems Inc., a startup that demonstrated remote packet ring silicon last year, has gained $20 million in Series B financing to be use to extend its mixed-signal design expertise into integrated devices for the transport and enterprise-aggregation markets
2009-08-05 Corning, Soitec develop SiOG substrates for OLEDs
Corning Inc. and the Soitec Group have agreed to work together on the development of high-performance silicon-on-glass (SiOG) substrates for flat panel OLED mobile displays
2015-08-05 CoolCube 3D interconnect targets FinFET process
The research institute demonstrated the feasibility of CoolCube used to stack FinFET layers on its 300mm production line as well as with fully-depleted silicon-on-insulator manufacturing processes
2002-09-10 Convergence to introduce "third-era" computing
Silicon will be the driving engine that will bring new capabilities to the computing and communications sector, this is according to Intel president and COO, Paul Otellini, while opening the Intel Developer Forum Fall 2002
2003-05-27 Consortium vows to simplify IP reuse in SoCs
A group of EDA, silicon intellectual property and semiconductor vendors will announce the formation of a consortium at the 40th DAC
2009-07-08 Coming soon: Carbon chips
Carbonthe basis of all organic compoundsseems destined to displace silicon as the material of choice for future semiconductors
2016-01-14 Combined multi-touch, 3D-gesture modules aimed at displays
Microchip Technology and Silicon Integrated Systems worked together to roll out projected-capacitive touch and 3D-gesture interface modules geared to speed up development and slash costs
2009-03-31 Circuit stacking handles complex 3D designs
Soitec SA has announced that its circuit stacking technology is ready for technology transfer and manufacturing.
2006-08-10 Chipset suit IP telephony, modem, line monitoring apps
The new chipset from Integration Associates is voice and V.92 capable and is suitable for telephone line interface requirements and standards
2002-11-28 Chipmakers bang away at metal gates
Technologists are girding for yet another major change in CMOS gate stack integration: the replacement of polysilicon gate electrodes with two metals for PMOS and NMOS transistors
2003-09-11 Chip technologies from IBM promise faster transistors
IBM announced two milestones that could enable the IT industry to produce higher performing, lower power devices in the near future.
2007-01-30 China firms mount FM tuner face-off
Two Shanghai companies are tuning in to the FM radio chip market, hoping to challenge market leaders with their own CMOS-based offerings.
2007-03-16 China firms challenge radio chip market leaders
Two Shanghai-based companies are tuning in to the FM radio chip market, hoping to challenge market leaders NXP Semiconductors and Silicon Laboratories with their own CMOS-based offerings
2012-02-13 Challenges, opportunities of the 2.5D/3D ecosystem
While opportunities abound, moving to 2.5D/3D manufacturing has posed significant challenges to designing, fabricating, assembling and testing of 2.5D/3D ICs.
2005-06-22 Celoxica, SGI step up high-performance computing apps
Celoxica Ltd announced support for Silicon Graphics Inc.'s (SGI) reconfigurable application-specific computing (RASC) technology in the Celoxica DK design suite of tools for C-based design and synthesis
2001-05-01 Cadence's 'all-in-one' tool gets skeptic reviews
Cadence's Integration Ensemble (IE) is the first single tool that can take a hierarchical chip design all the way from synthesizable RTL code through a GDSII layout file and designers are raising an eyebrow if it will perform as well as it promises
2004-02-20 Cadence rolls synthesis tool, new metric
Cadence Design Systems will announce that its Encounter RTL Compiler Ultra synthesis tool supports the VHDL language.
2002-05-22 Cadence overhauls IC implementation suite
Aiming to speed timing closure and signal integrity analysis, Cadence Design Systems Inc. this week will announce an across-the-board update to its SP&R (synthesis, place and route) IC implementation suite.
2010-11-03 Cadence maps out design tool development strategy
Cadence Design Systems Inc. explained the company's strategy to provide an end-to-end flow of silicon and software design tools as part of its EDA360 campaign
2016-04-05 CAD tool for capacitance extraction in image sensor designs
Silicon Frontline Technology released the F3D field solver that allows capacitance extraction of complex 3D large-area structures such as pixels, arrays and precision analogue circuits
2008-06-02 Boost DC/DC converter efficiency at higher frequencies
How can you increase the efficiency of your DC/DC converter design across its load range for higher switching frequencies? One method is to focus on reducing the recovery charge and forward voltage drop of the low-side MOSFET. Chips that integrate a Schottky diode with the MOSFET have several benefits at higher frequencies when compared to a standard trench MOSFET. Here's what you can expect from such a design.
2002-01-16 Bluetooth coming to terms with single-chip issue
When Bluetooth surfaced on the wireless scene a few years ago, the semiconductor industry jumped onto the notion of single-chip solution for a seamless integration
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