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2002-10-03 RF Micro, Jazz partner for silicon production
Jazz Semiconductor and RF Micro Devices Inc. have entered into an arrangement in which the latter will obtain a guaranteed, lower cost source of supply for wafers fabricated utilizing Jazz's manufacturing processes.
2005-08-01 RF IC tools still seeking paths to silicon
Complicated by multiple modulation schemes, RF tools have become proficient at simulating behavior on an architectural level.
2005-02-25 Retimer chips achieve new levels of integration for CX4, LX4 apps
Mysticom introduced a pair of new retimer chips for Xenpak, X2 and XFP modules that incorporates its third generation 10GbE transceiver technology.
2011-10-19 Recent developments in 3D integration
Here's a discussion on through-silicon via and mechanically flexible interconnect, and how these are being currently developed
2011-09-19 Power Silicon's SoC design earns patent win
Open-Silicon has earned a patent win for its low power ASIC design process through design-specific library augmentation
2005-03-15 PON driver touts integration
Vitesse's VSC7965 pairs a limiting amp with a driver and is designed to be integrated into low-cost transmit optical subassemblies for residential PONs.
2002-05-16 Planar integration of optical components
This news article discusses the industry methods in constructing optical circuits out of waveguides fabricated on silicon wafers, or planar integration, using conventional semiconductor tools and techniques.
2010-02-01 PHY IP solution eases HDMI 1.4 integration
Synopsys Inc. has launched the high-quality DesignWare HDMI 1.4 transmitter (Tx) and receiver (Rx) digital controllers and PHY IP solutions that are compliant to the standard specification.
2012-02-17 PHY IP enables fast HDMI integration
The DesignWare HDMI 1.4 IP solution is fully compliant with both HDMI and high-bandwidth digital content protection specifications and has received certification from HDMI authorized testing centers.
2002-11-01 Photonic integration takes a new shift
Changes in achieving silicon optical bench integration raised the issue whether the integration of electronic and photonic components is still necessary.
2004-03-16 Passive integration activates wireless
The PiiP concept is a unique design approach for integrating package-level design into the silicon world via BiCMOS SiGe process
2010-02-22 Open-Silicon, Virage offer low-power design solutions
Open-Silicon Inc. and Virage Logic are teaming up to provide comprehensive design solutions including access to Virage's extensive physical and advanced interface intellectual property portfolio
2006-11-30 Open-Silicon offers MIPS processor core for ASICs
Open-Silicon has signed a deal with MIPS Technologies to offer the latter's MIPS32 24Kc Pro processor core for use in ASIC and SoC designs
2006-11-22 Open-Silicon licenses MIPS' processor core for ASIC devt
MIPS Technologies Inc. announced that Open-Silicon Inc. has selected the MIPS32 24KEc Pro processor core to power advanced custom ASIC solutions for complex SoCs
2007-03-15 NXP intros 'first' pure DVB-T silicon tuner
NXP introduced a new generation of high-definition digital terrestrial silicon tuner, the TDA18211HD, which raises the performance and lowers the costs of STB applications
2005-03-15 Micronas licenses Silicon Images' HDMI, and DVI IP for TV ICs
Micronas has licensed the High-Definition Multimedia Interface (HDMI) and Digital Visual Interface (DVI) receiver IP for integration in their consumer ICs from Silicon Image Inc.
2004-02-13 MediaTek adopts Silicon Image HDMI technology
MediaTek has adopted Silicon Image's High-Definition Multimedia Interface (HDMI)-compliant PanelLink Cinema transmitter technology
2005-01-28 Marvell obtains silicon success using Magma design solutions
Magma Design Automation Inc. announced that Marvell Technology Group Ltd has achieved silicon success on several designs using Magma's Blast Create and Blast Fusion software
2010-10-11 LSI's 28nm custom silicon platform enables enhanced SoC integration
LSI Corp. announced its 28nm custom silicon platform which includes a broad portfolio of IP blocks as well as an advanced design methodology for customized SoCs
2002-11-22 LSI silicon platform to use Virage cells
LSI Logic Corp. has licensed Virage Logic Corp.'s ASAP Metal Programmable Cells to be used on their RapidChip silicon platform
2005-01-12 Laser demos silicon-opto convergence
Intel Corp. claims to have developed the world's first all-silicon laser chip
2006-11-14 Japan's Shemei grows blue LED on silicon wafer
Shimei Semiconductor announced that it has developed a blue LED grown on a silicon wafer that it plans to make available by next April
2011-07-06 JA Solar boosts wafer capacity with Solar Silicon Valley buy
JA Solar will acquire 100 percent ownership of Silver Age Holdings in a transaction that values Solar Silicon Valley at approximately $180 million
2004-06-22 Ittiam rolls out WLAN silicon
Ittiam Systems announced the availability of its 802.11g-compliant WLAN physical layer.
2003-07-16 iSCSI silicon taken to new price point
Higher chip integration often creates a new price point that can spur growth in a burgeoning market. And iReady Corp. hopes to do just that with an iSCSI storage-networking device it has developed with National Semiconductor Corp
2010-02-17 Intel sees III-V-on-silicon as 2015 transistor option
Intel director of technology strategy Paolo Gargini said that the inclusion of III-V materials is a 2015 transistor option that could deliver either 3x the performance of silicon at the same power consumption
2002-08-15 Intel adopts strained silicon for 90nm process
Intel Corp. said that it will add strained silicon technology to its 90nm technology mix, and will use the process to make the Pentium 4 microprocessor code-named "Prescott" starting next year
2011-06-17 Integration, regulation rev up automotive MEMS
This special report outlines emerging trends in automotive MEMS, such as microbolometers and CMOS image sensors, and the integration of multiple sensors, supporting processors and communication functions
2002-12-02 Integration strategies transform microcontroller design
New application demands and semiconductor economics increase levels of integration demanded of products, and hence blurring the traditional boundaries between MCUs and MPUs
2002-09-01 Integration essential to affordable GPS
To complete a telematics system, a GPS RF front-end has to be added as well as a cellphone module suited to the type of network required, plus their antennas and controlling software.
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