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2008-12-08 Causing an avalanche: the latest advance in silicon photonics
Several companies are active in the field of silicon photonics because they believe that silicon has an advantage in making the very low cost optical parts needed for large markets
2011-12-14 Carbon nanotube beats copper in 3D integration
A research team at Chalmers is working with carbon nanotubes as conductive material for TSVs, citing its thermal qualities as crucial to the application.
2009-10-05 Braving software-to-silicon verification challenges at 45nm
Software-to-silicon verification holds immense challenges at 45nm and beyond for system designers and tool vendors, with multiple paradigm shifts converging at the same time
2008-10-30 Bluetooth modules ease integration in embedded designs
Laird Technologies Inc. has added of four new Bluetooth modules to its range of wireless products.
2006-12-18 Balancing processing needs, power and integration in next-gen handsets
This article will discuss how new types of cellphone designs are changing the way cellphone designers tackle some of the most difficult challenges.
2008-09-30 Asian start-ups to get hold of silicon shuttle services
HKSTP and e-Shuttle Inc. have signed an agreement to provide silicon shuttle services for start-up IC design houses in Asia
2002-05-31 ARM, Synopsys, TSMC develop SoC integration method
ARM, Synopsys Inc. and TSMC have collaborated in developing a SoC integration methodology for ARM partners who use TSMC as a foundry
2004-06-30 Application convergence defines silicon IP industry
Application convergence helps dictate how silicon IP vendors define and develop their products
2011-05-27 Analog partner program targets first-time silicon success
Analog Bits started launching its partnership program to enhance the semiconductor design ecosystem prioritizing first-time silicon success among its analog partners
2004-10-27 All-silicon clock oscillator touts performance, integration benefits
Micro Oscillator said its new all-silicon CMOS-based clock oscillator will match the performance of 32kHz crystals
2008-10-21 Affordable silicon ink speeds up RFID tagging
Printing thin-film circuits on flexible substrates may be available in the market with the release of what is believed as silicon ink's first commercial integration.
2012-04-17 Addressing integration concerns with SiP technologies
Learn about the benefits and drawbacks of system-in-package technologies.
2012-01-11 Address hardware/software integration issues with combined prototyping solutions
Find out how to reap the individual advantages of prototypes in combination with other prototyping techniques.
2013-02-15 Accelerate tester-based silicon debug (Part 2
Learn about a detailed check list of must-do practices during verification for testing.
2013-02-08 Accelerate tester-based silicon debug (Part 1
Learn about the silicon test and debug phases an SoC must undergo, as well as the techniques and tools available to the test engineer
2012-12-20 A*STAR offers 2.5D through-silicon-interposer MPW service
The service is aimed at providing a cost-effective platform to do research and development prototyping and proof-of-concept in 2.5D TSI technology.
2016-05-18 44W silicon switch cuts power, size for cellular systems
The ADRF5130 from ADI is specified at 0.7GHz to 3.5GHz frequency band with typical 0.6dB insertion-loss, isolation of 50dB and linearity of 68dBm aimed at cellular radio systems.
2005-02-01 3G integration not a linear progression
The road map toward 3G integration has been set; the tough ride to progress begins
2014-06-23 3D integration tech thins down 300mm wafer to 4?m
The length of the wiring between upper- and lower-layer chips in the thinned wafers is reduced to below 1/10 compared to conventional TSVs, with wiring resistance, capacitance, and volume being reduced drastically.
2014-01-16 3D integration leads to robust I/O performance, says IBM
IBM fellow Jon Casey tells EE Times that the semiconductor industry needs to embrace chip stacking amid a slowdown in Moore's Law and the rise of data-driven applications.
2008-12-19 200 Gbps silicon photonic integrated chip
To fully exploit the computing power of multi-core and many-core computers, there is a need of high-speed and high-capacity communication network that can manage enormous data transport among the cores and memories.
2014-09-22 100nF silicon capacitors aimed at ultra-broadband systems
The UBSC capacitor series from IPDiA is intended for DC blocking, feedback, coupling and bypassing applications in all broadband optoelectronics and high speed data systems.
2007-11-15 Green' silicon ink prints cheaper RFID tags
Kovio claimed that RFID tags using its 'green' silicon ink will drop Kovio's price from 15 cents today to 5 cents by 2008, when Kovio begins volume production of its inkjet-printed RFID tags
2002-04-08 Wireless-trench technology for silicon GSM power amplifiers
This article describes the results obtained for power amplifiers designed with the new wireless trench technology.
2014-06-03 Wearables, IoT-ready GPUs shrink silicon size
The GPUs are designed to offload and reduce system resources including complete UI/composition and display controller integration, minimal CPU overhead, and bandwidth modulation
2004-11-23 Tyco connector reduces cost of PoE integration
Tyco Electronics released a new interconnect that enables PoE functionality to be embedded within the connector.
2002-11-26 Tiny Bluetooth module touts integration
Murata Electronics has designed a full host controller interface-level Bluetooth module into a 9.8-by-9.6-by-1.8mm package.
2012-03-19 Test sol'ns ease integration of PCIe 3.0 in Intel Xeon processors
Tektronix products that support development of the processors include DPO/DSA/MSO70000 series oscilloscopes, TLA7SA16/TLA7SA08 logic protocol analyzer modules and TLA7000 series logic analyzers.
2010-12-07 Sparc-Solaris integration breaks database records
The system executed more than 30 million transactions/minute, overtaking systems from IBM and Hewlett-Packard by a wide margin.
2008-02-15 Mobile TV ICs tout high integration, energy efficiency
Infineon Technologies has added two highly integrated and power-efficient devices to its mobile TV IC family, the OMNIVIA TUS 9090 and OMNITUNE TUA 9001.
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