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2003-12-10 Tool set eyes process test-chip design
Silicon Canvas Inc. will release a platform for process test-chip development that the company calls the first commercial product of its kind. The Laker T1 platform is designed to help foundries and integrated device manufacturers create test chips to verify, optimize and calibrate new silicon processes
2014-02-19 Tips for cost-effective 3D IC production
Know how to distribute the cost-of-ownership across the supply chain.
2006-10-12 Tiny DAB/FM radio module rolls for battery-run handhelds
Frontier Silicon touted its new Naples FS2011 as the industry's first miniature and integrated stand-alone dual-band DAB/FM radio module for handheld battery-powered products
2006-05-05 TFT-LCD panel suits mobile devices
Samsung announced that it has developed an amorphous silicon, 7-inch, single-chip TFT-LCD panel that reproduces colors in high resolution
2012-01-30 Team-up unveils Si-photonics biosensor ICs
Imec and Genalyte have developed a disposable silicon photonics biosensor chip that allows for high levels of multiplexed biosensing
2003-09-16 SVP is key technology for nanometer IC design
Examine the importance of chip-level architectural issues and the need for physical hierarchy for multi-million gate nanometer SoC design.
2004-06-16 SVM aids process selection
Silicon Virtual Machine offers guidance in determining the suitability of a process for a particular design
2004-02-02 Strained SOI on the move to mainstream
The advantage of strained silicon lies in its electrical properties. The crystalline lattice of the top, electrically active layer of silicon is strained so that electric charges flow faster
2011-04-21 STATS ChipPAC aims TSV expansion in Singapore
STATS ChipPAC is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities in Singapore
2011-05-23 Standard power modules deliver fast switching frequencies
Microsemi has expanded its standard power modules with silicon carbide (SiC) devices to offer standard, off-the-shelf products
2006-09-18 Spice tools rev speed, accuracy
Berkeley Design Automation released in August two products that claim to speed Spice simulation by five- to tenfold while preserving full Spice accuracy.
2013-07-31 SpeedBridge adapter enables PCIe 3.0 design verification
The SpeedBridge Adapter for PCIe 3.0 provides easy bring-up and fast debug of PCIe-based designs when used with a Cadence Palladium Verification Computing Platform.
2002-02-14 Solus opens development facility in the U.K.
Tunable optical components developer Solus Micro Technologies has opened a development facility in Bracknell.
2009-07-16 Soitec, IBM pioneer 22nm for 3D ICs
Soitec Group and IBM Corp. have teamed up to pioneer 22nm node silicon wafer substrate and bonding techniques that will enable wafer-level, 3D integration technology for next-generation ICs.
2005-11-11 Single chip serves as satellite front-end
The team at Silicon Laboratories developed the SiRX family of satellite front-ends
2002-04-29 Simplex purchase expands Cadence's technology trove
In announcing its intention to purchase Simplex Solutions, Cadence Design Systems has set its sights on some key EDA and silicon architecture technology
2010-06-21 Sematech welcomes Qualcomm as first fabless member
Qualcomm Inc. has joined chip-making consortium Sematech to gain an edge in next-generation technology, reportedly including 3D chips.
2003-02-21 SCP to acquire Mattson's wet products division
SCP Global Technologies Inc. has signed a purchase agreement to acquire the wet products division of Mattson Technology Inc.
2005-06-14 Sagantec updates 65nm, 45nm tool
Capable of supporting 65nm and 45nm technology design rules, the Sagantec Tool Set version 8 has been used to deliver 65nm silicon, and is now being used in an early 45nm engagement
2014-10-10 Rising costs drive chip companies to alternate routes
The low cost of capital is fuelling M&A across all industries, and the rising cost and complexity of making chips is pouring gas on the fire in semiconductors.
2014-07-24 Researchers embed InAs crystals into Si nanowires
The hybrid nanowires are produced by implantation and annealing, which are carried out using ion beam synthesis and heat treatment with xenon flash-lamps.
2011-04-26 Researchers doubt OPV's market potential
Citing OPV's inability to beat crystalline silicon on cost per watt, researchers predict developers will focus on niche applications where OPV provides other capabilities like transparency and flexibility
2013-03-04 Research: Magnetic materials control light at nanoscale
Researchers at the A*STAR Data Storage Institute, Singapore have created tiny spheres of silicon that can strongly interact with the magnetic field of visible-wavelength light
2012-10-25 Renesas shows next-gen MCU, MPU roadmap
The company announced plans to use the company's 40nm metal oxide nitride oxide silicon embedded flash technology with its RX family of high-performance, general-purpose 32bit MCUs
2014-06-18 Qualcomm advocates monolithic 3D adoption
The chipmaker appears to be making a concentrated effort to employ 3D integration technology to stretch out the semiconductor roadmap beyond the scaling trajectory predicted by Moore's Law
2014-03-25 Power trends take spotlight at APEC 2014
During this year's APEC, global players such as Fairchild, Intersil and Texas Instruments revealed their business plans and product offerings in anticipation of the power efficiencies demanded by next-generation electronic devices.
2007-10-18 Physical sensors drive MEMS consumerization wave (Part 1)
Benedetto Vigna notes that we are living today in the commercial era of MEMS Consumerization where microphones, motion and pressure sensors are the main actors. He believes this trend will continue for the next five years.
2005-11-08 PHY, digital core IP combo integrates HDMI in SoCs
Silicon Image unveiled a HDMI digital IP receiver and transmitter core with a companion PHY chip for MPEG SoC designs
2011-08-16 Photonic chip to replace electronic chips
Researchers at the California Institute of Technology and the University of California, San Diego have discovered a way to prevent light signals on a silicon chip from reflecting backwards and interfering with its operation
2005-06-02 Philips, Asus to deliver motherboard with TV reception
Royal Philips Electronics announced that Asus is using its advanced solution for analog TV to deliver motherboard with TV reception
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