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2002-08-20 Intel strengthens advanced chip-making process
Intel Corp.'s 90nm process has been strengthened even further with the integration of several technology breakthroughs
2006-10-25 Industry warms up to solar energy
Silicon Valley firms have set eyes and interest on solar energy, with Internet giant Google disclosing plans to run its headquarters on solar energy and other firms seeking ways to develop the alternative energy
2011-04-06 Industry pushes TSV-based 3D chips development
Amid fears that IC scaling is becoming too costly for chipmakers, the IC industry is working to develop TSV-based 3D chips, and stack and connect devices in a 3D configuration using TSVs.
2015-12-18 Imec reveals significant headway on 200mm GaN-on-Si tech
During the recent IEEE International Electron Devices Meeting 2015, Imec presented three novel AlGaN/gallium nitride (GaN) stacks featuring optimised low dispersion buffer designs.
2008-04-07 IC design looks promising for Romania
"I was surprised to find it less expensive to operate in Romania than in India, Malaysia or China," said Hugh Durdan, VP of marketing for eSilicon, a custom IC developer.
2002-04-04 IBM, Sony and Toshiba to co-develop advanced chip processes
In a deal that will move SOI and other advanced semiconductor process technologies into cost-sensitive consumer electronics ICs, IBM, Sony Corp., Sony Computer Entertainment Inc. and Toshiba have signed a four-year process technology development agreement.
2002-07-01 IBM technologist sees convergence of biology and IT
Nicholas N. Donofrio, senior vice president of technology and marketing at IBM Corp., told a group of IT professionals at TechXNY on Tuesday (June 25) to brush up on their biology if they expect to ride the next wave of technology innovation.
2012-11-01 IBM research opens path for smaller computer chips
The research demonstrates initial steps towards commercial fabrication of carbon nanotubes as a successor to silicon, leading to more powerful and smaller ICs
2009-12-17 IBM details 3D IC design challenges
IBM Corp. engineer John Knickerbocker offers five challenges for 3D devices based on TSVs.
2014-06-18 Hybrid circuit casts a spotlight on carbon nanotubes
The combination of carbon nanotube thin film transistors and other thin film transistors comprising indium, gallium and zinc oxide breeds circuits that can reduce power loss and increase efficiency.
2006-12-13 HDTV-on-a-chip promises simpler system
Broadcom Corp. announced a "television-on-a-chip" which it touts as the first digital HDTV silicon solution to support full 1,080-progressive display resolution
2005-10-31 GSM/GPRS monolithic radio integrates complete phone on one chip
Silicon Laboratories' AeroFONE Si4905 integrates a power management unit, battery interface and charging circuitry, digital baseband, analog baseband and a quad-band RF transceiver in a 12-by-12mm package
2004-04-28 Giga Scale tweaks IC prototyping
Giga Scale IC will announce its InCyte product family, which lets users estimate and optimize design objectives such as timing, area, power, leakage and yield.
2004-12-17 FS2 rolls out logic analyzer for Atmel products
FS2 and Atmel announced the availability of FS2's Logic Navigator System for embedded debug, trace, and logic analysis for Atmel's FPSLIC and FPGA products.
2006-11-01 Frontier, SigmaTel push for DAB in China
Frontier Silicon Ltd and SigmaTel Inc. are linking up to offer a combined digital audio broadcasting (DAB), FM and MP3 player platform for portable devices
2005-11-23 Front-end IC based on SiGe
Atmel released a new Silicon Germanium based front-end IC that features a wide operating frequency range of 300MHz to 500MHz
2005-02-11 Free chip estimation tool debuts online
Giga Scale Integration has launched a free online version of InCyte, its chip estimation tool
2011-10-28 FPGA boasts 6.8 billion transistors
Xilinx claims an industry-first with the most number of transistors for Virtex-7 2000T by using 2.5D IC stacking.
2005-10-06 Fluorine sweeps high-k defects out of the gate
Hafnium oxide, the anointed successor to silicon dioxide in the gate stack, has a new ally: fluorine
2013-01-28 Fit in large-capacity memory in advanced-node SoCs
Using large-capacity SRAMs can dramatically reduce leakage and deliver higher system performance while keeping mask costs in check.
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles.
2002-09-11 Entegris, Tru-Si partner on wafer handling initiative
Entegris Inc. and Tru-Si Technologies have formalized a nonexclusive open alliance to support thin silicon wafer handling in the semiconductor industry
2006-09-01 EDA app shows variants of IC design
DFM tool provider Aprio Technologies Inc. has developed an application extension, Halo-Quest, designed to fit on top of EDA design and analysis tools, and to generate accurate silicon image representation of IC designs for use within design flows
2011-01-17 DSP core touts audio performance, flexibility, broad codec support
CEVA's 1GHz CEVA-TL3211 extends CEVA-TeakLite-III DSP architecture. With HD audio features, this DSP targets digital TVs, STBs, mobile computing and smartphones.
2004-10-04 Dow Corning, INVINT partner in interconnect processes
Dow Corning Corp. has signed a joint development contract with INVINT Ltd, a conductive polymer interconnect technology specialist.
2003-09-15 Dow Corning sets up photonic solutions business
Dow Corning Corp. has launched a new photonic solutions business which takes the advantages of silicon-based materials into the optical domain for next-gen optical apps across multiple market sectors
2009-01-26 Dongfeng, Freescale to put up auto electronics lab in China
Dongfeng Motor Corp. and Freescale Semiconductor Inc. plan to establish a joint automotive electronics lab in China. The lab will be aimed at jointly developing silicon, software and system-level solutions to be used in next-generation Dongfeng Motor vehicles for the China and export markets
2008-06-13 Digital demodulator targets DVB-T market
Xceive Corp. has released the XC800 COFDM digital demodulator that features the company's direct digital interface.
2007-06-29 Development platform rolls for PXA3xx processors
Synopsys Inc.'s DesignWare VPXA3 Virtual Platform eases the development of smartphones, handheld and consumer electronics devices that use Marvell PXA3xx XScale technology application processor.
2005-09-09 Development kit makes good on digital design
Silicon Laboratories' development kit for its Si825x family of digital power controllers is a complete hardware and firmware development system that eliminates user-written software for implementing digital power supplies
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