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2003-07-25 Virage licenses IP to Silterra, SMIC
IP provider Virage Logic struck two licensing deals, saying it would transfer logic, memory and I/O technology to Silterra Malaysia Sdn. Bhd. and Semiconductor Mfg Int. Corp. in China.
2011-06-16 Silterra, ProMOS partner for advanced HV tech
ProMos' fabs in Taiwan will soon be ready to manufacture small-panel LCD driver ICs for smartphones using Silterra Malaysia's advanced 0.13?m and 0.11?m high-voltage (HV) process technology.
2004-07-02 Silterra, IMEC to develop 0.13?m process
Silterra Malaysia Sdn. Bhd. and the IMEC research center have agreed to create a foundry-compatible 0.13?m CMOS manufacturing process to be based on an IMEC's 0.13?m manufacturing process modified to meet foundry customers' requirements, Silterra said Tuesday (June 29, 2004).
2005-11-17 Silterra, Essensium target European market
Malaysian foundry Silterra and Belgium-based design firm Essensium announced a new partnership Tuesday (Nov. 15) that will see the two companies jointly develop turnkey solutions for European semiconductor customers.
2002-09-03 Silterra's RF process called compatible with TSMC's
Silterra Malaysia is ready to offer customers an RF and mixed-signal version of its baseline 0.185m process.
2003-02-19 Silterra standardizes on Mentor verification tool
Silterra Malaysia Sdn. Bhd has selected Mentor Graphics Corp.'s Calibre product as its internal standard for design rule checking, layout versus schematic, and optical and process correction functionalities.
2002-05-30 Silterra Malaysia, to increase output via $107M investment
Silterra Malaysia Sdn Bhd, a semiconductor-manufacturing foundry, will invest an additional $107 million in capital equipment.
2002-06-11 Silterra launches IP initiative
Silterra Malaysia Sdn Bhd has launched a silicon intellectual property initiative.
2002-08-30 Silterra introduces latest mixed-signal, RF technology
Semiconductor-manufacturing foundry Silterra Malaysia Sdn. Bhd. has launched its latest mixed-signal and RF technology, the CL180MR process.
2004-12-03 Silterra demonstrates 0.13?m 8Mbit SRAM
A joint development project between Silterra Malaysia Sdn. Bhd. and Europe's IMEC research center, has produced an 8Mbit SRAM fabricated in an all-copper, foundry-compatible 0.13?m CMOS manufacturing process.
2004-12-02 Silterra demonstrates 0.13?m 8Mb SRAM
A joint project between Silterra and IMEC research center has produced an 8Mb SRAM fabricated in an all-copper, foundry-compatible 0.13?m CMOS manufacturing process.
2005-01-19 Silterra adopts HPL IP to speed 0.13?m CMOS process
Silterra Malaysia Sdn. Bhd and HPL Technologies Inc. revealed that their collaborative work has been instrumental in reducing the development and debug time for Silterra's new 0.13?m CMOS process technology.
2002-10-29 Silterra acquires Brooks-PRI equipment for fab expansion
Malaysian foundry Silterra Malaysia Sdn. Bhd. has purchased additional automation equipment from Brooks-PRI Automation Inc. for Silterra's planned capacity expansion of its fab manufacturing IC chips on eight-inch wafers.
2013-11-22 MTP memory qualified for SilTerra's 110nm high voltage tech
SilTerra Malaysia and Chip Memory Technology released the Multiple-Time-Programming (MTP) embedded non-volatile memory solution for SilTerra's advanced 110nm high voltage technology.
2007-10-05 Malaysian telco aids Silterra on 90/65nm chip production
Foundry Silterra has signed an agreement with the R&D arm of Malaysia's largest communications provider Telekom Malaysia to assist in its drive to lower process-technology nodes.
2006-05-25 Key ASIC, Silterra partner on design-to-manufacture services
Key ASIC and Silterra Malaysia announced their partnership to offer streamlined design-to-manufacture services for ASICs in the mobile and consumer electronics markets.
2006-08-28 eMemory, Silterra extend semicon collaboration
eMemory has verified its Neobit one-time-programmable memory on Silterra's 0.18m CL180G and CL180H CMOS process technologies.
2002-12-16 ARM, ParthusCeva, Unive, strengthens Silterra IP Portfolio
Silterra Malaysia Sdn. Bhd. has joined the ARM Foundry Program, giving the company access to the ARM7TDMI core.
2006-04-18 Malaysian foundry increases production capacity by 20%
Silterra Malaysia has increased the production capacity of its manufacturing fab by 20 percent to 33,500 wafer starts per month.
2006-08-23 Asian electronics address possible talent shortage in region
Threatened by the possible shortage of engineering talent in Asia, chip makers are taking matters into their own hands by partnering with governments and universities to groom future talent.
2007-10-17 Malaysian fab invests $100M for capacity expansion
Malaysian foundry Silterra has invested $100 million for phase 1 of its the capacity expansion plan for its existing 200mm fab.
2005-09-30 Malaysia foundry, Taiwan design house team up
Taiwan Silterra Malaysia Sdn. Bhd and Goyatek have entered into an agreement to jointly develop and support fabless semiconductor customers worldwide.
2008-08-25 Device controls mobile displays
With an eye on the consumer electronics market, particularly higher-resolution displays for smartphones, silicon foundry provider Silterra Malaysia is promoting its 0.13?m high-voltage technology.
2002-12-13 ARM program extends to Asia-Pacific region
Anam Semiconductor and Silterra Malaysia Sdn. Bhd. have joined ARM Ltd's Foundry Program.
2012-03-26 130nm CMOS logic backend tech unleashed
SilTerra Malaysia released the CL130AL that offers single poly up to six layers of aluminum metallization, borderless contacts and via with USG inter-metal dielectric.
2009-03-27 110nm CMOS squeezes extra die per wafer
Silterra Malaysia Sdn. Bhd. has debuted a foundry-compatible copper-based 110nm CMOS logic process technology. Codenamed CL110G, the technology offers a 10 percent optical shrink for the copper-based 130nm and enables customers to squeeze extra die per wafer.
2007-07-02 Web compiler supports embedded memory IP
Seeking to reduce the cost and cycle times of IC designs, Novelics Inc. will roll a Web-based compiler technology that supports its line of intellectual property cores for embedded memory applications.
2009-10-08 Specialty foundries seek new growth opportunities
Gearing for the next IC upturnand perhaps survival over the long runspecial foundry providers are rolling out new strategies and processes.
2007-06-20 Russia cooks up 300mm wafer fab plans
Russia is collaborating with a party known only as the "Kedah Group" to construct a 300mm wafer fab at the city of Nizhny Novgorod.
2009-06-24 Palmchip plans to break innovation barrier
After three years of non-compete, Palmchip Corp. has come out into the open with announcements that aim to stir design activity and to "stimulate the economy."
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