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2008-10-22 High-current connector enhances overload capacity
Tyco has released a new single-pole high current circular connector for industrial applications, e.g. spindle motors.
2011-03-23 HEMS a $2 billion business by 2016
Home energy management systems will achieve moderate growth until 2013; but will see rapidly increasing global shipments by 2014, with utilities as the largest channel for HEMS going to market.
2002-03-18 HEM introduces lead-free solder for power packages
Honeywell Electronic Materials has announced the development of the Bi-Ag lead-free solder for die attach in power packages.
2006-10-06 Heard on the grapevine: private equity firms eyeing Cypress
Rumors are circulating that private equity firms are talking to Cypress about a leveraged buyout.
2015-04-28 Guide for better PCB fabrication: Tools you need to know
In this roundup, we feature some of the prominent methods of making your own circuit boards that will help to alleviate some of the issues that entail the manufacturing process.
2006-07-17 Green engineering challenges reliability, logistics
Chip makers began transitioning to Pb-free finishes and "green" packaging years ago, prompted largely by the European Union's clampdown on six substancesincluding leadin electronics equipment. Eliminating lead has significantly affected the electronics industry.
2015-03-19 Grasping capacitors, ripple and self-heating
Ripple can be a necessary design function, and the considerations can be quite straightforward. In this article, we will take a look at ripple ratingsor how to cook a capacitor.
2012-12-05 Graphene market to rake in $100M by 2018
IDTechEx forecasts that the graphene industry is set to reach the $100 million mark by 2018 with the R&D sector as its main market driver.
2003-06-25 Good-Ark bridge rectifier has 50A overload rating
Suzhou Good-Ark Electronic Co. Ltd has released the 2W005 bridge rectifier that has a peak overload rating of 50A.
2007-10-01 Good strategies for a low-power resistive touchscreen
Engineers are increasingly designing touchscreens into portable devices. This article discusses the construction of a resistive touchscreen panel and the inner workings of a typical four-wire resistive screen. It also discusses some hardware low-power strategies.
2011-10-24 Glass improves lab-on-chip manufacturing
MIT researchers have developed an engraving technique that claims to be more precise than nanoimprint lithography.
2010-08-23 Glass board tests laser weapon energy
Researchers have developed a system to measure a laser's power and spatial energy distribution simultaneously by directing the laser beam onto a glass target board.
2006-08-09 Funding on nanotech projects down, says report
The amount of money venture capital firms provided to MEMS and Nanotech companies combined in the first half of 2006 is reportedly down by 15.4 percent compared to the first half of 2005.
2003-03-03 Fujitsu power relays shrink in size, power draw
Fujitsu Components America Inc.'s high-performance relay offers a 31 percent height reduction and 8 percent lower power consumption for PLC apps.
2012-07-05 FT-CAPs ideal for harsh environment apps
New dielectrics from Kemet offer capacitance stability up to 150C.
2013-10-07 Fraunhofer team finds way to mass produce lab-on-chips
LOCs, or pocket labs, can automatically perform a complete analysis of even the tiniest liquid samples, integrating all the required functions onto a chip that's just a few centimeters long.
2009-01-21 FPI gaskets deliver improved features
Laird Technologies Inc. has released a the EMI SENTRY family of Form-In-Place (FIP) gaskets that consists of four specially-designed, silicone-based pastes for dispensing onto a substrate.
2003-01-07 Forward miniature relays offer high shock resistance
The FRA 11D and FRA 11DS miniature relays can withstand a shock or 30g for up to 6ms and a vibration resistance of 6g.
2010-02-04 Forum addresses smart grid roadblocks
A panel at the Grid ComForum noted that engineers will face plenty of challenges enabling smart grids in the home and in utility distribution networks.
2006-08-16 For carriers, IPTV poses new challenges
The flexibility of IP delivery will make traditional RF broadcasting a thing of the past. But even as operators tackle the technical challenges that IPTV presents, they are entering a whole new world of content choices.
2011-04-29 Fluid dispenser offer .025mm accuracy
GPD Global introduces the MAX Series Dispensing Systems that are designed for high accuracy and repeatability applications.
2009-07-20 Flexible slide switches tailored for mobile apps
C&K Components has unveiled the OS series of compact two-position slide switches that feature flexible design for easy integration into standard and custom mobile communication devices.
2014-02-19 Flexible piezoelectric fibres generate 2x power output
Knitted together to form a 3D fabric, piezoelectric fibres can generate electricity by harnessing the energy created by an impact or movement, converting it into electrical power.
2010-11-09 Flash lamp-based sintering process wins patent
U.S. patent office grants NovaCentrix patent for flash lamp sintering of metal-based inks and materials
2010-03-26 Firms join hands to bring smart grid to consumers
Consumer electronics and technology companies, retailers and consumer advocacy groups, have formed the Smart Grid Consumer Collaborative to build consumer acceptance and use of the smart grid.
2005-07-13 Filters survive high temp processes
Syfer Technology offers a wide range of solder-mount feedthrough EMI filters that are fully compliant to the European Union's RoHS Directive and will withstand the higher soldering temperatures of lead-replacement materials.
2005-07-19 Few care about mobile video, survey finds
Few mobile subscribers have any interest in receiving video on their phones, according to a survey released Monday (July 18) by market research firm In-Stat.
2008-09-10 FastSoft TCP accelerator targets carrier systems
FastSoft Inc. will embed the FastTCP flow-control software in a 1Gbit/s platform, E 1000, intended for carrier and content-delivery markets.
2003-07-18 Fairchild turns to lead-free finish packages
Fairchild Semiconductor has announced that they have initiated conversion of all products to lead-free finish packages.
2011-03-28 Factors that influence side-wetting performance on IC terminals
Here's a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting.
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