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2004-04-13 Toshiba rolls out first 4Gb single-die MLC NAND flash unit
Toshiba has disclosed that it has introduced the semiconductor industry's first 4Gb single-die, multi-level cell, NAND flash memory.
2007-04-10 Spansion bundles NOR, ORNAND, Quad on a die
Spansion plans to combine its MirrorBit NOR, ORNAND and Quad flash memory on a single die, making it the latest flash memory player to rethink its architecture in an effort to offer handset designers a one-stop-shop approach to choosing a memory subsystem.
2015-08-27 Small RF filters handle multiple bands in single die
RF filter specialist Resonant claims to have developed multi-band techniques that allow two or three filters to share the same die, as well as creating tunable models that can change their frequency
2008-10-17 Single-chip DSP integrates three 1GHz cores
Texas Instruments Inc. has developed a new high performance multicore DSP that offers significant cost, power and board space savings.
2012-05-07 Single-chip drivers LIN-ready for BLDC motors, actuators
Melexis' new family of driver ICs claim highly efficient BLDC motor control from a single IC by combining the voltage regulator, LIN-transceiver, MCU, EEPROM, Flash, RAM and power FET pre-driver
2013-06-28 Silicon Labs touts single-die alternative to quartz crystals
Silicon Labs joins the scalability and economy of CMOS and the stability of MEMS in its patented single-chip MEMS oscillator, dubbed CMEMS
2011-02-16 Silicon die integrates Wi-Fi, Bluetooth
Atheros's XSPAN AR9462 combo solution integrates 2-stream, dual-band 802.11n and Bluetooth 4.0 technologies onto a single die.
2013-08-28 Is a single-chip SoC processor what you need
Find out when, where and why embedded developers should consider a single-chip SoC processor as alternative to a general-purpose microcontroller
2012-10-04 French company plans 1024 high-end DSP cores on single die
Kalray has recently sampled a Purpose Processor Array MPPA-256 processor integrates 256 processors onto a single silicon chip and is planning a 1024 processor version
2011-11-16 Embedded die tech-based 3D package unveiled
ChipletT and ChipsetT enable packaging in the sub-250?m range, up to 50 percent less than alternative embedded die solutions, the companies claimed
2015-03-05 Embedded die in substrate shows promise in processing tech
Yole Dveloppement revealed that embedding die in laminate substrates is a promising packaging principle, but it has to overcome several challenges, which include the supply chain
2005-05-12 Anadigics reveals HBTs, pHEMTs process on single InGaP GaAs die
Anadigics Inc. has unveiled its proprietary, patent pending, commercial process for integrating heterojunction bipolar transistors (HBTs) with psuedomorphic high electron mobility transistors (pHEMTs) on a single indium gallium phosphide (InGaP) gallium arsenide (GaAs) die.
2010-10-13 802.11n 4x4 single-die solution targets enterprise, home apps
Marvell introduced its Avastar 88W8764, a pioneer in 802.11n, 4x4 single-die solution for enterprise access points, service provider gateways, high performance home routers, media and mobile servers, Digital TVs, and set-top boxes (STBs).
2007-12-04 Universal GPS, Galileo RFIC comes in tested die
Maxim Integrated Products has introduced the MAX2769E/W, claimed to be the industry's first universal GNSS receiver for GPS, WAAS, Egnos, Galileo and Glonass navigation satellite systems in a single tested die.
2012-07-26 Techniques, procedures for die bonding
Here's a look at various techniques for die bonding, a process of connecting die to the package for communication to the outside world
2004-11-26 Solomon Systech introduces single-chip TFT-LCD driver IC
Hong Kong-based Solomon Systech Ltd recently announced that it has released its first single-chip TFT-LCD driver IC -- SSD1278 -- suitable for smart phone systems
2011-06-23 Single-chip MCU targets automotive apps
Freescale Semiconductor introduces the S12VR64, a single-chip, mixed-signal MCU designed for use in DC motors for automotive window lift and sunroof applications
2007-10-30 Single-chip bistable display driver provides flexible waveforms
Solomon Systech has released SSD1623 single-chip integrated driver with controller, allowing the output waveform to be set to drive different displays
2003-06-18 Silicon Wave Bluetooth die provides high-density integration
Silicon Wave's UltimateBlue 3000 radio processor and the SiW1712 radio modem are available as standalone bare die products
2011-05-11 Sensor signal conditioner enables single IC apps
ZMDI unveils a sensor signal conditioner with integrated LIN transceiver that enables the development of a complete sensor application with a single IC and helps save component costs and board space
2008-02-28 SecurID fob provides single-chip safety net
The SecurID generates a new code every 60s over the fob's lifetime, with the host-side solution synchronously calculating this moving target to stay in lockstep with the token.
2005-01-18 Samsung announces 'first eight-die MCP technology
Samsung has developed what it touts as the world's first eight-die MCP technology, designed for use in high capacity mobile devices
2001-04-15 Same-die tactic eases DDR transition
The industry consensus is clear: DDR's time has come. Now what design issues must engineers consider, and what can DRAM suppliers do to make this memory transition happen smoothly and seamlessly?
2011-08-29 Placement system touts high-speed die bonding
Single machine solution eases IC manufacturing with die bonding speeds at 3,500cph per head at 25?m.
2005-09-16 Mimix's new GaAs amp with self-biased, single supply design
Mimix Broadband introduced a GaAs two-stage low noise gain block amplifier that has a self-biased, single supply design
2002-04-22 Ismeca tape-and-reel machine system determines KGD via single test
The MP 630 tape-and-reel machine from Ismeca Europe SA is claimed to be first integrated testing, marking, and handling system capable of determining known good die (KDG) packages through a single test.
2006-08-03 Freescale cuts die area, thickness with new chip packaging tech
Freescale's proprietary redistributed chip packaging technique delivers about a 30 percent reduction in packaged-die area and thickness
2007-05-01 Design a single-chip, six-band UMTS transceiver for global connectivity
Find out what you need to design a truly global phone with full wireless connectivity.
2000-03-10 CSP die shrink solution for memory devices
This application note shows the effectiveness of die shrink as a package solution for memory devices. In the case of the 8-by-10mm Direct Rambus DRAM device, about 350 dies can be obtained from a single 203.2mm wafer. The 85 percent linear shrink allows an addition of 150 dice from the same size wafer.
2003-09-11 Broadcom ships single-chip Wi-Fi solution
Broadcom Corp. has announced that it is shipping what it claims to be the world's first single-chip Wi-Fi solution
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