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2006-11-27 Intersil battery charger accepts two power inputs
Intersil's single-cell Li-ion or Li-polymer battery charger accepts two power inputs, normally one from a USB port and another from a desktop cradle
2014-05-14 Intel sets sights on a foundry goal for innovation
The chip giant has been raising the profile of its foundry business over the last year, mainly in pursuit of growth and profit. It has also expanded its deal with Altera to produce multi-die devices
2004-12-21 Intel 65nm process moves forward
Intel Corp. showed die photos of two microprocessors made with its 65nm process Wednesday (Dec. 15) on the final day of the International Electron Devices Meeting, including a dual-core processor believed to be the mobile processor codenamed Yonah
2005-02-22 Infineon's memory strategy: invest during downturn
Executives of Infineon Technologies' North America operations said its plan to ramp up a new 300mm fab here is part of a simple strategy: bigger wafers, smaller die size, maximum capacity utilization and continuing investment in its memory technology during a downturn
2004-07-09 Infineon RF transistors deliver reduced memory effect
Infineon announced the next generation of its GOLDMOS LDMOS die technology for high-performance, high-power RF transistors
2013-01-24 Imec, Cadence team up for DFT solution for 3D memory
Cadence's and imec's solution includes generation of DRAM test control signals in the logic die and inclusion of the DRAM boundary scan registers test access mechanisms of the 3D test architecture
2010-04-23 IC firms join hands to drive Pb-free solutions
Five IC firms have formed the DA5 consortium to investigate and standardize the acceptance of alternatives for high-lead solder for attaching die to semiconductor packages during manufacturing
2012-08-27 HotRail Assembly machine supports RF power amps
The HotRail radio frequency assembly cell from Palomar Technologies is a fully automatic, high-accuracy system that provides heat profile vs. time eutectic reflow on a single, large work area build site
2005-04-20 High-power amp IC boosts signals for military, communications apps
Mimix Broadband introduced a GaAs MMIC two-stage, single ended, X-band high power amplifier, which integrates an on-chip gate bias circuit to simplify biasing
2008-10-22 High-current connector enhances overload capacity
Tyco has released a new single-pole high current circular connector for industrial applications, e.g. spindle motors
2009-01-14 High-brightness LED touts low thermal resistance
Optek Technology has developed a star-shaped red/green/blue/amber LED assembly by integrating four 1W LED die into a single assembly for solid-state lighting applications.
2007-07-02 GNSS receiver achieves cascaded NF of 1.4dB
Maxim Integrated Products introduces the MAX2769, the industry's first universal, single-chip global navigation satellite system receiver for GPS with total cascaded NF of 1.4dB
2015-04-07 Future of 3D SoCs: Adding unlimited layers sans TSVs
The future of three-dimensional (3D) very large scale integration (VLSI) for system-on-chips (SoCs) will not stack die connected by through-silicon-vias (TSVs), but will build them on a single layered die, according to Qualcomm.
2007-08-21 Four-channel LIN transceiver lowers system costs
The MLX80001 LIN transceiver from Melexis can significantly reduce system costs of the LIN PHY by 20 percent compared to multiple single transceiver ICs
2008-05-30 ESBT power switch extends voltage rating
STMicroelectronics has introduced the STC03DE220HV ESBT power switch, which enables engineers to improve efficiency, cost, component count and size in auxiliary switched-mode power supplies for single- and three-phase applications
2007-11-06 EEPROM-configurable system monitors suit high-end apps
Maxim has introduced EEPROM-based system monitors with non-volatile fault memory targeted at high-end systems where a large number of voltage rails exist in a single system
2016-03-08 Developments in MEMS integration
Learn about the advances in MEMS industry aimed at tackling the integration challenges head on at the package, wafer and die levels
2013-09-25 Design Linux-based femtocell base-station (Part 1)
Here's the first of a two-part series on how to build a wireless femtocell using a single chip base-station SoC and a Linux-based fast-path architecture
2005-01-13 Demodulator enables TV receivers to be 'digital cable ready'
ST unveiled a single-chip, fully integrated digital demodulator that is designed to be the front-end device in advanced interactive cable-ready digital TV receivers and in terrestrial and cable STBs in the U.S
2010-12-23 DB-LSA targets logic devices
Ultratech's latest dual-beam laser spike anneal system offers within-die uniformity, layout-independent process results, and closed-loop wafer temperature control
2008-06-04 Cypress touts simplified laser navigation system
Cypress has launched its second-generation laser navigation system, claiming it is the first to integrate a laser navigation sensor and programmable flash-based microcontroller on one die, which will ease mouse design and manufacturing processes
2005-12-02 Controllers meet power requirements of Intel, AMD CPUs
Maxim Integrated Products released single-chip 2-/3-/4-phase controllers with integrated dual driver, designed specifically for next-generation Intel and AMD core power requirements
2005-07-19 CMOS IC acts as analog front end
ProTek Analog released a mixed-signal CMOS monolithic device that integrates analog-to-digital converter conversion operations on a single chip
2005-06-21 Charger IC targets portable apps
Accepting power inputs from the USB port or desktop cradle/AC adapter, the ISL6299 advanced high voltage dual-input battery charger IC from Intersil is designed for single-cell Li-ion/polymer apps
2008-12-03 Charger IC handles concurrent system load, charging
Advanced Analogic Technologies Inc. has released the AAT3672, a highly integrated, single-cell Li-on/polymer battery charger and system management IC that enables simultaneous battery charging and system load management
2004-03-16 Cellphones suck up the chips
Cellphones have become the single largest market for processor silicon and also the largest market for RISC cores
2004-03-16 Cellphones suck up the chips
Cellphones have become the single largest market for processor silicon and also the largest market for RISC cores
2004-10-27 Cal Berkeley dean predicts server-farm-on-a-chip
Software configurable processors arranged in a sea-of processor configuration on silicon will soon enable designers to put a server farm worth of compute power on a single IC, said U.C. Berkeley's Dean of the College of Engineering Richard Newton in his keynote at the Synopsys EDA Interoperability Developers forum here Thursday (Oct. 21
2001-05-01 Cadence's 'all-in-one' tool gets skeptic reviews
Cadence's Integration Ensemble (IE) is the first single tool that can take a hierarchical chip design all the way from synthesizable RTL code through a GDSII layout file and designers are raising an eyebrow if it will perform as well as it promises
2007-10-17 Broadcom packs key 3G technologies in one chip
Broadcom has announced a new single-chip HSPA processor that integrates all key 3G cellular and mobile technologies on a single low-power 65nm CMOS die.
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