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2007-09-28 Broadcom 802.11n chip integrates power amp
Broadcom has started sampling a single chip 802.11n compliant device that is being made in a 65nm CMOS process and integrates the power amplifier on chip
2012-06-07 Bluetooth controller targets ultralow-power wireless sensing apps
EM Microelectronic's EM9301 Bluetooth smart-qualified controller runs on as little as 0.8V, powered by a wide range of common single-cell batteries or energy harvesters
2014-01-22 Besi, Imec partner on thermocompression for 3D IC bonding
Imec and Besi have announced that they are collaborating to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput
2007-01-16 Benefits of thermally aware design
Rajit Chandra shows how thermally-aware design can improve the accuracy of current design tools and flows, specifically by including the distribution of temperature on the die
2006-04-06 Audio codec targets MP3, WMA players
Atmel announced the availability of the AT85C51SND3 single-chip audio codec for high-volume markets
2005-09-29 Atmel RFID chip suits LF apps
The new ATA5558 from Atmel is a contactless Read/Write (R/W) RFID device for multi- or single-tag applications in the low frequency range
2011-05-30 Alternator regulator goes fully-integrated
Freescale Semiconductor has released the single-chip alternator regulator TC80310 that offers improved control and energy use
2006-06-22 Aehr Test's wafer tester is ready for production
Aehr Test Systems announced its FOX-1 full wafer, single touchdown parallel tester is ready for high-volume manufacturing
2005-06-14 Aehr Test rolls out new wafer tester
Aehr Test's new FOX-1 full wafer contact test and burn-in system is focused on testing an entire wafer of devices with a single touchdown or for short-duration burn-in and test
2008-06-03 Advanced GPS devices roll from Atheros
Atheros Communications' newest ROCm GPS solution consists of its second-generation, single-chip GPS receiver, the AR1511, and companion ORION 3.0 software suite
2007-02-07 65nm SoC combines Wi-Fi, Bluetooth, FM techs
Using 65nm process technology, Broadcom is producing a low-power SoC that combines Wi-Fi, Bluetooth and FM receiver technologies onto a single silicon die, allowing OEMs to drive these wireless technologies into more handset platforms.
2010-08-13 32nm DDR toggle mode NAND features faster interface
The device is offered in multi-level cell versions with densities of 64-, 128- and 256Gb; and single-level cell versions with densities of 32-, 64- and 128Gb
2006-02-15 2MP CameraChip integrates AF control
OmniVision unveiled the OV2645, which it touts as the world's first 1/4-inch, 2 Megapixel CameraChip with fully integrated autofocus (AF) control on a single chip
2005-11-02 1Gb NOR flash memory device based on 90nm MirrorBit tech
Spansion LLC announced their sampling of the world's first single-chip 1Gb NOR flash memory device in the embedded market
2010-04-15 16-/2Kbit EEPROMs come in miniature WLCSP
Microchip Technology Inc. is rolling out its single-I/O bus UNI/O EEPROM devices in miniature, WLCSP and TO-92 packages, in addition to the 3-pin SOT-23 package
2009-09-23 10G transceiver packs diagnostic reporting
Phyworks has begun sampling a single-chip transceiver in CMOS that integrates a temperature sensor and diagnostic reporting
2015-03-24 1.5A low dropout linear regulator aimed at industrial apps
Linear Tech's the LT3081's precision 50μA reference current source allows a single resistor to program output voltage to any level between zero and 34.5V
2009-05-07 'First' red-green-blue-white multichip LED debuts
Cree Inc. has expanded its high-power color LED product offerings with what it claims is the first multichip MC-E LED with red, green, blue and white chipsall in a single package
2008-08-20 The MIPS32 34K core family: powering next-generation embedded SoCs
A new multi-threading implementation of the MIPS architecture provides significant performance improvements with only a minimal increase in die size while leveraging existing software infrastructure
2014-05-08 POET integrates electronic, optical elements in one chip
The Planar Opto Electronic Technology (POET) platform is semiconductor fabrication process that uses gallium arsenide technology to combine electronic and optical elements on a single integrated circuit
2008-06-06 XO-1 teardown reveals why they can't sell for $100
The OLPC XO-1's displays, batteries, CPUs, fancy enclosures and the rest all add up to a BOM that sits uncomfortably far from the $100 target.
2011-06-02 WiFi, Bluetooth combo chip reduces power consumption
Broadcom announced its first 40nm Wi-Fi and Bluetooth combo chip for notebook and netbook that reduces chip size, module cost and power consumption.
2008-02-08 Wi-Fi, WiMAX soon to invade handsets
An afternoon session on wireless networks at the ISSCC concluded that cost of the latest Wi-Fi and Bluetooth links are going down, and WiMAX will soon find its way to cellphones.
2014-12-18 What's hot at IEDM 2014?
The 2014 International Electron Devices Meeting proved that Moore's Law is still alive. The event was a victory lap for Intel, which gave more details on the 14nm finFET process.
2011-02-01 Updated AMD APP now available
AMD has launched an updated AMD Accelerated Parallel Processing (APP) Software Development Kit (SDK) ver 2.3 with full support for the first AMD Fusion Accelerated Processing Units (APUs), OpenCL 1.1 and AMD Radeon HD 6900 Series graphics.
2005-01-14 TSMC validates 90nm process using Mentor Graphics Calibre xRC
Mentor Graphics Corp. disclosed that Taiwan Semiconductor Corp. (TSMC) used a comparison of Calibre xRC results, field solver data and silicon measurements as part of the validation for its 90nm process technology.
2012-05-07 TowerJazz brings CMOS imaging fab tech to CA
TowerJazz has transferred its CMOS image sensor (CIS) technology from its Israel facility to a fab in California to meet its customers' manufacturing requirements.
2006-01-30 TI completes Chipcon acquisition
Texas Instruments has completed its previously announced acquisition of Chipcon, a company that designs short-range, low-power wireless RF transceiver devices.
2002-11-05 Thinner, brighter LEDs shine for PDAs
Two LED lines from Sharp Microelectronics of the Americas tout advances in package sizes, luminosity, and color reproducibility.
2014-03-27 The move to 100A at POL and beyond
While current demand is beginning to exceed the 100A level at the point of load, adopting a SEPIC-fed buck topology could prove useful in improving power conversion efficiency and transient response.
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