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2004-01-28 Toshiba, Sonics team in SMART interconnect IP products
Toshiba Corp. and Sonics Inc. have expanded their business relationship with a joint technology collaboration.
2003-04-25 Toshiba SoCs to use Sonics interconnect technology
Toshiba Corp. has entered into a corporate-wide contract with Sonics Inc. enabling Toshiba to use Sonics SMART Interconnect IP as an interconnect technology in its SoCs.
2003-02-26 Hitachi-IT licenses Sonics interconnect IP solutions
Sonics Inc., Hitachi Information Technology Co. Ltd, and Innotech Corp. have announced a business partnership and the licensing of the latter's SMART Interconnect IP solutions for use in complex SoC designs by Hitachi-IT.
2005-09-27 Staktek, SMART ink licensing pact for ArctiCore, stacking tech
Staktek Holdings Inc. and SMART Modular Technologies Inc. have signed a license agreement that provides SMART with access to Staktek's latest ArctiCore module technology, as well as Staktek's Value Stakpak, Performance Stakpak and High Performance Stakpak package stacking technologies
2015-01-29 SMART Modular develops first DDR4 Mini-DIMMs
SMART Modular Technologies, in partnership with Molex, plans to release Mini-DIMMs that will use a DDR4 vertical-mount 288-pin socket with secure latches
2009-11-11 Smart card connectors offer high-temp thermoplastics
The smart card connectors are suitable for use in transaction, identification and point-of-sale applications
2012-05-24 On-ground molded interconnect antenna touts tiny footprint
Molex's 2.4GHz SMD on-ground antenna weighs in at only 0.03g measuring 3 x 3 x 4mm for tablets, headsets, smart meters and other portable electronic devices running Bluetooth, WiFi, ZigBee and other wireless standards
2008-07-04 Interconnect links processing, memory channels
Sonics Inc. rolls out a new chip-level interconnect technology, addressing what it says is a growing memory bandwidth problem faced by a broad range of people who develop video processors
2015-07-06 Google enters smart home market with another standard
In addition to the existing standards aimed at smart homes, Google Brillo joins the likes of Qualcomm AllJoin, Apple Home Kit and Intel IoTivity to battle it out in the lucrative space
2005-01-05 ERNI selects E-SMART to offer connector line in Asia
ERNI has appointed E-SMART as its new additional distributor in Singapore, Malaysia and Thailand
2010-06-01 Engineers push smart grid spec by next year
Engineers target to deliver within a year a broad suite of standards needed to build smart electric grids, reporting stepwise progress at the end of Connectivity Week
2004-10-04 Dow Corning, INVINT partner in interconnect processes
Dow Corning Corp. has signed a joint development contract with INVINT Ltd, a conductive polymer interconnect technology specialist
2006-09-15 Cypress unrolls connectivity chips for 3G smart phones
Cypress said its More Battery Life (MoBL) dual ports integrate an address/data multiplexed (ADM) interface for next-generation smart phones
2015-08-05 CoolCube 3D interconnect targets FinFET process
The research institute demonstrated the feasibility of CoolCube used to stack FinFET layers on its 300mm production line as well as with fully-depleted silicon-on-insulator manufacturing processes.
2012-11-12 Benefits of rugged components in smart meter apps
There is a growing need for smart meter applications to integrate only the most rugged available components
2014-11-03 Adding 'smart' to Asia's power grid
The installation of modern electronics to assist in better generation, delivery and consumption of electrical energy is picking up within the region, promising to prevent power outages, conserve energy and support green undertakings.
2013-10-29 Design an efficient, smart thermal mgmt system
Build a thermal management system with fewer ICs while reducing the customisation needed.
2005-02-07 Toshiba adopts SonicsMX handheld chips
Toshiba Corp. will design the SonicsMX and Sonics3220 SMART interconnects into its family of wireless handheld products
2004-04-22 Sonics, CoWare to speed up complex SoC development
SoC provider Sonics Inc.'s Smart Interconnect IP products and CoWare Inc. have entered into a long-term strategic partnership to speed the development of complex SoCs.
2006-06-09 SoC tools promise seamless SystemC-to-RTL design flow
Sonics' latest SonicsMX Smart Interconnect and SonicsStudio promise a seamless SystemC-to-RTL design flow that provides consistent SystemC or RTL versions of specific SonicsMX configurations.
2004-05-07 MIPS, Sonics unveil joint digital multimedia SOC solution
MIPS Technologies Inc. and Sonics Inc. have joined forces in combining a 32-bit processor and SMART interconnect IP to dramatically cut the development time of cost-effective SOCs for digital multimedia applications, such as digital set-top boxes and digital TV receivers.
2002-07-30 Vendors push for backplane interface spec
Transceiver and connector vendors unite to find a way to operate below the layer of competing bus and interconnect efforts such as HyperTransport and RapidIO
2013-11-07 Rockchip gains licences to ARM processor, GPU tech
The agreement gives Rockchip access to ARMv8-A and ARMv7 processors including the ARM Cortex-A57, Cortex-A53 and Cortex-A12 processors, the ARM Mali GPU family and ARM CoreLink technology.
2005-09-01 Packaging becomes problem-solving tool
Package technology provides improved electrical and thermal performance for today's single-die power products.
2011-10-14 MEMS production uses TSV
The ST-patented TSV technology claims to offer space savings and higher interconnect density than wire bonding or flip chip stacking
2012-12-24 LIN transceiver optimised for minimal current usage
Melexis' MLX80050 is produced using a 0.35?m HV-CMOS process technology and draws only 15?A in standby mode.
2008-02-11 Less than $1 investment for high-speed USB
With the release of an integrated product from SMSC, the cost of putting high-speed USB into a product drops to less than $1.
2014-12-11 Intel unveils software for IoT apps
The effort echoes a more general offering Intel created for embedded systems in 2012. It comes amid a growing diversity of options in IoT components, software and services.
2010-09-17 Intel debuts 'Tunnel Creek' SoC
New Intel SoC for embedded systems launched at IDF
2015-05-25 Huawei details everything-connected roadmap
For most Chinese high-tech companies, whether it is a wearable start-up, a smartphone vendor or an Internet giant, the whole of China is their whole oyster. Not so for Huawei.
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