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2010-07-26 Virage, SMIC extend partnership to 40nm
Virage Logic Corp. and Semiconductor Manufacturing International Corp.have extended their partnership to the 40nm low-leakage (LL) process technology.
2003-07-25 Virage licenses IP to Silterra, SMIC
IP provider Virage Logic struck two licensing deals, saying it would transfer logic, memory and I/O technology to Silterra Malaysia Sdn. Bhd. and Semiconductor Mfg Int. Corp. in China.
2002-08-27 VeriSilicon platform optimized for SMIC CMOS process
VeriSilicon Microelectronics Co. Ltd has released the Standard Design Platform optimized specifically for Semiconductor Mfg Int. Corp.'s 0.185m CMOS process.
2002-08-12 VeriSilicon develops platform for SMIC CMOS process
VeriSilicon Microelectronics Co. Ltd has released the Standard Design Platform engineered specifically for Semiconductor Mfg Int. Corp.'s 0.185m CMOS process.
2006-03-21 UTAC, SMIC launch Chengdu joint venture
UTAC and SMIC announced at an opening ceremony for their joint assembly and test facility that the factory has already moved into the pilot production phase.
2006-12-14 UTAC, SMIC joint fab to break-even next year
The joint venture of United Test and Assembly Center and Semiconductor Manufacturing International Corp. in Chengdu, China is projected to register a break-even next year.
2007-09-18 U.S. court issues preliminary injunction against SMIC
TSMC announced that the California State Superior Court of Alameda County has issued an order on TSMC's pre-trial motion for a preliminary injunction against SMIC.
2006-12-04 TSMC, SMIC increase flash efforts
TSMC and SMIC are reportedly increasing their efforts to raise their flash memory market shares.
2006-08-30 TSMC files patent, trade secret suit against SMIC
Silicon foundry TSMC has once again filed a patent and trade secret suit against archrival SMIC for "breach of an agreement" over a settlement in a patent suit filed back in 2005.
2003-01-14 Toshiba to transfer SRAM process technology to SMIC
Semiconductor Mfg Int. Corp. and Toshiba Corp. have jointly announced a technology licensing and foundry agreement that will introduce 0.155m low power SRAM technology to SMIC's manufacturing facility in Shanghai, China.
2008-03-18 Synopsys, SMIC tip 90nm reference design flow
Synopsys Inc. and SMIC have released an enhanced 90nm hierarchical, multivoltage RTL-to-GDSII reference design flow that benefits from advanced synthesis, design-for-test and DFM capabilities.
2006-09-07 Synopsys, SMIC team on ref design flow 3.0
Synopsys Inc. and Semiconductor Manufacturing International Corp. announced that they have jointly developed and deployed reference design flow 3.0.
2007-08-31 Synopsys, SMIC develop low-power sol'n for China mobile TV market
Synopsys and SMIC have partnered to develop a low-power design solution optimized for the mobile TV market in China.
2006-09-07 Synopsys unrolls connectivity IP for SMIC 130nm tech
Synopsys has expanded its DesignWare MSIP portfolio with the release of connectivity IP for SMIC's 130nm technology.
2015-11-13 Strong performance allows SMIC to defy chip downturn
SMIC, China's largest foundry, said its capacity is fully utilised, and aims to develop a range of specialised versions of its most advanced 28nm process technology for such applications as RF.
2008-08-25 Spansion, SMIC forge 43nm fab deal
Spansion has expanded its foundry arrangement with SMIC to include 43nm production.
2007-10-26 Spansion taps SMIC for 65nm MirrorBit production
Spansion announced it will transfer its 65nm MirrorBit technology to SMIC for foundry services on 300mm wafers in China.
2010-11-16 SoC design solution integrates Synopsys, SMIC technology
Synopsys Inc. and SMIC announced their delivery of a comprehensive solution for SoC design for the advanced 65-nm process. The solution integrates Synopsys' broad DesignWare interface and analog IP portfolio, plus other foundation IP with Synopsys' Galaxy Implementation Platform, in a tuned reference flow.
2007-10-02 SMIC-Saifun flash project delayed but not stalled
The Saifun-SMIC flash memory project is moving forward, but it is taking much longer than expected.
2008-04-28 SMIC-ASTRI team yields dual-mode UWB MAC ASIC
SMIC and ASTRI have collaborated to provide the world's first dual-mode UWB MAC IC using SMIC's 0.13?m mix-mode CMOS technology.
2005-05-18 SMIC, UTAC agree to set up chip fab in Chengdu
Semiconductor Mfg Int. Corp. (SMIC) and Singapore-based United Test and Assembly Center Ltd (UTAC) recently agreed on a joint venture and will set up an assembly and testing facility in Chengdu in Sichuan.
2015-03-03 SMIC, start-up group manufacture CMOS image sensors
Shanghai-based start-up company Cista System teams up with Semiconductor Manufacturing International for mass production of two CMOS image sensors, which both sport back-side illumination.
2010-02-04 SMIC, SHHIC deliver smart card IC using 0.162?m EEPROM
SHHIC's a high-end contactless smart card IC design has successfully entered into commercial production at SMIC using 0.162?m embedded EEPROM process.
2005-04-07 SMIC, QQ develop telecom ICs
SMIC and QQ Technology recently signed a Memorandum of Understanding (MoU) for the joint development of high-end telecommunication ICs.
2007-03-19 SMIC, MoSys expand foundry agreement
MoSys has extended its existing agreement with China's Semiconductor Manufacturing International Corp. to include MoSys' new high-density embedded flash memory IP.
2005-11-21 SMIC, Magma offering RTL-to-GDSII flow for 130nm SoCs
Magma Design Automation Inc. and Semiconductor Manufacturing International Corporation (SMIC) have made available a validated reference flow based on Magma's Blast Create, Blast Plan Pro, Blast Fusion and Blast Power for system-on-chips (SoCs) targeted at SMIC's 130nm process.
2016-02-22 SMIC, Leadcore to roll out smartphone SoC in HKMG process
Based on SMIC's 28nm HKMG process platform, the smartphone SoC launched by Leadcore promises better performance, higher speed and lower power consumption, and 1.6GHz CPU performance.
2005-04-14 SMIC, ISSI-Shanghai develop EEPROM technology
Semiconductor Mfg Int. Corp. (SMIC) and Integrated Silicon Solutions Inc.-Shanghai (ISSI-Shanghai) has developed a high reliability EEPROM technology.
2015-06-26 SMIC, Huawei, Qualcomm, Imec sign 14nm joint venture
SMIC hopes the deal will enable it to have its home-grown 14nm process in production in an SMIC fab by 2020, which is said to still have problems even with its 28nm process.
2003-12-29 SMIC, Elpida sign deal for DRAM production in China
Semiconductor Mfg Int. Corp. (SMIC) and Elpida Corp. have signed a five-year foundry agreement under which SMIC will produce Elpida's 0.10?m DRAM products at its 300mm fabrication facility in China.
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