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2013-10-24 H-bridge power modules feature high-speed IGBT H3s
The improved flowPACK 1 H modules have been engineered to satisfy the performance demands of high-frequency solar inverter, power supply and welding applications ranging up to around 17kW.
2011-04-14 Bridge rectifiers for switchmode power supplies
Vishay Intertechnology's low forward voltage rectifiers LVB1560 and LVB2560 are ideal for high efficiency equipment, systems, and other applications.
2001-02-01 Testing dimensional limits of high I/O flip-chip design
The study characterizes underfill materials, examining some large package geometries and design manufacturing processes to avoid defects for I/O counts.
2009-09-02 Silicon circuit board trumps ASICs
Startup siXis Inc. has selected foundry SVTC Technologies to fabricate its embedded silicon board computing modules, which claims to bridge the gap between PCB prototypes and ASIC-based designs
2008-05-30 Vishay releases enhanced rectifier series
Vishay Intertechnology Inc. introduces a new series of enhanced high-current-density PowerBridge rectifiers with current ratings of 10-25A and maximum peak reverse voltage ratings of 600-1,000V.
2007-06-13 Using tolerance analysis method in product selection
There are two tools that engineers can use to estimate the level of uncertainty with the product selection of components in circuits, namely root-sum-square and extreme value analysis.
2011-04-21 STATS ChipPAC aims TSV expansion in Singapore
STATS ChipPAC is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities in Singapore.
2014-12-19 SRAMs in nextgen IoT and wearable embedded designs
In this article, we will discuss the technology advances that necessitate SRAMs and also the evolving trends in SRAM technology that make it ready to service the needs of the future.
2005-08-09 Speedline 'greens' wave soldering systems
Speedline Technologies announced Pb-free enhancements for its Electrovert Econopak Gold Wave Soldering Systems.
2005-03-04 New Pb-free nozzles are 40 percent wider
Speedline announced that it new UltraFill Pb-free nozzles feature an innovative technology and design to enable electronic manufacturers to overcome a variety of process challenges inherent in lead-free wave soldering.
2015-04-22 Is resistive RAM the next NVM star?
Resistive RAM features low power consumption and a small cell areaboth compelling reasons for their adoption as a non-volatile memory.
2008-09-23 IR rolls Class D audio power amplifier reference design
IR has introduced the IRAUDAMP7 reference design for Class D audio amplifiers above 25W per channel including home theatre applications, musical instruments and car entertainment.
2015-03-09 IoT drives chip packaging innovation
The need for high performance multi-functional devices in a single package is pushing the industry to innovate in multi-chip packaging. This high level of integration has presented huge challenge.
2015-12-14 Get 500W in converter with GaN (Part 2)
In Part 2, we tackle the key details of physical and electrical design, including layout, key waveforms and losses. We also summarise key potential improvements.
2008-10-23 Feature-packed BLDC motor ICs trim overall system cost
Atmel Corp. has released ATA6833 and ATA6834 highly integrated driver ICs for brushless DC (BLDC) motor applications such as fuel pumps, turbo chargers, or exhaust gas recirculation.
2015-07-03 Examining 3D embedded substrate power packaging
Here is a look at 3D embedded substrate power packaging technologies, which will be increasingly deployed in everything from cell phones to hybrid electric vehicles.
2005-06-15 Aeluros makes 'green' versions
Aeluros recently announced green variants of its Puma 10Gbps physical layer IC devices.
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