Global Sources
EE Times-Asia
Stay in touch with EE Times Asia
EE Times-Asia > Advanced Search > solder reflow

solder reflow Search results

total search171 articles
2009-06-02 Wave solder exposure of SMT packages
Attaching surface mount components to the bottom side of a PCB by wave solder processing is common practice. Because surface mount components are normally soldered using a reflow oven process, the impact of wave soldering and wave solder simulation methods must be understood.
2009-06-17 Solder reflow guide for surface mount devices
This application note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards.
2008-12-22 Solder reflow guide for surface mount device
This application note provides general guidelines for a solder reflow and rework process for Lattice surface mount products.
2009-05-22 Solder reflow attach method for high power RF devices in over-molded plastic packages
This application note aims to provide Freescale Semiconductor customers with a guideline for solder reflow mounting of high power RF transistors and ICs in over-molded plastic (OMP) packages.
2003-01-16 Solder paste process control for CSPs and 0201s
This technical article discusses a more effective strategy to improve first pass yields and prevent defects from occurring in CSPs and 0201s.
2001-06-04 Reflow soldering conditions for VCO and synthesizer products
This application note describes recommended practices for the successful assembly of M/A-COM VCO and synthesizer components using automated solder reflow techniques.
2003-10-16 Yamato Works reflow oven suits 300mm wafers
The N2 reflow oven for solder bump forming from Yamato Works Co. Ltd features hot plate and upper far-infrared rays that can be used for heating.
2006-05-31 Yamato unveils N2 reflow oven for 200-300mm wafers
Yamato Works rolled out a nitrogen relfow oven for solder bump forming for 200-300mm wafers
2012-03-15 Ulvac crafts new direct solder deposition processes
The process developed by Ulvac use sputtering to deposit solder, unlike conventional solder deposition which is done by evaporation or printing
2007-05-16 Solder paste with SACX alloy delivers high throughput
Cookson Electronics Assembly Materials adds to its offering the new ALPHA OM-350 Pb-free solder paste with SACX alloy developed by the Cookson Electronics' R&D group
2010-08-10 Solder paste is halogen-free, Pb-free
Indium Corp. introduced the Indium8.9HF-1 solder paste, highlighting the product's halogen-free, Pb-free formulation
2010-01-25 Intel, Carnegie Mellon work on solder nanocomposites
Carnegie Mellon University and Intel Corp. are working on a new class of materials called solder magnetic nanocomposites that could help streamline the process of computer electronic packaging
2002-03-18 HEM introduces lead-free solder for power packages
Honeywell Electronic Materials has announced the development of the Bi-Ag lead-free solder for die attach in power packages
2000-10-01 Evaluating solder-paste defects
A robust solder-system evaluation saves manufacturing facilities unnecessary expenses
2000-10-01 Effects of NEMI reflow on PTHs
This paper evaluates the changes in plated through-hole (PTH) performance and laminate material properties for several epoxy-based laminate systems caused by the thermal reflow requirements of the NEMI higher temperature alloy
1998-10-01 Avoiding solder-ball formation
Solder balls occur in both wave and reflow soldering and can also occur if great care is not taken during hand soldering.
2001-06-14 Surface mount soldering considerations
This application note provides several guidelines to proper surface mount soldering techniques to achieve high reliability.
2000-12-11 Storage and handling of Drypacked surface mounted devices (SMD)
This application note provides ON Semiconductor customers with the necessary storage and handling guidelines to preclude component package cracking during solder reflow procedures.
2002-10-24 PCB land pattern design and surface mount guidelines for leadless packages
This application note describes the land pattern design and surface-mount guidelines for leadless packages.
2015-01-05 How electro-optical circuit boards are made
Electro-optical PCBs use copper for distributing power and low-speed data, and optical paths for high-speed signals. Read this article to learn more about them.
2015-02-17 Canadian start-up develops PCB printer
Each printer will come with a cartridge of conductive ink, insulating ink, solder paste, solder wire, blank boards in a few sizes and a sample pack of template boards
1999-10-01 Trends and issues in thermal processing
Revision in standards, introduction of new solder materials, emergence of different base materials and alterations in component design are driving thermal processing requirements. Assimilating these changes within your present processes entails proper analysis and equipment improvement and optimization
2002-09-06 Teradyne delivers optical test equipment to BISC
Teradyne's Assembly Test Division has received an order from Beijing International Switching System Corp. Ltd (BISC) for two Teradyne Optima 7300 post-reflow automated optical inspection systems
1999-11-10 Surface mount soldering recommendations
The most important consideration in reliability is achieving a good solder bond between surface mount device (SMD) and substrate since the solder provides the thermal path from the chip. A good bond is less subject to thermal fatiguing and will result in improved device reliability
2004-01-27 Speedline upgrades its manufacturing equipment features
Speedline Technologies Inc. has introduced three product features for its electronics manufacturing equipment.
2001-07-16 Reworking CSPs, ?BGAs and flip-chips
Rework of CSPs and flip-chip is required to achieve systems that are reliable, repeatable and cost effective.
1998-12-01 Rework BGAs for improved process yields
The removal and replacement of Ball Grid Array (BGA) devices requires proper equipment selection, robust process control, and proper training of staff. Rework involves the following sequence of steps: BGA module removal, BGA site preparation, sol-der paste deposition, module replacement, and reflow
2000-11-01 Profiling for successful BGA and CSP rework
This technical article discusses how to successfully profile a PCB when reworking BGA and CSPs.
2015-01-28 Preventing embedded PCB design defects
Printed circuit board defects can remain unnoticed until failure occurs, so it is important to implement disciplined practices even at the early stages of design.
2004-02-06 Indium releases Pb-free soldering products
Indium Corp. has developed several Pb-free soldering products.
Bloggers Say

Bloggers Say

See what engineers like you are posting on our pages.

Back to Top