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2009-06-02 Wave solder exposure of SMT packages
Attaching surface mount components to the bottom side of a PCB by wave solder processing is common practice. Because surface mount components are normally soldered using a reflow oven process, the impact of wave soldering and wave solder simulation methods must be understood.
2002-02-26 Vitronics Soltec machine separates reusable solder from waste
Aimed at reducing costs by separating reusable solder, the company's Dross Grabber separates good solder from real dross, and returns the usable solder to the pot for further use.
2001-05-30 Using custom solder dots in schematic
This application note describes how to create and use a custom solder dot in the Schematic Editor.
2012-03-15 Ulvac crafts new direct solder deposition processes
The process developed by Ulvac use sputtering to deposit solder, unlike conventional solder deposition which is done by evaporation or printing.
2006-07-01 Testing solder joints for Pb-free connectors
OEMs and contract manufacturers in the electronics industry have been accelerating efforts to replace tin-lead finishes on electronics components and tin-lead solder in interconnects with lead-free finish and solder. Test shows that solder joints constructed from lead-free solder show higher voiding content than those of eutectic tin-lead solder.
2012-08-14 Solder-in probing sol'ns target oscilloscope probing
Agilent introduced the high-bandwidth accessories for its InfiniiMax III oscilloscope probing system for high-speed digital system design, component design and differential serial bus measurement.
2010-09-07 Solder stays wetter longer
The SN100C alloy was compared to SAC305 on stranded wire used for speakers and was shown to have increased wettability and spreadability after melting.
2009-06-17 Solder reflow guide for surface mount devices
This application note provides general guidelines for a solder reflow and rework process for Lattice surface mount products. The data used in this document is based on IPC/JEDEC standards.
2008-12-22 Solder reflow guide for surface mount device
This application note provides general guidelines for a solder reflow and rework process for Lattice surface mount products.
2009-05-22 Solder reflow attach method for high power RF devices in over-molded plastic packages
This application note aims to provide Freescale Semiconductor customers with a guideline for solder reflow mounting of high power RF transistors and ICs in over-molded plastic (OMP) packages.
2007-05-16 Solder paste with SACX alloy delivers high throughput
Cookson Electronics Assembly Materials adds to its offering the new ALPHA OM-350 Pb-free solder paste with SACX alloy developed by the Cookson Electronics' R&D group.
2003-01-16 Solder paste process control for CSPs and 0201s
This technical article discusses a more effective strategy to improve first pass yields and prevent defects from occurring in CSPs and 0201s.
2010-08-10 Solder paste is halogen-free, Pb-free
Indium Corp. introduced the Indium8.9HF-1 solder paste, highlighting the product's halogen-free, Pb-free formulation.
2006-05-25 Solder paste allows high print speeds
Cookson Electronics Assembly Materials launched the Alpha OM-338 PT, a lead-free solder paste.
2001-02-01 Solder masks: Examining rules of thumb
Learn the plane facts about cuts in power planes and solder mask on surface layers.
2008-09-09 Solder mask and trace recommendations for FBGAs
This application note provides recommendations for solder masks used with FBGAs and escape considerations for traces. The recommendations reflect current industry practices. As always, it is a good idea to follow the recommendations of the board manufacturer.
2001-04-01 Solder joint reliability of BGA/CSP for mobile phones
A study of drop impact stress on solder joints verifies that stress can be checked by measuring motherboard strain, and this strain can be reduced by underfilling. This article describes the influence of drop impacts unique and common to mobile phones on the reliabilities of the BGA/CSP solder joints.
2001-04-01 Solder joint reliability of BGA/CSP for mobile phones
A study of drop impact stress on solder joints verifies that stress can be checked by measuring motherboard strain, and this strain can be reduced by underfilling. This article describes the influence of drop impacts unique and common to mobile phones on the reliabilities of the BGA/CSP solder joints.
2001-04-15 Solder flux jetting technology
Advances in jetting technology improve film thicknesses and provide excellent edge definition in selective flux applications.
2006-03-09 Solder flux designed for tin-lead, Pb-free processes
Cookson Electronics Assembly Materials has launched the ALPHA EF-6100 low-solids wave solder flux.
2013-12-30 Removable antistatic masking tape for wave solder process
The Polyonics XT-658 is a 1mil polyimide antistatic tape with an acrylic PSA and PET liner that is rated for 300°C and, depending on the severity of the process, can be removed with little to no residue.
2001-08-01 Preventing flip-chip solder joint failures
Learn about the degradation of solder joints in FCOBs as a result of thermal cycling. The article also seeks to answer how solder joint cracks are initiated and propagated.
2001-09-11 Plated and solder dipped finishes for semiconductor components
This application note describes plated or hot-solder-dipped coatings for semiconductor component external solder terminations.
2004-08-18 New wave solder alloy delivers quality cost-effectively
Cookson introduced its Alpha Vaculoy SACX307 lead-free wave solder alloy that "cost-effectively" delivers high yield and fast throughput.
2011-01-26 Nanotape may soon replace solder pads
The new nanotape could replace solder pads with a thin lightweight material that improves thermal energy management. Its foam-like flexible compliance could form the basis for new IC packaging techniques.
2004-06-16 NanoStar & NanoFree 300?m solder bump wafer chip-scale package application
This app note provides the necessary design and reliability information to apply the NanoStar 300?m solder bump packages.
2012-02-14 Mill-Max outs solder barrier pin receptacles, sockets
The Organic Fiber Plug uses precision-machined brass housing with a press-fit beryllium copper 'multifinger' contact for through-hole soldering into PCBs.
2003-05-20 Matsushita completes switch to lead-free solder for PCBs
Matsushita Electric Ind. Co. Ltd has completed a switchover to the use of lead-free solder for PCBs used in its Panasonic and National brand products.
2012-05-07 LED array holder touts solder-free connection
Molex's thermoplastic LED array holders provide solderless screw-down compression contacts to power LEDs, taking away the need for hand soldering or SMT equipment.
2010-01-25 Intel, Carnegie Mellon work on solder nanocomposites
Carnegie Mellon University and Intel Corp. are working on a new class of materials called solder magnetic nanocomposites that could help streamline the process of computer electronic packaging.
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