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2013-08-13 13.5mm solderless LED flashes 1500lm of brightness.
The Soleriq S 13 from Osram Opto can be installed in LED luminaires as a so-called retrofit, replacing halogen spotlights with high wattage.
2006-06-14 Press-fit connectors suit high-reliability, high-cycle apps
Sullins has added pin-compliant solderless press-fit terminations to its edgecard connector family for high-reliability and high-cycle applications.
2012-05-07 LED array holder touts solder-free connection
Molex's thermoplastic LED array holders provide solderless screw-down compression contacts to power LEDs, taking away the need for hand soldering or SMT equipment.
2003-08-29 Omron tactile switch reduces production lead-time
Omron has developed a solderless ultra-low profile tactile switch that reduces production lead-time for operating parts of portable devices.
2012-05-16 Interconnects push LED solution upgrades
Molex has presented solderless LED array holders and other microminiature connectors that the company says can enable advanced lighting solution designs.
2003-01-09 High-performance socket targets BGAs
A solderless GHz ZIF socket from Ironwood Electronics makes it possible to socket 1mm-pitch, 40mm-body BGA ICs with power dissipation up to 35W.
2006-04-27 Cinch unveils flex circuit interconnect solutions
Cinch Connectors has unveiled a solderless, board-to-board, interconnection solution that blends the Cinch iQ connector with a flex circuit and compression system.
2006-04-17 Cinch interconnection solution eases multi-board connection
Cinch Connectors unveiled a solderless, board-to-board, compression style interconnection solution that blends the Cinch iQ connector with a flex circuit and compression system.
2006-02-07 Test sockets come in three mounting styles
Emulation Technology has expanded its test socket line with a surface-mount QFN/MLF Quick Lock version. The sockets are also available in through-hole and compression-fit mounting styles.
2007-01-18 Test sockets accept 0.40mm pitch devices
Aries Electronics has announced that all sizes of its CSP/Micro BGA test and burn-in sockets accept devices with pitches as low as 0.40mm.
2005-07-14 Test socket fits 28-40mm? devices
Aries Electronics' new RF socket can be used for manual testing of devices with pitches as small as 0.50mm, in apps with speeds from 1GHz to 18GHz.
2005-02-10 Quick Lock sockets suit BGA packages
Emulation Technology has expanded its Quick Lock series to include BGA and mBGA test sockets.
2014-06-09 Molex touts plastic substrate interconnect for CoB arrays
With a low overall package height of about 2mm, Molex PSI boasts a slim design for space-limited applications while minimising substrate costs.
2004-10-06 High-frequency test socket targets 28 to 55 mm? devices
Aries Electronics now offers a new high frequency test socket for devices that measure 28mm? to 55mm? wide.
2002-07-11 High-frequency test socket rolls
Aries Electronics has broadened its line of high-frequency test sockets with a unit that has a replaceable spring probe interposer.
2015-07-15 E-band cost, reliability concerns in MMIC packaging
Traditional semiconductor packaging approaches either cost too much or suffer from signal integrity issues. However, new techniques are becoming available that can address these problems.
2005-02-17 Cypress subsidiary unveils 3 development kits for PSoC devices
Cypress MicroSystems introduced three development kits for its Programmable System-on-Chip mixed-signal array devices.
2012-04-25 Compliant-pin tech targets automotive apps
Molex's EON1.0, EON1.45 and EON1.80 connectors can be used on both the soldered and component sides of the PCB, allowing double-sided PCB assembly.
2004-12-06 Cinch connectors with
The new low profile board-to-board connectors from Cinch offer a low mated height of 0.81mm in custom, and flexible footprint configurations.
2005-04-25 Center probe RF test socket is designed for Delta handlers
Aries introduced a new center probe RF test socket designed specifically for use with Delta handlers.
2003-07-23 Aries sockets accommodate to 13mm? packages
Aries Electronics has released the BGA/CSP test and burn-in socket for devices with a pitch from 0.5mm or larger in applications of up to 1GHz.
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