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2006-07-12 Toshiba audio power amp gives 21W per channel
Toshiba America's first Class-D audio power amplifier IC, the TB2924FG, delivers up to 21W per channel in a heatsink-free design for audio consumer electronics applications.
2007-05-16 Tool lowers system cost for handsets
QuickLogic's ArcticLink is an ASSP that can be configured to support several communications and peripheral protocols for handheld systems.
2010-01-28 Tiny piezo motor runs over 7mm/s at low power
New Scale Technologies' SQUIGGLE RV reduced voltage linear drive system delivers performance comparable to much larger motion controls at 40 percent lower power and less than one-fourth the size.
2005-10-28 TI unveils new 24-bit ADCs
Texas Instruments Inc. (TI) announced a pair of 24-bit analog-to-digital converters (ADCs) that integrate a low-noise programmable gain amplifier (PGA), precision delta-sigma ADC and internal oscillator
2004-05-19 TI rolls out IC controller, PoE power module
Texas Instruments Inc. has launched an IC controller and a Power-over-Ethernet (PoE) plug-in power module that reduces design time and eases implementation of Ethernet-powered industrial and commercial devices.
2012-10-15 TI rolls MCUs, PMICs, motor drivers
The SafeTI design package includes the 32bit Hercules safety MCUs, TPS65381-Q1 PMIC and DRV3201 motor driver to help speed and ease customer motor control design and certification.
2004-09-15 TI PWM processor offers eight speaker channels
TI unveiled a digital amplifier PWM processor that provides up to eight speaker channels with 48bit processing.
2011-06-14 TI claims first fully-integrated Li-Ion battery IC
TI has released the bq33100, which claims to be the industry's first fully integrated Li-Ion battery management IC.
2014-04-23 The key to improving wearable medical electronics
An essential component of wearable technologies is the power source which usually comes in the form of a battery.
2016-04-28 Tackling IoT and Industry 4.0 sensor backplane needs
Read about the configurable analogue architecture that supports the bimodality requirements of the sensor backplane for both IoT and Industry 4.0 applications.
2005-11-11 Structured ASIC devices embed PCI Express physical layer
ChipX has introduced a new structured ASIC family that it claims is a low-risk alternative to traditional ASIC and FPGA devices
2013-05-24 Stratix V GX FPGAs added to PCI-SIG integrators list
Altera's Stratix V GX FPGAs successfully passed all PCI-SIG compliance and interoperability tests, completing inclusion for Stratix V on all three generations of the Integrators Lists for PCIe.
2005-09-23 ST expands USB MCU lineup
STMicroelectronics expanded its line of USB microcontrollers (MCUs) with the introduction of new products in its ST7263B series.
2014-12-19 SRAMs in nextgen IoT and wearable embedded designs
In this article, we will discuss the technology advances that necessitate SRAMs and also the evolving trends in SRAM technology that make it ready to service the needs of the future.
2009-12-09 SR controller promises high accuracy, reliability
International Rectifier has launched the IR11672A SmartRectifier IC with advanced Minimum On Time protection circuitry for energy-efficient AC/DC power converters.
2015-09-17 Spot IGBT degradation through power cycling
Here is a look at an experiment in which we conducted thermal transient tests from one steady-state to another to determine cause of failure for a small sample of IGBTs.
2005-08-09 Speedline 'greens' wave soldering systems
Speedline Technologies announced Pb-free enhancements for its Electrovert Econopak Gold Wave Soldering Systems.
2004-05-03 Speakers challenge APIs for EDA interoperability
A standard API and database implementation may not be the best approach to EDA tool interoperability, according to Synopsys speakers at the Electronic Design Processes (EDP-2004) workshop here Monday (April 26, 2004).
2013-02-28 SMPD module platform integrates thyristor, IGBT
IXYS' device that touts proprietary DCB isolated substrates claims to offer improved reliability and reduced board size by offering surface mount solutions for systems up to 15kW.
2006-11-10 SmartRectifier IC targets home entertainment apps
International Rectifier has introduced the IR1166 SmartRectifier IC for AC-DC power converters used in home, computer and audio applications.
2011-05-18 Single-layer sensor delivers lower-cost capacitive touchscreens
Cypress has created proprietary algorithms that interface with a true single-layer sensor without bridges to deliver two-layer performance, enabling mobile device makers to save 30 percent on sensor costs.
2011-10-12 Singapore school promotes cloud education
Singapore Polytechnic has launched a cloud computing center that will offer training in virtualization, enterprise computing and data center management.
2011-04-28 Silver box reference design touts 92% efficiency
Infineon has developed a marketable silver box reference design that enables PC and server power supply units to achieve up to 92.35 percent efficiency at low material costs.
2003-02-28 Silicon collaboration to develop next-gen RDRAM chipset
Silicon Integrated Systems Corp. has collaborated with Samsung Electronics Co. Ltd, ASUSTeK Computer Inc., and Rambus Inc., on the development of a next-generation RDRAM-based chipset - the SiSR659.
2011-05-11 Sensor signal conditioner enables single IC apps
ZMDI unveils a sensor signal conditioner with integrated LIN transceiver that enables the development of a complete sensor application with a single IC and helps save component costs and board space.
2007-10-01 Sensor nets monitor safety-critical structures 24/7
Structural health monitoring a sensor-based preemptive approach that could supplement the current system of visual inspections and follow-on tests of bridges, buildings, aircraft and other safety-critical structures.
2010-04-07 Sensor interface IC suits battery management apps
From austriamicrosystems comes a high-precision DAQ front-end IC for automotive battery current, voltage, temperature sense applications and in general for sensor interface applications.
2015-09-07 Sensor interface AFE simplifies sensor conditioning
Read about a sensor interface that includes a 16:1 differential multiplexor, a programmable gain instrumentation amplifier, a 10bit offset correction DAC, and a low dropout regulator.
2008-09-29 Sensor design tool speeds up data conversion design
National Semiconductor has released a new online design tool to its WEBENCH family.
2012-04-10 Sensing problems at the network periphery
Find out how to ensure reliability of networks in increasingly harsh terrains.
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