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2004-01-28 Toshiba, Sonics team in SMART interconnect IP products
Toshiba Corp. and Sonics Inc. have expanded their business relationship with a joint technology collaboration.
2003-04-25 Toshiba SoCs to use Sonics interconnect technology
Toshiba Corp. has entered into a corporate-wide contract with Sonics Inc. enabling Toshiba to use Sonics SMART Interconnect IP as an interconnect technology in its SoCs.
2004-04-22 Sonics, CoWare to speed up complex SoC development
SoC provider Sonics Inc.'s Smart Interconnect IP products and CoWare Inc. have entered into a long-term strategic partnership to speed the development of complex SoCs.
2004-11-16 Sonics tunes next-gen architecture for rich media
With the introduction of its MX architecture, Sonics aims for the handheld rich-media apps that just about every other IP vendor and chip house is targeting.
2002-03-06 Sonics releases memory scheduler core
Sonics Inc. introduced a memory scheduler core at the Design Automation and Test in Europe conference.
2002-01-22 Sonics lands $20 million in funding
Sonics Inc., a developer of intellectual property cores, has received $20 million in Series C financing from a group of investors.
2012-09-03 Sonics joins HSA Foundation to support mobile, cloud computing
The company will assist with R&D and will provide system IP to semiconductor companies building SoCs that adopt the HSA architecture by ensuring Sonics' products are specification-compliant.
2004-05-07 MIPS, Sonics unveil joint digital multimedia SOC solution
MIPS Technologies Inc. and Sonics Inc. have joined forces in combining a 32-bit processor and SMART interconnect IP to dramatically cut the development time of cost-effective SOCs for digital multimedia applications, such as digital set-top boxes and digital TV receivers.
2003-02-26 Hitachi-IT licenses Sonics interconnect IP solutions
Sonics Inc., Hitachi Information Technology Co. Ltd, and Innotech Corp. have announced a business partnership and the licensing of the latter's SMART Interconnect IP solutions for use in complex SoC designs by Hitachi-IT.
2013-05-06 ARM, Sonics ink licensing deal for next-gen interconnects
Sonics and ARM will cooperate to support Sonics' power management technologies, which are intended to deliver power savings by the intelligent control of power to cores
2006-06-09 SoC tools promise seamless SystemC-to-RTL design flow
Sonics' latest SonicsMX Smart Interconnect and SonicsStudio promise a seamless SystemC-to-RTL design flow that provides consistent SystemC or RTL versions of specific SonicsMX configurations.
2003-09-24 SoC backbone blends bursts, streams
Intellectual property vendor Sonics Inc. has unveiled the 3G version of Silicon Backplane.
2006-11-01 Outsource the interconnect
Outsourcing the SoC interconnect design is a direct, straightforward measure to significantly reduce the impact of the OEM software-shift phenomenon on the semiconductor industry.
2005-01-17 OCP-IP upgrades core to bus validation tool
The latest version of OCP-IP's front end OCP validation tool is fully compliant with, and supports the OCP 2.0 spec.
2009-05-07 Tool simplifies on-chip interconnect design
EDA vendor Sonics Inc. has rolled out a new tool to ease the job of building on-chip interconnects using the ARM Amba bus.
2008-02-18 Overcome critical SoC architectural challenges
A collaborative effort among IC designers using CoWare's ESL tools and Sonics' SMX smart-interconnect IP designed for this class of SoCs enabled the rapid optimization and verification of the design aspects necessary to meet the critical architectural challenges.
2008-07-04 Interconnect links processing, memory channels
Sonics Inc. rolls out a new chip-level interconnect technology, addressing what it says is a growing memory bandwidth problem faced by a broad range of people who develop video processors.
2011-02-17 Altair licenses Sonic on-chip network solution
Sonics Inc. reports that three of its on-chip network solutions have been licensed by Altair Semiconductor for the company's existing and next-generation line of ultralow-power, small footprint LTE processors.
2009-03-13 Xilinx CEO: no VC comeback for semis
Venture capital funding is in short supply and will not return to the semiconductor industry even after the current recession, according to Moshe Gavrielov, president and CEO of Xilinx Inc.
2003-08-12 VSI Alliance adds new members
Gaining new support from the semiconductor industry, the Virtual Socket Interface Alliance has added three new companies to its board of directors.
2010-04-19 Virage Logics sets sight on subsystems
Virage Logic no longer sees itself as just a provider of a collection of IP cores, instead, it's betting on becoming a supplier of 'subsystems' that can be quickly embedded in SoCs for its licensees.
2010-10-07 TSMC expands IP alliance to welcome soft IP
TSMC has now expanded its IP Alliance to incorporate a soft IP program which will improve soft IP readiness for advanced technology nodes and promote earlier time-to-market.
2005-02-07 Toshiba adopts SonicsMX handheld chips
Toshiba Corp. will design the SonicsMX and Sonics3220 SMART interconnects into its family of wireless handheld products.
2003-11-11 SystemC tool 'automates' ESL-to-RTL design flow
Offering technology that it claims will automate the ESL-to-RTL design flow, startup SpiraTech Ltd. has announced Cohesive, a toolset that bridges multiple levels of abstraction.
2002-10-18 Synopsys, OCP-IP codevelop SoC methodology
Synopsys Inc. and the Open Core Protocol International Partnership has announced the development of a SystemC modeling methodology for OCP-based SoCs.
2009-03-18 Solution supports on-chip power management
Cadence Design Systems Inc. has enhanced the Cadence Low-Power Solution to include support for new on-chip power management schemes enabled by the recently ratified Si2 Common Power Format (CPF) Version 1.1.
2003-10-16 SoCMosaic speeds IC co-development
Having reduced chip development time with its SoCMosaic platform, Toshiba Corp. is promising to shorten time-to-market further for custom chips.
2015-04-27 Slowing mobile market looks to smart watches for growth
Over the next five years, both smartphones and tablets will slump to single-digit growth levels but smart watches could rise to annual sales of 300 to 400 million units, analyst Linley Gwennap forecast.
2005-09-30 MIPS32 core based computing subsystem is available for SoCs
K-Micro has launched its MIPS32 24Kf core-based computing subsystem, called Topaz, for integration into SoCs
2005-09-28 MIPS32 24K silicon integrated to K-Micro's computing subsystem
ASIC provider K-Micro and MIPS Technologies Inc. disclosed the inclusion of the MIPS32 24Kf processor core in K-Micro's latest Topaz advanced computing subsystem for SoCs. The subsystem will enable designers to bring applications requiring very high-performance computing power, including PON ONU/OLT, set-top boxes, printers, routers, and storage devices to market more easily.
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