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2012-02-03	STATS ChipPAC closes Thai plant Damages to the facility was so extensive that economic restoration is no longer possible.
2012-01-16	STATS ChipPAC builds new factory Once the new building is completed, STATS ChipPAC's combined manufacturing space in Singapore will increase from 55 277.30 to 73 579.21 square meters (595,000 to 792,000 square feet).
2011-04-21	STATS ChipPAC aims TSV expansion in Singapore STATS ChipPAC is expanding its 300mm through silicon via (TSV) offering with the addition of mid-end manufacturing capabilities in Singapore.
2007-03-05	Singapore private equity eyes STATS ChipPAC Singapore's Temasek Holdings is offering of up to $1.6 billion for local packaging house STATS ChipPAC—a bid that analysts said may undervalue the once-troubled firm.
2004-08-09	Shareholders approve STATS, ChipPAC merger Shareholders of both semiconductor test and assembly service providers STATS and ChipPAC have approved a merger originally announced in February 2004.
2002-07-15	RFMD, STATS adopt Teradyne test systems RF Micro Devices and ST Assembly Test Services Ltd will ramp Bluetooth device production on Teradyne Inc.'s Catalyst test systems.
2012-09-17	QFN package design kit for ADS launched by STATS ChipPAC The QFN package design kit enhances package modeling and simulation accuracy with Agilent's ADS electronic design automation software for radio frequency.
2013-08-14	NTU, STATS ChipPAC work on advanced wafer level packaging Singapore's NTU has entered a joint research programme with STATS ChipPAC to advance solutions for next generation semiconductor packaging technologies.
2005-08-03	Merger continues to weigh on STATS ChipPAC With STATS ChipPAC Ltd continuing to post losses nearly a year after the merger that created it, and failing to leverage on a generally positive industry environment, observers said the immediate outlook for the test and packaging firm is grim.
2007-10-04	LSI sells Thailand facility to STATS ChipPAC LSI Corp. announced it has completed the sale of its semiconductor assembly and test operation in Pathumthani, Thailand, to STATS ChipPAC Ltd.
2004-01-06	FastRamp changes name to STATS FastRamp Test Services ST Assembly Test Services Ltd (STATS) announced that FastRamp Test Services Inc. has changed its name to STATS FastRamp Test Services.
2005-07-29	Amkor, STATS ChipPAC still spilling red ink Two major chip packaging and test vendors - Amkor and STATS ChipPAC - continue to spill red ink amid slumping demand and severe price pressures in the market.
2005-10-06	Americas, Europe, Japan in decline, SIA stats show For the second month running actual semiconductor sales in the Americas, Europe and Japan have declined year-on-year, despite the fact that the global market is growing. And while the rest of the world is in decline the Asia-Pacific region is enjoying boom-like growth, according to statistics kept by the Semiconductor Industry Association.
2004-11-08	Agilent to provide Stats Chippac with 93000 SOC system Agilent Technologies Inc. has been selected as Stats Chippac Ltd strategic test supplier in an agreement worth up to $125 million.
2014-12-17	Packaging and testing industry trends from 2013 to 2014 In 2014, the output value of OSAT industry is seen to grow by 8.4 per cent and the advanced packaging industry is expected to increase by 10 per cent.
2005-12-27	IC packaging providers upbeat Continued strength in the IC packaging and test sector during the fourth quarter and possibly beyond has prompted an investment banking firm to raise its estimates for Amkor, Siliconware and STATS ChipPAC.
2012-07-11	Advanced flip chip packaging tech unveiled STATS ChipPAC's fcCuBE technology features copper column bumps, bond-on-lead (BOL) interconnection and enhanced assembly processes for high volume production.
2011-11-22	Wafer packaging fab opens in Taiwan STATS ChipPAC has increased production capacity with the completion of its 300mm wafer bump and WLCSP facility.
2008-08-11	Trio seeks to cut costs in chip packaging Infineon has granted licenses for its embedded Wafer-Level BGA chip packaging technology to competitor STMicroelectronics as well as STATS ChipPAC to lower costs and achieve higher market acceptance.
2005-09-02	Singapore packager to expand flip-chip capacity Assembly and test company STATS ChipPAC Ltd is expanding its capacity for flip-chip assembly.
2007-05-17	R&D center for high-end packaging opens in Singapore STATS ChipPAC is laying the groundwork for its expansion into the high-end packaging market by building a new R&D center at its Singapore headquarters.
2013-01-31	Open ecosystem team up spawns 3D IC STATS ChipPAC and UMC unveiled a 3D chip stack, consisting of a Wide I/O memory test chip stacked upon a TSV-embedded 28nm processor test chip, which boasts package-level reliability success.
2009-07-07	MEMS devices grow, equipment drops The Information Network releases stats on global MEMS device, equipment, and materials markets.
2014-11-17	How to predict a hard drive's death After analysing SMART stats from thousands of failed hard drives, Backblaze found five attributes that will help determine if the drive is nearing its expiration.
2011-03-10	Flip chip packaging boasts 40% lower cost STATS ChipPAC releases a flip chip packaging technology, fcCUBE, that boasts high input/output density, high performance and reliability in advanced silicon nodes.
2011-10-10	eWLB tech aimed for mobile, cloud apps STATS ChipPAC's FO-WLP technology platform combines eWLB, TSV and IPD to enhance packaging solutions.
2013-08-22	Embedded packaging cuts PoP height by 40% STATS ChipPAC's ultra thin embedded Wafer Level Ball Grid Array (eWLB) technology offers height reduction in the bottom PoP architecture to provide an ultra thin z-height of 0.3mm.
2013-05-30	Collaboration to yield low cost interposers for 2.5D ICs ASTAR Institute of Microelectronics, Qualcomm Technologies and STATS* ChipPAC teamed up to address issues related to high volume manufacturing of 2.5D interposers.
2012-03-02	WSTS membership pull out: A wrong move for Intel, AMD Any industry, whether it's automobiles, semiconductor or veeblefetzers, will begin?once it stops collecting data within the industry?to lose a significant measure of its economic and political power in the greater world.
2005-03-21	Video codec is a study in power Mobilygen's new MG 1264 chip supports a two-channel AAC audio codec