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2009-06-25 Intel: Fab tool market savior?
Intel Corp. continues to fund technologies and procure fab-equipment, but behind the scenes, the company is investing in some companies and brokering deals for others, reportedly including ASM International NV and NuFlare Technology Inc., sources said.
2009-09-29 Intel set to transform TV viewing
Intel chief technology officer Justin Rattner described how technology might personalize TV by adding social networking capabilities and extending viewing to 3D.
2006-10-02 Indian engineers more aggressive than U.S. counterparts
A recent EE Times survey has painted contrasting pictures of go-getter engineers in India and today's typical U.S. engineer.
2015-01-14 IBM leads in patent wars; Google, Apple ranks climb
The US patent office granted a recorded 300,674 patents last year, up eight per cent, with most of the top 50 winners increasing their annual awards, according to IFI Claims Patent Services.
2014-11-25 Global inertial sensor market to hit $1.4B in 2019
Yole Developpement reported that in the overall inertial consumer sensor market, discrete and combo, ST is the leader with 40 per cent market share, going ahead of Bosch.
2007-06-05 Fluctuating forecasts muddle chipmakers' plans
Skepticism is growing about the outlook for 2007 and beyond with the mounting disconnect between consistently strong electronic end-equipment market demand and dwindling sales at semiconductor component suppliers.
2008-02-25 Flip Ultra camcorder delivers ode to clean design
When engineers at Pure Digital Inc. sat down a couple of years back to lay out their next project, they had many of the typical design criteria in mind: low cost, high quality, size, ease of use and low power.
2010-01-06 Fearless IC forecasts for 2010
2010 is just beginning to unfold in the electronics industry and there is already uncertainty in the air. EE Times' Mark LaPedus offers his chip forecasts and other prediction for 2010.
2002-12-19 FastRamp acquires Conexant test operation
FastRamp Test Services has agreed to acquire Conexant Systems Inc.'s test operations in San Diego, California.
2015-02-26 Fan-out wafer level packaging to reach $200 million, analysts say
Market researchers predict in a new report that the Fan-Out Wafer Level Packaging (FOWLP) market is likely to reach an estimated $200 million in 2015, expects 30 per cent CAGR in the following years.
2004-04-16 EDAC expands tracking of IP industry revenues
The EDA Consortium's Market Statistics Survey group, which tracks and reports quarterly EDA industry revenues, is expanding its tracking of silicon intellectual property (SIP), adding 40 new IP categories.
2014-11-19 Dreams can come true: China to rise as IC powerhouse
With nearly two decades of efforts aimed at creating a strong and thriving semiconductor industry, China's dream to become an IC powerhouse may come true after all.
2006-06-16 Design role drives 'new Europe'
Danube is riding a wave of economic expansion, fueled largely by the emergence of Hungary and neighboring countries as a hub for electronics design and development.
2007-05-25 Console war is no kids' game
Videogame systems have come a long way from the days of a paddle and a bouncing ballinteractive games, online play and realistic graphics have moved gaming from something that only kids play to a pastime of many.
2004-08-27 ChipMOS announces plans to acquire FICTA assets
Amid a major shakeout in the IC packaging and test industry, Taiwan chip packaging provider ChipMOS Technologies Bermuda Ltd announced on Aug. 24 plans to acquire the assets of another local subcontractor, First International Computer Testing and Assembly Technology Inc. (FICTA.).
2009-02-17 Chip packaging houses in red, too
Like the silicon foundries, IC-packaging houses are also seeing red ink.
2015-11-20 China's chip acquisitions send ripples across industry
The technologies and IP targeted by China include disk drives, CMOS image sensors, servers, memory chips and advanced semiconductor packaging and test services.
2015-07-15 China seeks Micron buyout for $23B
It's a good time to bid for Micron, second to Samsung among top memory chip makers. Micron's stock price slid this year from $35 to $17, despite the fact memory chip prices have been on the rise.
2014-09-05 China plots global chip domination
A group of Chinese investors, which include a state-owned firm, offered a buyout proposal to U.S. digital imaging chipmaker OmniVisiona move that will allow China instant access to the global market.
2015-05-19 China mulls future of wearables market
Chinese vendors see the nascent wearable market, despite its uncertainties, as their chance to seize the initiative, compared to their catch-up/copycat status in smartphones.
2005-09-06 Chartered tackles SoC designs at 2005 tech forums
Chartered Semiconductor Mfg announced details of its annual technology forum series entitled "Ready for the Smart Choice," on September 7 in Hsinchu, Taiwan, and September 22 in San Jose, California.
2015-11-05 Camera phone: From birth to how it transformed the world
A smartphone today without a camera is unthinkable, but two decades ago, this combination would have been an unthinkable marriage of two completely different products.
2005-08-26 ATE group adds members, loses Freescale
The Semiconductor Test Consortium (STC) - the Intel-backed group that is driving an "open standard" for automatic test equipment (ATE) - has gained some new partners but it also lost a founding member in Freescale Semiconductor Inc.
2014-09-16 Asia-Pacific hogs chip sales in computer, communications
Enjoying continued dominance as the leading market for IC sales in computer and communications categories, the Asia-Pacific region is also expected to gain top share in automotive systems segment.
2006-05-11 Asia seen driving next wave of chip growth
The global semiconductor industry can look forward to a period of steady growth, much of it driven by Asia's emerging economies, analysts and industry representatives said.
2009-08-21 APAC fixed broadband lines to reach 182M this year
Frost & Sullivan predicts there will be 182 million fixed broadband subscribers in Asia Pacific by 2H 09.
2002-06-01 Abstraction tackles interoperability
Applying abstraction methodologies can help developers of network-based devices match speed requirements with the rapid evolution of interoperability products.
2015-11-12 A*STAR set-ups high density, low-cost packaging consortium
Together with industry partners, A*STAR's IME has set-up a high-density FOWLP consortium to extend FOWLP capabilities for applications such as smartphones, tablets, navigation tools and gaming consoles.
2008-10-24 450mm wafer standard gets industry nod
Hoping to accelerate the development of 450mm fabs, International Sematech and others have formulated a preliminary standard for 450mm silicon wafers.
2009-01-06 2009 IC fearless forecasts
2009 is just beginning to unfold in the electronics industry and there is already a looming uncertainty based on recent industry data.
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