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2009-04-24 Tiny charger IC fits slimmer portable apps
Summit Microelectronics has released the SMB239 charger IC that enables slimmer designs for portable consumer electronics.
2007-12-11 Tiny 24bit audio DAC integrates high-output headphone amp
Asahi Kasei EMD has announced the AK4372 ultrasmall 24bit DAC with integrated high-output headphone amplifier.
2005-08-09 Tiniest' 1.2W Class-D audio amplifiers
Power Analog Microelectronics, a developer of Class-D digital audio amplifiers and innovative power management semiconductors, introduced what it touts as the world's smallest 1.2W Class-D audio amplifiers
2005-08-03 Tiniest' 1.2W Class-D audio amplifiers
Power Analog Microelectronics (PAM), a developer of Class-D digital audio amplifiers and innovative power management semiconductors, introduced what it touts as the world's smallest 1.2W Class-D audio amplifiers
2006-10-19 TI, Mistral Software co-develop virtual CD changer ref design
Texas Instruments Inc. and Mistral Software Ltd are launching a virtual CD changer (VCDC) reference design for next-generation A/V applications.
2006-07-04 TI unveils new audio DSP for cars, home systems
Texas Instruments has announced the TAS3108 audio DSP that promises higher fidelity to car audio while providing cost-effective audio processing for home systems.
2006-10-06 TI unveils 'highest-power' single-chip Class D amp stage
TI says its TAS5261 is the industry's highest power single-chip Class D amplifier stage, delivering more than 300W into a 4-ohm speaker (or 220W into 6 ohms, 125W into 8 ohms) for AV and DVD receivers and home theater systems.
2007-01-10 TI intros charge pump-based headphone amp
Texas Instruments' TPA6130A2 is the first product in the company's DirectPath line of charge pump-based headphone amps.
2009-03-20 TI exec weighs in on iPhone, future smart phones
The next-generation smart phone will project high-definition movies, replace digital still cameras, pack more than 100Gbyte memory and be easy to use. That was the prediction of Marcelo Vieira, general manager of the smart phone business at Texas Instruments Inc.
2004-12-29 TI DSPs offer substantial price/performance ratio
TI announced full volume production of its two high performance digital signal processors (DSP)the TMS320C6410 and TMS320C6413.
2003-04-14 TI Class D audio amps have high efficiency
The TPA3000D family of Class D audio amplifiers from Texas Instruments exhibits 250kHz PWM operation and low output FET on-resistance.
2005-01-13 TI announces new audio reference design, beta version audio processor
TI introduced its latest audio processor and a beta version of its upcoming production-ready reference design for portable audio apps.
2002-07-30 Three-Five microdisplay offers 150x image magnification
Three-Five Systems Inc. has introduced the Brillian Z86D-3 SVGA near-to-eye microdisplay that offers a pixel fill factor of 93 percent, resulting to non-pixilated images at 150x magnification.
2009-06-09 Three alternatives challenge HDMI
At least three companies are fielding new wired alternatives to the HDMI hopes to leapfrog the HDMI 1.4 specification by providing more bandwidth, reach or networking capabilities.
2005-11-07 Third-gen of Philips' EDGE solution now available
\Nexperia Cellular System Solution 5210 GSM/GPRS/EDGE platform incorporates a hardware and software design for multimedia performance.
2011-03-18 The revolutionary opportunities of Bluetooth low energy
Bluetooth is rapidly approaching saturation point as the ultimate means of data transfer for portable devices and features in approximately 80 percent of all mobile handsets worldwide.
2003-12-11 Technik connectors withstand 5,000 operating cycles
The TSH-381 A/V connector from Technik Ind. Co. Ltd is housed thermoplastic material with copper alloy contacts covered with plating. The product's adjacent opened terminals have an insulation resistance of >50 milliohms, while contact resistance of normally closed terminals is <0.03 ohms.
2010-11-15 Teardown: Kinect Xbox 360 add on has PrimeSense, Marvell, TI, ST parts
a teardown analysis performed by UBM TechInsights of Microsoft Corp.'s Kinect motion-gaming add on for its Xbox 360 found chips made by PrimeSense, Marvell, TI and STMicroelectronics.
2012-06-13 TDF8597, TDF8599A, TDF8599B class-D amps for automotive apps
Know the available application PCB and the I2C-bus control software.
2005-01-18 Taking a walk inside Bluetooth EDR
There's no doubt that Bluetooth technology has started to gain hold in the communication sector.
2015-02-24 Take a sneak peak at HTC One M9 smartphone
The phone will be powered by a 2GHz octo-core Qualcomm Snapdragon 810 processor with 3GB of RAM, 32GB of built-in storage and support for memory cards with capacities stretching to 128GB.
2008-05-05 Take a peek inside Sony's OLED TV
Sony released the first commercial OLED TV in December of 2007 with the code name XEL-1 that offered amazing technical specifications in an extremely small form factor.
2011-07-25 Taiwan postcards: A reporter's photojournal
EE Times' Rick Merritt shares photographs from his trip to Taipe and Hsinchu, where he visited ODMs, the companies who design and make the vast majority of the world's notebooks, desktops and servers.
2006-04-27 Switches combine USB, low distortion capabilities
Intersil Corp.'s dual single-pole, double-throw switches are said to combine low distortion audio and accurate USB 2.0 full speed data signal switching in the same low voltage device.
2003-11-04 STMicro driver IC cuts cellphone component count
STMicroelectronics has introduced a headset and speaker driver IC for mobile phones that includes an audio amplifier and digital volume control.
2004-01-14 STMicro audio processors suit all TV platforms
STMicroelectronics has introduced a family of multi-standard TV sound demodulation and audio processing devices.
2004-11-23 Star Micronics, Sarnoff team on cell phone components
Star Micronics Co. Ltd and Sarnoff Corp. have signed an agreement to jointly develop new components and complete products for the mobile phone, video recorder, automotive, and other markets.
2005-10-17 Standard boosts automotive Bluetooth streaming
Generic Media Control Profile offers device-neutral user experience with automotive multimedia.
2011-09-15 ST-Ericsson opens tech center, beefs up mobile portfolio
The company's new technical center will provide local support and product demos for its wireless mobile products.
2006-01-16 ST announces new DTV solution
ST introduced a dual-channel DTV solution called DTV100. This production-ready reference design is based on the company's STD2000 single-chip HDTV processor, which is manufactured in 90nm CMOS technology.
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