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2003-10-01 A rebirth of IC compilation
R. Goering rediscovers an old paradigm for designing sub-100nm ICs in an interview with Rajeev Madhavan, Magma Design Automation's CEO: silicon compilation
2003-01-22 UMC extends licensing deal with Numerical Tech
United Microelectronics Corp. has extended its phase-shifting technology licensing agreement with Numerical Technologies Inc. as UMC migrates to the 90nm process-generation.
2004-11-01 Wanted: New class of engineering generalists for DFM
Symposium sees need for 'tall and fat' engineers to help 'reintegrate' IC production
2003-10-03 Life-long testing prescribed for chips
Chip testing strategies continue to perplex the industry as sub-100nm node designs become more commonplace
2004-08-09 FEI, Zyvex ink strategic alliance deal
FEI Co. and Zyvex Corp. have signed an agreement to provide real-world solutions for electrical/IC probing applications
2003-04-23 TSMC will expand test, assembly services to spur demand
In an effort to remove barriers to chip production, Taiwan Semiconductor Mfg Co. will announce an expansion of its test and assembly services and additional guidance for chipmakers on how to prevent manufacturing delays.
2005-01-03 Test experts ponder cost of defects
Is 100 DPPM too tough to be practical for designs in 100nm or finer processes
2010-04-07 Quest for the right road to lithography
The industry has long known that without a viable NGL solutionwhich most assumed would be EUVMoore's Law scaling would slow and the secular growth rate of the IC industry would decline
2006-02-14 Evanescent wave litho to surface at SPIE
Is a technology called evanescent wave lithography the next big thing in IC manufacturing? It's unclear, but RIT claims to have printed 26nm images based on EWL
2003-01-07 The "new transistor"
The challenges the global electronics industry is presently experiencing have no equal in the past 50 years.
2005-04-18 Nanoimprint litho makes its mark at SPIE
While nanoimprint vendors made impressive claims in a recent conference in California, analysts noted that the market is in its infancy.
2004-02-26 IBM, Tera claim RTL handoff flow
Tera Systems and IBM Microelectronics have begun offering what they call the first production-ready RTL handoff flow.
2004-02-02 Changing face of chip design
Spurred by growing complexity, electronic system-level design startups and tools are emerging at a rapid rate.
2002-03-11 SoC stumbling blocks cataloged at DATE
It's not enough to be fast, efficient and technically proficient. Designers now must become Renaissance engineers.
2010-08-20 Fab capacity use reaches 95.6%
The Semiconductor International Capacity Statistics (SICAS) organization reports that almost all semiconductor manufacturing capacity in most leading-edge nodes was used in Q2 1010.
2015-07-30 Diamond substrate unleashes GaN potential
Diamond substrates and heat spreaders enable GaN devices to operate near its peak power output without degradation in lifetime.
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