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2000-03-01 Surface-Mount IC packages
This application note highlights the benefits of using surface-mount technology as the answer to the many limitations of dual in-line packages (DIP) and flatpack assemblies
2014-08-27 Handling, process guidelines for surface mount IC
This application note provides recommendations for handling, storing and mounting of Texas Instruments' surface mount IC packages. It can be used as a guideline and reference to support customers.
1999-11-02 Ultra miniature surface mount transistor packages: Concerns for design engineers
This paper talks about surface mount technology and its design concerns that engineers should not overlook
2004-05-19 TI rolls out IC controller, PoE power module
Texas Instruments Inc. has launched an IC controller and a Power-over-Ethernet (PoE) plug-in power module that reduces design time and eases implementation of Ethernet-powered industrial and commercial devices
2011-01-21 Thermally efficient power conversion IC has low-profile
Power Integrations' TOPSwitch-JX eliminates heatsink and achieves
2016-04-01 There's more to IC design than just circuits
It takes a village to get complex semiconductors out to market, from design, packaging, test and manufacture. It benefits everyone in the team to know where a product is headed.
2003-10-07 TAOS opto-sensors to come in surface-mount packages
Texas Advanced Optoelectronic Solutions Inc. (TAOS) has announced plans to offer all of the company's optoelectronic sensor solution product families in surface mount packages
2006-11-10 SmartRectifier IC targets home entertainment apps
International Rectifier has introduced the IR1166 SmartRectifier IC for AC-DC power converters used in home, computer and audio applications
2006-04-17 SmartRectifier IC tailored for digital computing systems
International Rectifier introduced the IR1167 SmartRectifier IC for AC/DC power converters for digital computing and home entertainment systems
2008-06-30 Rohm launches Hall effect IC switches
Rohm Electronics formally introduces its complete line of Hall Effect ICs for portable electronics applications.
2008-08-08 Photo-IC ambient light sensor brightens CE, PCs
Toshiba America Electronic Components Inc. introduces the TPS859, an ultracompact device to its family of photo-IC ambient light sensors
2002-05-07 ON Semi expands logic IC portfolio
ON Semiconductor has added three analog switches and a multiplexer to its logic IC portfolio, for use in cellular handsets and basestations, A/V systems, STBs, and communications switches
2005-09-05 Mixed-signal IC specialist enters frequency control market
Silicon Laboratories has entered the frequency control market with the introduction of two families of high-frequency, low-jitter crystal oscillators (XOs) and voltage-controlled crystal oscillators (VCXOs) for apps up to 1.4GHz.
2002-12-13 Maxim power supply IC occupies smaller footprint
The company's MAX1534 triple-output, keep-alive power supply IC is packaged in a 16-pin, 4-by-4mm QFN - occupying 33 percent less board space than discrete solutions
2007-05-30 Inverter IC trims power use in white goods
Mitsubishi Electric Europe's M81500FP inverter IC is not only the world's smallest IPM for the 90W range but is also the first in its class is integrated in an SMD package
2015-07-20 Hermetic GaAs IC SPST switch features 1.1dB loss at 6GHz
Skyworks said the wideband DC-6GHz ISO13316 performs with 45dB isolation at 2GHz, geared for high-reliability space, satellite and defence applications.
2008-02-07 GaAs MMIC packaging uses surface-mount tech
Mimix Broadband Inc. introduced surface mount technology (SMT) packaged, GaAs monolithic microwave IC receiver and transmitter devices that cover the 35-45GHz and 36-42GHz frequency bands.
2002-10-29 C&D surface-mount dc/dc converter has 5.5mm profile
The company's NTH series of 2W, dual-isolated output dc/dc converters occupies a footprint of 3.16cm? and has a profile of 5.5mm.
2002-04-29 ADI display interface IC uses
esigned for LC projectors, HDTVs, and projectors, the AD9882 display interface IC from Analog Devices Inc. provides an analog interface and Digital Visual Interface (DVI) capability, and uses the
1999-11-16 A high power IC surface mount package: PowerSO-20 power IC packaging from insertion to surface mounting
A high-power IC surface-mount package family is introduced in this note. It is called PowerSO family and has the JEDEC registration MO-166.
2008-09-29 3-axis compass IC delivers better map readings
Honeywell has developed a 3-axis compass IC in a chip-scale package designed to improve accuracy and location readings in consumer electronics applications
2003-10-03 Surface Mount Assembly and Handling of ANADIGICS LPCC Packages
This application note outlines the steps necessary for the handling and assembly of ANADIGICS power amplifiers in LPCC packages.
2002-12-20 STMicro switch IC fits portable systems
The STG3157CTR SPDT analog switch operates from a 1.65V to 5.5V supply and is packaged in a SOT-323 6-lead surface-mount package
2008-09-09 ST takes wrap off AC-switch gate driver with supervisor IC
The STCC08 from STMicroelectronics is said to be the first solid-state AC-switch driver to integrate switch-supervision, allowing designers to save board space and reduce workload with a straightforward solution for mains-powered devices designed to meet IEC60335-1 and IEC60730-1 safety standards.
2001-04-20 Innovative mounting techniques enhance thermal performance of the surface-mount D3Pak Package
This application note is intended to compare the thermal performance of various mounting methods for the D3PAK including classic SMD PCB mounting, insulated metal substrate (IMS) mount down, etc
2010-04-23 IC firms join hands to drive Pb-free solutions
Five IC firms have formed the DA5 consortium to investigate and standardize the acceptance of alternatives for high-lead solder for attaching die to semiconductor packages during manufacturing
2009-11-03 Hitachi takes over Renesas IC equipment biz
Deal seeks to implement integrated management of development through to manufacturing, sales and services.
2014-02-13 Ball grid array replaces standard IC packaging
One of the disadvantages of flip-chip BGA packaging is the dissipation of power and data rates on the enclosed product.
2002-08-22 Toshiba sensors reduce power consumption in mobile apps
The TPS850 and TPS851 photo IC illumination sensors from Toshiba Corp. are designed to reduce power consumption in mobile applications
2003-11-07 Toshiba photocoupler eyes digital signal transmission apps
To meet isolation requirements of advanced plasma display panels and other high-speed digital signal transmission applications, Toshiba Corp. has developed its high-speed IC photocoupler that supports signal transmission and switching speeds of 20Mbps
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