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2009-08-13 Mentor unveils open source plan
Mentor Graphics Corp. has detailed an Android and Linux strategy, which includes the acquisition of Embedded Alley Solutions Inc.
2015-03-05 Mentor Graphics buys Tanner, aims to expand IoT market
Mentor Graphics plans to expand its IoT market after acquiring the business assets of Tanner EDA, a leading tool provider for the design, layout and verification of AMS and MEMS ICs.
2014-08-28 MEMS plus piezoelectric equates to greater miniaturisation
ROHM established a process for MEMS that utilises thin-film piezoelectric elements. This combination is said to streamline design and reduce the size of processing controllers.
2010-03-02 Mellanox opens new R&D center in Israel
Mellanox Technologies Ltd has established its third R&D center in Gan Hataasiya Tel-Chai, Israel. The new center joins Mellanox's headquarters in Yokneam and its offices in Ramat Hachayal.
2004-08-04 MEI integrates electronic circuit capacitor business
Matsushita Electric Ind. Co. Ltd (MEI) has decided to transfer its film capacitor and other film-related products business of the Electronic Circuit Capacitor Division of MEI, to Matsushita Electronic Components Co. Ltd. (MACO), a subsidiary of MEI.
2010-01-20 MediaTek, AST Wireless to boosts TD-SCDMA
Through the strategic alliance with AST, MediaTek will deliver richer and more diversified products, thus making the TD-SCDMA industry stronger.
2007-07-10 Mechatronics paves way for driverless cars
Once dismissed as a fad, mechatronics has fulfilled its promise of smart autonomous electromechanical systems, used both in NASA's Rover and in the modern car.
2016-04-06 Lone ASIC vendor in Japan stands firm
Owned partly by Fujitsu and Panasonic, Socionext's business units include visual systems, IoT & graphics solutions, network SoCs, high performance SoCs, custom SoCs, Milbeaut and connected imaging.
2005-02-09 LCD maker to boost share in Fujitsu Hitachi Plasma Display
Hitachi Ltd has reached an agreement with Fujitsu Ltd regarding acquisition of Fujitsu Hitachi Plasma Display Ltd (FHP) stock owned by Fujitsu.
2002-11-14 Korea's Willtech sets sight on world measurement market
Chang Boo-Kwan, South Korean local entrepreneur and CEO of Willtech, recounts how the company pioneered the country's test and measurement industry.
2005-12-13 Korea Telecom, Alcatel target mobile wireless
Korea Telecom and Alcatel will establish a joint research center in a move to gain the top position in a recently-certified mobile wireless broadband service called WiBro.
2014-08-15 KEPCO buys Philippines' Naga Power Plant
The Korean power companythrough its joint venture with Cebu-based Salcon Power, KEPCO SPCoffered $26 million for the Naga Power Plant Complex, a bid it won over Aboitiz Group.
2010-02-09 Karnataka details semiconductor policy
The government of Karnataka, India IT department and the India Semiconductor Association (ISA), rolled out the state semiconductor policy at the 5th ISA Vision Summit 2010.
2003-05-14 K&S to transfer wire bonder manufacturing facility
Kulicke & Soffa Ind. Inc. will relocate the manufacturing operations of its manual wire bonders from Haifa to its Yokneam, Israel facility.
2006-05-11 Is Intel spinning off NOR flash unit?
In a major reorganization, Intel disclosed that it will bring its NOR flash memory fabs and memory process technology development effort within the company's flash memory group.
2004-03-10 Ion Optics, IMT produce infrared gas sensors
Ion Optics Inc. and Innovative Micro Technology (IMT) have partnered to bring Ion Optics' SensorChip products into production. Ion Optic's SensorChip is a silicon micro-machined infrared gas sensor.
2006-06-27 Internet security solution has 16 MIPS64 cores
Portwell said its Kilin family products have a tremendous processing power enabled by up to 16 MIPS64 cores and a fully optimized packet arbitration mechanism.
2007-08-02 Intel, SiRF to bring GPS to mobile devices
Intel and SiRF Technology have entered into a license and joint development agreement to bring GPS capability to mobile devices.
2013-12-06 Intel upgrades communications processor
Coleto Creek is made in the same 32nm process as Cave Creek, but gets significantly higher performance marks due in part to "beefier accelerators" in the chip.
2012-02-23 Intel to make Tabula's 22nm devices
For years, Intel only dabbled in ASIC and foundry sector. Since the Achronix deal was announced, some analysts saw that the chip giant was set to increase its presence it the foundry space dominated by TSMC.
2006-05-30 Intel opens new design facility in Malaysia
Intel unveiled a new $40 million design and development center in Kulim, Malaysia, in a move the chipmaker said would complement its existing operations there.
2009-08-14 Intel licenses Nvidia SLI technology
Nvidia said motherboard makers licensed the technology to prepare for Intel Core i7 and i5 chips.
2004-06-18 Infineon to refocus its global design network
Despite improving business conditions, Infineon Technologies AG is reducing scaling back its international design and development centers as it struggles to manage the costs of its R&D network, industry sources said.
2006-01-02 Infineon split tracks new market realities
Word that Infineon will sever its memory-products group opens a window to the complex game of semiconductor manufacturing.
2002-01-02 Infineon Japan, PALTEK form distribution agreement
Infineon Technologies Japan K.K. and PALTEK Corp. have signed a distribution agreement on the sales of application-oriented semiconductors used in communication equipment.
2008-01-21 Infineon CEO: Chipmakers must build systems, not fabs
To survive the wave of consolidation rolling over the semiconductor industry, companies must shift their focus from building fabs to building systems, and they must engage with customers at deep technical levels, according to Wolfgang Ziebart, Infineon CEO.
2006-11-01 IMS day has not yet dawned
While IP Multimedia Subsystem promises to usher in the era of true network convergence, participants at last September's VON conference cautioned that its day has not yet dawned.
2015-05-12 Impact of piling on package manufacturing
To accomplish various performance enhancements, packaging engineers should consider intriguing combinations being constructed at the chip to package level.
2006-06-08 IMI, PSi forge partnership aimed at power market
Philippines-based Integrated Microelectronics Inc. and PSi Technologies announced an agreement to leverage the two companies' engineering capabilities and promote the Philippine brand in the global power market.
2012-11-09 IEEE 1149.1-2012 JTAG standard receives 85% ballot vote
Intellitech Corporation has received majority support from the IEEE for its 1149.1-2012 JTAG standard which enables IC test re-use from silicon to systems.
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