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2004-08-12 Huawei chooses LSI DSP cores for mobile
LSI Logic has landed another big win in the Asian markets, announcing on Aug. 9, 2004 that Huawei will integrate the ZSP400 and ZSP500 DSP cores into ASIC designs for third-generation (3G) wireless phones
2010-07-21 Hitachi implements Cadence verification system
Transaction-based acceleration technology is being used to implement the system-level verification environment for Ethernet routing/switching products
2007-09-04 Green Grid adds LSI as new member
LSI has joined The Green Grid, a non-profit consortium of IT companies and professionals seeking to lower the overall consumption of power in data centers around the globe
2006-11-02 Fujitsu-Advantest JV to offer LSI prototyping services
Fujitsu and Advantest entered an agreement to establish e-Shuttle Inc. to provide prototyping services for leading-edge LSI semiconductors
2006-08-16 FM-quality sound achieved by audio Tx LSI
THine Electronics has developed THG4649, an FM transmitter LSI for audio that claims to have the best sound quality in the industry
2005-07-29 Epson unveils USB controller LSI device for in-vehicle use
Epson will release a lineup of USB controller LSI products with expanded guaranteed operating temperatures for in-vehicle use
2008-07-25 DFI initiative gets LSI, ST on board
LSI and STMicroelectronics have joined the collaborative technical working group for the industry standard DDR-PHY Interface specification, which simplifies the interoperability between the memory controller and PHY
2005-09-29 Denali, LSI Logic ink agreement on memory interface IP
Denali Software Inc. and LSI Logic Corp. have entered into a strategic agreement on memory interface intellectual property (IP), the companies said
2006-03-09 Dell, EMC, Intel, LSI team to drive external storage standardization
Dell, EMC, Intel and LSI Logic announced the Storage Bridge Bay Working Group (SBB), a cooperative, non-profit effort created to drive standardization in entry-level external storage
2006-11-28 Decoder LSI enables quality voice generation
Rohm has developed a decoder LSI that features high-quality voice generation and low current consumption specifically developed for home electronic appliances
2004-12-03 Datang expands core licensing agreement with LSI Logic
Datang Technology Co. Ltd has extended its licensing agreement with LSI Logic to include the ZSP540 digital signal processor (DSP) for use in its 3G wireless applications
2005-04-28 Cypress PSoC selected by LSI Logic for software development kit
Cypress Semiconductor Corp. announced that LSI Logic is offering a Serial Attached SCSI (SAS) software development kit (SDK) based on Cypress's Programmable System-on-Chip (PSoC) mixed-signal array devices and programming software.
2008-08-18 Controller LSI enables high-speed flash storage
TDK Corp. has developed the GBDriver RA8 series of NAND flash memory controller LSI that are compatible with 2KByte/page and 4KByte/page NAND flash memories
2003-04-28 ARM, DSP makers team on system-on-chip spec
ARM Ltd has announced that it is teaming with DSP vendors to create an integration specification that would make it simpler for designers to debug systems that employ a microprocessor and DSP.
2003-04-21 ARC technology selected by LSI Logic
ARC Int. has licensed its USB High-Speed On-the-Go and device technology to LSI Logic Corp
2012-01-17 12-in wafer bonding machine for 3D LSI ICs developed
In lieu of a conventional ion beam gun, the Bond Meister MWB-12-ST adopts a fast atom beam (FAB) gun to irradiate atoms for activating a material surface to bond.
2007-10-19 Single-chip LSI targets ATSC DTV systems
Renesas Technology's R8J66954BG offers single-chip implementation of major signal processing functions, from front-end signal input to later stages such as signal output to an LCD panel, for U.S. LCD DTVs.
2003-07-21 ROHM infrared module includes driver LSI
ROHM Co. Ltd has developed the RPM882-H7 IrDA infrared comms module that incorporates a built-in LED driver, and remote control transmission function.
2002-03-08 LSI Logic introduces 10Gb core solution for network apps
The company has announced the release of the System Packet Interface Level 4 Phase 2 IP core, allowing designers to design their ASICs with verified interoperability, simplifying interface design and reducing time-to-market of high-speed networking apps
2007-05-31 LSI chips support TV broadcasts on PCs
NEC Electronics Corp. unveils eight new MPEG encoder chips, the ?PD61250-7 model, targeted at PC TV tuner markets to enable OEMs to build powerful multimedia PCs to receive and record worldwide digital and analog TV broadcasts.
2002-12-27 LSI ADSL modem design integrates Intersil WLAN chip
LSI Logic Corp. has launched an ADSL modem reference design kit based on the company's HomeBASE chipset, integrated with Intersil's PRISM IEEE 802.11 WLAN chipset
2007-07-26 Hitachi unwraps contactless finger vein authentication system
Hitachi Ltd has unveiled its compact and contactless finger vein biometric authentication device and Software Development Kit (SDK).
2003-02-13 Hitachi technique to improve LSI performance
Hitachi Ltd has announced the development of a circuit technique that they claim is effective in achieving both high-speed performance and low power dissipation in LSIs such as SoC.
2008-02-06 Car LCD controller LSI rolls with video decoder
Oki Electric Industry has developed LCD controller LSIs for small- and mid-size LCD monitors that include video decoders compatible with the three major video standards and video adjustment functions.
2006-07-11 Audio system LSIs sound MP3 file playback
Rohm's BU9432-C1 and BU9434-C2 audio system LSIs integrate an MP3 decoder, DAC, system controller, USB host controller, and 3-output power supply
2002-09-11 Verification company in Japan formed thru collaboration
Tokyo Electron Ltd, Ebara Corp., and Dainippon Screen Mfg. Co. Ltd have entered into a memorandum of agreement to form a joint venture company, tentatively named E-Beam Corp.
2010-02-19 Toshiba, Fujitsu form assembly, test JV in China
Toshiba Corp. and Nantong Fujitsu Microelectronics Co. Ltd will form a manufacturing joint venture in China for the semiconductor back-end process.
2008-02-11 Toshiba touts 'fastest' embedded DRAM tech
Toshiba has developed what it claims to be the fastest circuit technology for embedded DRAM for System LSI, achieving a speed of 833MHz at 32Mbit density.
2003-04-23 Toshiba to manufacture 300mm wafers at new fab
Toshiba Corp. will start in June the construction of an advanced 300mm-wafer cleanroom for system LSIs at its Oita Operations plant in Oita prefecture, Kyushu, Japan
2003-08-06 Toshiba memory cell technology eyes DRAM apps
Toshiba has developed what it claims to be the world's first memory cell technology for embedded DRAM system LSIs on SOI wafers
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