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2004-02-23 NEC parallel clock technology operate up to 10GHz
NEC has developed a parallel clock technology that overcomes the limitations of clock frequency in system LSI devices.
2002-08-16 NEC chairman urges design-centric road to recovery
Chipmakers will have to get better at designing system-on-chip devices if they are to survive the current, crippling downturn, says NEC chairman
2013-02-12 Fujitsu, Panasonic confirm fabless chip venture
Fujitsu and Panasonic have announced that they will form an independent fabless chip firm through the merger of their system LSI businesses.
2009-01-15 DDR3 interface solution enables 1.6bit/s data rates
Panasonic Corp. has licensed Rambus Inc.'s DDR3 memory controller interface solution for system LSI implementation in consumer electronics products.
2002-09-13 Toshiba MPEG-4 codec eyes mobile apps
The TC35280XB video codec LSI encodes and decodes MPEG-4 A/V in mobile system for digital broadcasting and videophones.
2005-01-24 TI announces new WLAN solution
Texas Instruments announced the latest in its family of application specific system level WLAN solutions
2012-10-19 Team up to fast track mobile infrastructure, data centre network performance
LSI and 6WIND announced the availability of the 6WINDGate packet processing software for the LSI Axxia communication processor family
2002-10-03 SEMI's Oasis provides respite from GDSII
SEMI has rolled out the Open Artwork System Interchange Standard as a replacement for the GDSII file format, and said it promises a tenfold reduction in design data compared to GDSII
2006-02-27 Renesas licenses ARM multiprocessor
Renesas and ARM announced that Renesas has licensed the ARM11 MPCore multiprocessor, enabling the company to produce and sell LSI semiconductor solutions incorporating the ARM processor
2010-02-15 Processor handles multiprotocol processing at wire speed
LSI Corp. has launched its next-generation link communication processor (LCP) designed to allow migration of network traffic to IP-based networks
2007-03-02 NEC develops technology for design, quality inspection
NEC Corp. and NEC Electronics developed a technology that introduces signal jitter into an LSI's internal clock to accurately observe the internal operating margins of an LSI
2010-04-29 Multicore processors suit enterprise, data center nets
LSI Corp. has developed a portfolio of asymmetric multicore silicon solutions and software for use in enterprise and data center networking applications
2003-06-10 Major DSL suppliers back DMT line code for VDSL
Eleven DSL semiconductor and system vendors have supported a discrete multi-tone modulation as the line code for standard-compliant VDSL
2005-01-21 FineArch samples sound decoder that uses Ogg Vorbis format
FineArch has developed and manufactured on a trial basis the LSI FS-500 sound decoder with a low running clock frequency and on-chip memory using Ogg Vorbis
2009-01-12 Execs see bright future for India IC industry
India's portion of a $250 billion semiconductor market is marginal, yet for LSI Corp. president and CEO Abhi Talwakar, the nation remains firmly in the driver's seat of its own semiconductor and engineering design destiny
2008-08-28 DWA chip improves wireless USB comms
NEC Electronics announced that it has begun sample shipments of its new device wire adapter (DWA) LSI chip, part number ?PD720180A
2006-10-10 DWA chip connects wired USB peripherals to Certified WUSB systems
NEC Electronics and its subsidiaries have announced the availability of samples of a new device wire adapter LSI chip to enable the connection of wired USB peripherals to systems based on the Certified Wireless USB specification
2005-09-15 Do's and Don'ts of Architecting the Right FPGA Solution for DSP Design
Designing a flexible, programmable DSP system architecture is a daunting task
2009-03-06 Content processor now supports RMI multicores
In addition to Intel and AMD x86 processors, LSI Corp.'s Tarari T1000 Content Processors can now easily be coupled to RMI XLR Processor and XLS Processor families of multicore processors
2009-04-15 ASIC platform promises reduced NRE costs
ON Semiconductor Corp. has licensed 110nm process technology and associated IP from LSI Corp. to serve as the basis for a new ASIC platform, which is said to offer high-density and performance while minimizing non-recurring engineering (NRE) costs and time-to-market
2009-09-30 40nm PHY cuts validation, dev't costs in HDDs
LSI Corp. has begun shipping samples of the 40nm multi-interface PHY IP designed for notebook, desktop and enterprise hard disk drive (HDD) market segments
2008-07-10 12Gbit/s content processing board secures network
LSI Corp. announced the Tarari 8400 series of PCIe plug-and-play content processor boards designed to meet the high-performance needs of network security and telecom OEMs
2004-10-19 Xilinx, Toshiba form foundry relationship
Xilinx Inc. and Toshiba Corp. have formed a strategic foundry relationship under which Toshiba will manufacture Xilinx field programmable gate array (FPGA) products.
2007-11-05 What's the future for NEC Electronics?
A big question remains for NEC Electronics: Four years after being spun off from parent NEC Corp.and several management changes lateris the chipmaker heading in the right direction or is it destined to sink?
2014-10-10 Wafer foundry market teeters on edge of growth
The market's growth has fluctuated between a high of 39.4 per cent in 2010 and a low of 6.8 per cent in 2013, due mainly to the differentiation in wafer foundry industry.
2008-06-12 TSMC targets to unify 32nm design flow
Facing the 32nm challenge, Taiwan Semiconductor Manufacturing Co. Ltd is putting the pedal to the metal with a new design-for-manufacturing scheme.
2015-02-09 TSMC sues ex-employee over 28nm tech leak to Samsung
Analysts say that given TSMC's technology leadership, they were surprised when Samsung came abreast of TSMC in FinFET chips, the first of which are expected to be commercially available this year.
2008-02-22 Toshiba, Sony enter high-performance IC joint venture
Toshiba, Sony and Sony Computer Entertainment have entered a definitive agreement to form a new joint venture for the production of high-performance semiconductors.
2015-10-29 Toshiba, Sony confirm transfer of image sensor facilities
Sony and Toshiba aim to execute legally binding definitive agreements by the end of 2015. Afterward, the two Japanese companies will complete the transfer by March 31, 2016.
2002-09-16 Toshiba, Neolinear formulate new methodology for Soc design
Toshiba and Neolinear teams up to implement a new AMS design methodology that enables significant analog design reuse.
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