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2007-06-26 Tiny buck regulator ups system thermal performance
Fairchild Semiconductor's FAN2106 is the first product in a new family of TinyBuck DC/DC buck regulators that integrate an advanced analog IC, MOSFETs and a boot diode into an ultracompact MLP housing.
2005-12-21 Three new high-performance video amps from TI
Texas Instruments' new video amplifiers are touted to be the first to offer full I?C programmability of all functions independently for each channel.
2014-02-26 Significance of LED thermal characterisation
Learn how improving the thermal characterisation of LEDs will help to spur on the LED lighting revolution
2005-05-02 Science and art of telecom thermal design
Good thermal design is equal parts science and artan iterative process requiring constant adjustments based on real-world feedback
2005-05-17 Philips Semiconductor CTO outlines system-in-package challenges
The next step forward in integration has to address system-in-package (SIP) issues and needs EDA tools with broader scope and greater standardization of approach, according to Rene Penning de Vries, chief technology officer of Philips Semiconductors
2007-01-24 MOSFETs offer better thermal performance
Vishay is adding new n-channel 20V, 30V and 40V devices to its PolarPAK family of power MOSFETs with double-sided cooling, giving designers a new way to reduce system size and cost through better MOSFET thermal performance.
2007-09-18 MicroTCA power modules rolls for TEMs, system integrators
Ericsson Power Modules has introduced an evaluative level MicroTCA power module, part number ROA 117 5078/1, designed for telecom equipment manufacturers and system integrators
2004-07-16 Linear Tech controller IC with remote thermal monitoring
Linear Tech introduced an Intel VRM10 Pentium 4 power supply controller with precision current balancing and remote thermal monitoring
2013-05-27 Improving thermal analysis of LEDs
Here's a straightforward alternative to estimate the amount of heat generated by an LED based on Luminous Efficacy of Radiation.
2014-12-11 Half-bridge transistor touts 87 per cent system efficiency
The EPC2101 offers improved switching speed and thermal performance, as well as increased power density. It also aims to save space and lower system costs.
2005-03-04 Fairchild SPM with low thermal resistance
Fairchild introduced what it claims as the world's first Smart Power Module especially designed for driving single-phase switched reluctance motors for vacuum cleaners.
2005-08-08 DIMM improves thermal performance
Designed for server applications, Elpida's 4GB fully buffered dual in-line memory modules, part numbers EBE41FE4AAHA-5C-E and EBE41FE4AAHA-6E-E, can deliver up to 32GB of memory in an eight-slot server platform.
2015-03-10 Addressing difficult thermal analysis problems
Find out how a simple analogue ASIC can be used to solve a difficult thermal analysis problem. It allows system designers to fully model, measure and modify designs before committing to costly silicon
2007-05-25 40V MOSFET trims board space, system cost
Fairchild's FDD8424H, a complementary 40V MOSFET that provides Dual DPAK packaging and industry-leading thermal dissipation to increase system reliability, reduce board space and decrease overall system cost
2004-10-29 Zarlink LDDs provide 'industry-leading performance
The two new LDDs from Zarlink are touted by the company to deliver industry-leading DVD/CD write/rewrite performance for optical disc drives
2014-12-26 UV curable system touts up to 7,000psi tensile strength
The Master Bond UV15X-2 combines a high performance physical profile with very low shrinkage upon curing, and targets fibre optic, optical, electronic, microelectronic and laser applications
2013-04-23 Understand thermal management for power supplies
Know the basics of dissipating heat in power supplies while keeping the noise down.
2009-08-04 Understand thermal derating aspects of PWM ICs to ensure the best system performance
This article describes how to construct and calibrate a thermal-derating box for evaluating the thermal performance of PWM controllers
2007-02-20 UMTS transmit system rolls for multiregion 3G handsets
RFMD has released its RF628x family of products that provides a UMTS transmit system for the implementation of multiregion, multimode 3G handset platforms
2013-04-01 Transceiver system ready for next-gen Ethernet standard
FCI's single on-board transceiver system has a small footprint to save precious PCB real estate and offers different transceiver heat sink options to meet thermal application requirements
2005-02-17 TI DSP combines high performance, low power
TI rolled out a next generation programmable DSP capable of handling multiple 3G air interface standards and a range of base station form factors on a single chip.
2006-09-08 Thermal sensor delivers 1C accuracy
Maxim Integrated Products has introduced a 1.0C accurate thermal sensor for next-generation notebooks with upgradeable graphics systems
2008-05-09 Thermal management kit offers 100 heat sink options
ATS has introduced the Thermal Management Design Kit that contains 96 of its maxiFLOW heat sinks and maxiGRIP sink attachment systems
2006-06-27 Thermal management ICs generate market heat
Databeans Inc. thinks thermal management ICs are hot. With revenue hitting $674 million in 2005, the firm believes this market could reach just under $2 billion in 5 years
2014-11-05 Thermal evaluation method for TLV62065
Here's a look at an accurate evaluation method of junction temperature. This method is proven to be easy to use and have good accuracy and relevance to real applications.
2007-08-13 System management tool starts at $1.20
Actel has introduced a new reference design for embedded applications that enables intelligent system and power management implementations starting at $1.20
2012-04-27 Stepper motor driver reduces board space, improves thermal efficiency
Texas Instruments' new driver is designed for industrial, medical and consumer applications.
2008-10-01 Stacked microprocessor system promises better performance
Take a different approach to chill. A group of researchers just did, resulting in what may be the most efficient heat dissipation possible for stacked microprocessors.
2016-05-04 Selecting memory for high performance FPGA platforms
Given the competitive advantage a few nanoseconds can make, the type of memory used is also a critical aspect when building a custom FPGA-based solution.
2004-08-23 SDK unveils high-performance thermoelement
SDK disclosed that they have developed a high-performance thermoelement, a key component of modules that convert heat energy directly into electric energy
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