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2000-07-01 The CDMA receiver system in an IS-98-A standard
Reciprocal mixing, cross-modulation, spurious response and other RF issues should be considered carefully in the design of a CDMA receiver. The paper offers a derivation of essential specifications, block- and front-end level, for the receiver section of a CDMA handset.
2004-04-23 Teradyne sets up pin J750 test system in Russia
Teradyne Inc. has collaborated with Amideon Systems for the installation of the 512-pin J750 test system at the Scientific Research Institute of Electronic Engineering (RIEE) in Voronezh, Russia.
2002-12-27 Tegal to install "proteomics" analysis system in Zyomyx fab
Zyomyx Inc. has purchased a 903e plasma etch system from Tegal Corp.
2005-05-16 System-in-a-cube to improve quality of life
Wireless bioelectronics communication systems pave an avenue toward a healthy body and lifestyle
2010-08-06 SunPower completes largest solar power tracking system in Australia
SunPower Corp. announces its completion of a 505KW solar power installation for Horizon Power, a government-owned utility providing power to remote and regional communities and resource operations in Western Australia.
2006-02-24 South Korean firm offers T-DMB system-in-package
Integrant Technologies said it has developed a package-level decoder chipset that operates to Korea's mobile TV broadcasting standard called DMB.
2007-03-27 South Korea to implement e-passport system in '08
The government of South Korea will introduce a new electronic passport (e-passport) system with enhanced electronic security features on July 2008, according to a report from the Korea Herald.
2002-01-22 R&D consortium eyes system-in-package substrates
Five Japanese companies have formed an R&D association to develop materials and technologies for high-density substrates that will be used in system-in-package devices.
2008-02-11 Putting the system in electronic system design
The narrow scope of most ESL approaches and tools has limited their adoption. A more encompassing methodology, one that steps beyond the SoC, is needed to dramatically reduce time, cost and errors in complex system development.
2005-05-17 Philips Semiconductor CTO outlines system-in-package challenges
The next step forward in integration has to address system-in-package (SIP) issues and needs EDA tools with broader scope and greater standardization of approach, according to Rene Penning de Vries, chief technology officer of Philips Semiconductors.
2004-11-19 OptiLED unveils HIVE modular system in Asia-Pacific
OptiLED introduced its new High Intensity Vorticular Enclosure (HIVE) modular system to the Asia-Pacific market.
2010-10-18 NXP to test ATOP-based automotive telematics system in Singapore
NXP Semiconductors building 3.5G automotive-qualified telematics solution for traffic management
2010-11-12 NXP tests eCall car emergency system in Europe field trial
NXP and partners test eCall system across Europe
2008-09-22 NXP solution embedded in accident alert system in cars
NXP Semiconductors has signed up to support eCall, the the pan- European emergency call system.
2006-03-07 LeCroy to deploy Harvey's shipping system in Malaysian facility
Harvey Software announced it has reached an agreement with LeCroy to deploy Harvey Software's new CPS shipping system for Asia-origin shippers at its newest facility in Malaysia.
2005-07-18 Implement component partitioning for system-in-package apps
SiP alternatives need broader supplier collaboration on system-partitioning decisions within the electronics food chain.
2004-02-02 Design considerations of a power management system in mobile phone handsets
This technical feature discusses the challenges designers face as mobile handsets become crammed with sophisticated and complex features.
2004-05-12 Custom dice tossed for system-in-package
A fabless DRAM company that has been providing product to select partners for some time, albeit in stealth mode, will take off the wraps this week.
2001-05-01 Booting a TMS320C32 target system in a C environment
This application note describes methods to boot a TMS320C32 DSP target system in a C environment.
2002-10-15 Autron to market Cogiscan system in Asia
Cogiscan has partnered with Autron Corp. Ltd to resell and market its Cogiscan MSD control system for Moisture Sensitive Device tracking to the Asian electronics manufacturing market.
2004-11-12 Tessera, Matsushita sign packaging agreement
Tessera Technologies Inc. has signed a technology licensing agreement with Matsushita Electric Ind. Co. Ltd (MEI), giving the Japanese consumer electronic supplier access to its IP portfolio of multi-chip and chip-scale packages.
2004-02-12 STATS to merge with ChipPAC
ST Assembly Test Services (STAT) and ChipPAC have agreed to merge their businesses to create an independent semiconductor assembly and test solutions company.
2005-06-23 Stacked package from Sharp allows 0.5-mm grid
Sharp Corp. has developed packaging technology that allows stacking of multiple packages with 0.5mm pitch ball grids, which the company claims is the industry's tightest pitch.
2007-12-20 Staccato design tool aims at wireless USB video apps
Staccato Communications' latest reference design for its Ripcord family of ICs delivers a compact form-factor design for a cost-effective path for Wireless USB connectivity with existing USB devices.
2012-10-05 ST pushes for wireless MEMS
A system-in-package approach to MEMS ll yield wireless MEMS components by the end of 2013 and could see integration of gas sensors in environmental MEMS in 2014.
2005-09-16 SiP: a window of opportunity for passives
In the great debate of SoC vs. SiP, design engineers usually get tangled in the delicate technical intricacies while missing an important pointthe implications on the passive component industry.
2005-03-18 SiP solution offers faster throughput
Philips' 802.11g WLAN semiconductor SiP solution enables consumers to access content up to five times faster than current 802.11b products without compromising the battery life of the mobile phone.
2014-09-18 SiP sol'n offers precision sensing in portable medical devices
ON Semiconductor introduced Struix, a semi-customisable SiP solution for precision sensing and monitoring in various mobile medical electronics such as glucose monitors and heart rate monitors.
2007-01-29 SiP lacks EDA tool support
System-in-package (SiP) may be an increasingly attractive alternative to SoCs, but EDA tool support is sorely lacking.
2010-12-01 SiP eases mobile entry into NFC
The SecuRead system-in-package for NFC mobile devices includes an NFC controller, security controller, Java Card OS and an open NFC protocol stack.
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