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2005-03-18 SiP solution offers faster throughput
Philips' 802.11g WLAN semiconductor SiP solution enables consumers to access content up to five times faster than current 802.11b products without compromising the battery life of the mobile phone.
2005-06-01 Freescale rolls out SiP ZigBee solution
Freescale expanded its product offerings for wireless monitoring and control applications by delivering a cost-effective system-in-a-package ZigBee solution
2005-04-21 Filter cleans low-voltage supplies
Picor's QPO-2 System-in-a-Package is an active power filter that reduces a supply's output ripple and noise by more than 30dB from 1kHz to 500kHz.
2007-07-06 Ballast ICs save space in CFL, LFL lightning apps
Fairchild Semiconductor introduces FAN7710/FAN7711 devices that promise to save board space and reduce component count in CFL/LFL lighting applications.
2006-06-08 Wireless USB SiP includes development kit
Staccato Communications is debuting a reference design kit for developers of Certified Wireless USB HWA and DWA designs.
2015-10-14 VeriSilicon to buy embedded GPU IP vendor
VeriSilicon said the addition of Vivante will provide a shot in the arm for its growing IP portfolio in a deal that will also increase VeriSilicon's exposure to the Tier One customer base.
2002-12-24 Semiconductor packaging market to experience growth in '03
The worldwide semiconductor packaging and assembly segment is poised for growth in 2003, according to Dataquest Inc., a unit of Gartner Inc.
2007-10-02 SanDisk opens SiP production facility in China
SanDisk has announced the opening of its production facility in Shanghai, China, which produces a flash memory-based chip package called SiP.
2005-01-21 Samsung develops 512MB DRAM for mobile devices
Samsung has completed a working prototype of a 512MB DRAM for mobile products that operates at up to 333Mbps, transmitting 32 bits of data simultaneously.
2003-12-01 Philips releases Bluetooth SiP solution
Royal Philips Electronics has unveiled the industry's first complete plug-and-play Bluetooth solution in a single, low-cost chip package.
2005-03-17 Philips debuts reference design for converged handsets
Philips took the wraps off a complete UMA reference design for converged mobile handsets at the CTIA Wireless
2005-03-17 Philips debuts reference design for converged handsets
Philips Electronics took the wraps off a complete Unlicensed Mobile Access (UMA) reference design for converged mobile handsets at the CTIA Wireless show Monday (March 14) and said it is working with Alcatel on interoperability tests between UMA handsets based on the Nexperia reference design and the French group's Spatial Atrium server/softswitch
2015-05-06 NXP, Qualcomm to bring 'Apply Pay' to Android phones
The collaboration between the two will go beyond mobile payment applications for smartphones. They plan to develop new reference designs to expand the reach of NFC into other applications.
2006-06-19 Mobile TV disappoints World Cup fans
The poor performance of mobile TV during the World Cup in Germany made for a disappointing user experience.
2014-11-12 GQFN package shrinks devices by up to 60%
Aside from reducing package size, the grid array flat no-lead package also enables improved electrical performance through lower inductance and capacitance.
2014-06-24 FPGAs afford server boosts in datacentres
Bing is rolling out Stratix-based fabric on servers to accelerate processing of customer searches, an approach that Microsoft revealed to improve ranking server throughput by 95 per cent.
2009-03-05 DC/DC regulators withstand extreme temp
Linear Technology Corp. has developed the LTM8020MPV, LTM8022MPV and LTM8023MPV complete and encapsulated 200mA, 1A and 2A, 36V input switching DC/DC regulator systems tested for extreme temperatures ranging from -55C to 125C.
2005-07-19 CMOS IC acts as analog front end
ProTek Analog released a mixed-signal CMOS monolithic device that integrates analog-to-digital converter conversion operations on a single chip
2002-01-09 ChipPAC qualifies 300mm wafer packaging
ChipPAC Inc., a provider of semiconductor assembly and test services, has qualified all of its front-end assembly operations in the 300mm wafer packaging.
2010-10-08 Battery chargers output 2A from up to 32V input
Linear Technology's new battery chargers boast active current limit, host of features
2012-10-05 Altera moves from Cu to optical backplanes
Improving the I/O bandwidth to support 28Gb/s backplane links and a new DSP architecture that focuses on the bandwidth are key elements of the 20nm products that Altera will launch next year.
2014-05-26 7nm, 5nm scaling compels adoption of new materials
Shifting advanced nodes involve exploring alternativesfrom silicon to graphene, FinFET to SOIand considering how to apply the strengths associated with 3D device architectures to new technologies.
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