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2006-02-24 South Korean firm offers T-DMB system-in-package
Integrant Technologies said it has developed a package-level decoder chipset that operates to Korea's mobile TV broadcasting standard called DMB.
2002-01-22 R&D consortium eyes system-in-package substrates
Five Japanese companies have formed an R&D association to develop materials and technologies for high-density substrates that will be used in system-in-package devices.
2005-05-17 Philips Semiconductor CTO outlines system-in-package challenges
The next step forward in integration has to address system-in-package (SIP) issues and needs EDA tools with broader scope and greater standardization of approach, according to Rene Penning de Vries, chief technology officer of Philips Semiconductors.
2005-07-18 Implement component partitioning for system-in-package apps
SiP alternatives need broader supplier collaboration on system-partitioning decisions within the electronics food chain.
2004-05-12 Custom dice tossed for system-in-package
A fabless DRAM company that has been providing product to select partners for some time, albeit in stealth mode, will take off the wraps this week.
2004-11-12 Tessera, Matsushita sign packaging agreement
Tessera Technologies Inc. has signed a technology licensing agreement with Matsushita Electric Ind. Co. Ltd (MEI), giving the Japanese consumer electronic supplier access to its IP portfolio of multi-chip and chip-scale packages.
2004-02-12 STATS to merge with ChipPAC
ST Assembly Test Services (STAT) and ChipPAC have agreed to merge their businesses to create an independent semiconductor assembly and test solutions company.
2005-06-23 Stacked package from Sharp allows 0.5-mm grid
Sharp Corp. has developed packaging technology that allows stacking of multiple packages with 0.5mm pitch ball grids, which the company claims is the industry's tightest pitch.
2007-12-20 Staccato design tool aims at wireless USB video apps
Staccato Communications' latest reference design for its Ripcord family of ICs delivers a compact form-factor design for a cost-effective path for Wireless USB connectivity with existing USB devices.
2012-10-05 ST pushes for wireless MEMS
A system-in-package approach to MEMS ll yield wireless MEMS components by the end of 2013 and could see integration of gas sensors in environmental MEMS in 2014.
2005-09-16 SiP: a window of opportunity for passives
In the great debate of SoC vs. SiP, design engineers usually get tangled in the delicate technical intricacies while missing an important pointthe implications on the passive component industry.
2014-09-18 SiP sol'n offers precision sensing in portable medical devices
ON Semiconductor introduced Struix, a semi-customisable SiP solution for precision sensing and monitoring in various mobile medical electronics such as glucose monitors and heart rate monitors.
2007-01-29 SiP lacks EDA tool support
System-in-package (SiP) may be an increasingly attractive alternative to SoCs, but EDA tool support is sorely lacking.
2010-12-01 SiP eases mobile entry into NFC
The SecuRead system-in-package for NFC mobile devices includes an NFC controller, security controller, Java Card OS and an open NFC protocol stack.
2010-10-25 SiP device supports automotive LIN networking
Atmel unveiled a new SiP solution for LIN automotive networking applications, the ATA6614.
2002-12-24 Semiconductor packaging market to experience growth in '03
The worldwide semiconductor packaging and assembly segment is poised for growth in 2003, according to Dataquest Inc., a unit of Gartner Inc.
2003-02-19 Samsung, Infineon co-develop solution for smart phones
Samsung Electronics and Infineon Technologies have jointly developed a semiconductor system solution combining both companies' technologies.
2009-03-11 R3Logic to advance 3D design flow R&D
R3Logic announced that it has created a new R&D center in Grenoble, France to develop and enhance its design tools for 3D heterogeneous system and system-in-package design.
2007-07-24 Qimonda ships samples of 75nm Mobile DRAM
Qimonda is sampling its first 512Mbit Mobile DRAMs in 75nm geometries.
2006-11-28 Pressures tip wireless apps toward SiP
System-in-Package technology has begun to challenge SoC implementations as a high-level design strategy for selected wireless applications because of lengthening SoC design cycles and other factors.
2014-05-27 Power modules minimise PCB space
The 600V devices from International Rectifier leverages the company's trench IGBTs and three-phase gate driver IC in a fully isolated, thermally-enhanced package for motor drive applications.
2006-02-16 Pinpoint the next big things in handsets
Upcoming phones are adopting higher-res imagers and MP3 playback capabilities, among other things.
2008-05-01 Partition and package to miniaturize handsets
Designers are turning to system-in-package, 3D IC stacking and wafer-level packaging to enable the acute miniaturization found in handsets, particularly for RF functions.
2006-10-19 Optimal announces enhancements to SiP analysis suite
Optimal is announcing chip/package/PCB co-design support in the form of enhancements to its Optimal SiP Analysis Suite.
2006-10-02 New tools, scalable methods facilitate SiP design
EDA-software providers must develop new tool functionality and present scalable design methods and flows in SiP.
2004-10-07 NEC reorganizes semiconductor assembly, testing operations
NEC Electronics Corp. has launched NEC Semicon Package Solutions Ltd, a back-end production company specializing in assembly and testing.
2013-12-13 Latest developments in 3D IC technologies
Here's a look at the various forms of 3D IC technology, starting with the simpler incarnations and culminating in today's start-of-the-art implementations.
2010-11-24 Intel SIP chip combines Atom, FPGA
Intel Corp. unveiled the first members of a family of system-in-package (SIP) products announced last September.
2004-05-13 Inapac solution integrates DRAM in SiP apps
Inapac has announced a solution for integrating DRAM into advanced SiP applications.
2002-12-10 Hitachi SiP to replace SoC in portable apps
Hitachi Ltd has developed the HJ931 series of System In Package (SiP) that combines the company's SuperH microprocessor and multiple memory chips in a single package using three-layer stack structure.
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