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2006-09-01 One-chip core logic eyes ultramobile PCs
Via Technologies Inc. is set to launch a single-chip core logic platform that squeezes a host of connectivity options and multimedia acceleration into a 35mm2 footprint.
2010-12-09 NXP, Google collaborate for Android NFC
NFC has been gaining momentum, and now NXP and Google have announced a partnership to integrate the short range wireless technology into handsets.
2007-10-09 NXP strengthens French operations with new R&D center
NXP Semiconductors has opened a new R&D center in Caen France with 800 engineers and researchers.
2013-04-02 Nvidia will push for 2.5D stacks on organic substrates
Organic substrates with new I/O techniques could pave the road to a 2.5D chip stack for Nvidia, said R&D VP William Dally.
2013-11-22 Novel dielectric material to enhance eWLB packages
Nanium released an improved dielectric material and process solution for its fan-out wafer-level packaging (FOWLP) technology, embedded wafer-level ball grid array (eWLB).
2006-01-16 NoC: A new venue for system innovation
The SoC concept has evolved through a number of design challenges over the years and so has the number of semiconductor IP blocks.
2016-02-29 NFC sol'n enables secure ARM mbed wearable reference design
The NFC solution is composed of the ST54E from ST, a SiP featuring an NFCC and a secure element compliant with the GlobalPlatform standard v2.2, and Ams' AS39230 NFC AFE with boostedNFC technology.
2012-02-28 NFC controller to enable contactless apps, mobile services
ST expands its Secure Elements portfolio with the ST21NFCA that the company said covers the full range of NFC use cases and requirements for handset manufacturers and mobile network operators.
2006-11-07 Nexperia solution powers SIM Tech UMA phones
NXP Semiconductors announced that SIM Technology is using the Nexperia cellular system solution 6120 to provide Unlicensed Mobile Access handsets around the world.
2006-08-22 New dice interconnects support up to 100Gbps
NEC Electronics has a wafer-level packaging technology that it says permits more than 1,000 3D interconnections between the logic and memory dice used in an image-processing system.
2005-10-14 Multi-die packaging gains ground, says analyst
Applications such as cellular telephones, Bluetooth, and digital cameras are going to cause the market for high-density packaging market to grow by 32 percent in 2005 to 1.5 billion units, according The Information Network, a market research company.
2008-05-22 Mobile WiMAX IC integrates advanced baseband functionality
Sequans has introduced a new mobile single chip solution, which is claimed to integrate advanced baseband functionality plus radio frequency and SDRAM.
2007-04-30 Mobile TV receiver has multistandard baseband
Frontier Silicon's single-chip receiver for T-DMB and DAB-IP integrates the Paradiso multistandard baseband IC with an RF tuner and ancillary passive components.
2008-08-18 Mobile TV marches on
The deployment of DVB-T for mobile TV has already started in Europe, China and in other parts of Asia despite the higher power consumption. Recently, a new and fast emerging segment that is taking traction is in-car mobile TV. This application requires multiple antennas to support diversity in ensuring consistently good picture quality.
2013-05-03 Microchip expands LIN 2.1/SAE J2602-2 devices
The firms released the LIN 2.1 and SAE J2602-2 compliant and low-power MCP2003A transceiver, MCP2021A, MCP2022A, MCP2025 and MCP2050 LIN SBCs, and PIC16F1829LIN SiP.
2006-11-01 MEMS resonator operates at 5.1MHz
The SiT0100 MEMS resonator from SiTime measures 0.8(H)-by-0.6(W)-by-0.15(T)mm, and is compatible with standard semiconductor packaging for SIP and MCM.
2012-04-10 MEMS packing leapfrogs IC packaging growth
The MEMS packaging market is growing twice as fast as the overall IC packaging market in terms of units shipped and is expected to grow at a CAGR of about 20 percent over the next five years.
2008-04-14 MEMS markets up for major boom
According to Wicht Technologie Consulting, the current $2.5-million market for MEMS oscillators will grow to $140 million by 2012, and thereafter MEMS oscillators could also begin penetrating the $1-billion market for mobile handset timing chips.
2010-01-07 MEMS compass improves mobile navigation, LBS
STMicroelectronics has combined a three-axis digital accelerometer with a three-axis digital magnetic sensor in a single module, aimed at enhancing mobile navigation and location-based services.
2016-01-06 MediaTek delivers chip series for wearables, smart home apps
MediaTek announced its new chip series dedicated for wearable devices, smart home applications as well as Ultra-HD 4K Blu-ray players at the Consumer Electronics Show 2016.
2004-04-23 Media processors offer MPEG-4, JPEG hardware encoding, decoding
Fujitsu's two Mobile Media Processors for mobile phones and other handheld devices boast MPEG-4 and JPEG hardware encoding and decoding functionality.
2007-10-09 Master the I/O planning puzzle
Systemwide I/O planning is an exercise in coordinating device placement with associated pin and net assignments across the chip-package-board system to maximize system quality for the target application. Achieving this goal is a multidomain balancing act of tradeoffs and iterations.
2015-02-25 Marvell unveils novel interconnects, memory architectures
Marvell's MoChi interconnect is based on the ARM AXI link running at 8Gb/s or faster, while its Final-Level Cache technology aims to cut the amount of DRAM main memory needed in a system.
2015-03-19 Marvell pushes for FLC-MoChi approach
Marvell President Weili Dai explained that the FLC-MoChi approach will significantly reduce the cost, power and size of electronics systemswhether PC, server, smartphone or wearable.
2008-02-05 Linear Tech debuts SiP signal chain receiver modules
Linear Technology has introduced the LTM9001, the first in a series of SiP signal chain receiver modules using its ?Module technology.
2007-02-16 LIN node SiP rolls for automotive actuator apps
Atmel's new multichip modules combine an MCU and a LIN SBC in a single SiP designed for automotive actuator applications typically found in comfort electronics as well as in powertrain applications.
2007-12-17 Life is still beautiful for EEs
Life is relatively good for engineersat least according to their responses to the EE Times Annual Salary and Opinion Survey.
2003-02-12 Java accelerator blends with memories to fit into cellphone
NanoAmp Solutions Inc. claims it has Flash and packaging partners who will make as early as May the combo chips for <$4 premium over the existing memory devices.
2013-02-14 Is the demise of high-speed I/O near?
High-speed serial interfaces featuring equalisation may be the norm in the future, and high levels of SoC integration may no longer be the best solution.
2007-08-16 iPhone sparkles with key design-in wins
Analysts at Semiconductor Insights and Portelligent went inside the iPhone to uncover the technologies and companies behind the hottest consumer device on the planet.
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