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2007-12-10 Intel forms new group for SoC design venture
Intel has established a new SoC enablement group, in line with its efforts both in multicore PC processors and SoCs for sockets outside its traditional PC markets.
2011-06-17 Integration, regulation rev up automotive MEMS
This special report outlines emerging trends in automotive MEMS, such as microbolometers and CMOS image sensors, and the integration of multiple sensors, supporting processors and communication functions.
2005-05-16 Integration gets serious
In today's digital era, designers are seriously integrating RF, mixed signal functionality in devices.
2004-01-20 Innovation to drive chip performance curve
When a guy like Bernard S. Meyerson, CTO of IBM Microelectronics, tells a roomful of Taiwanese designers and process engineers that traditional CMOS scaling is dead, they take it in stride.
2002-08-15 Infineon develops new chip stacking technique
Infineon Technologies has developed a new method in IC package stacking using a soldering method called solid liquid interdiffusion (SOLID).
2014-08-22 Infineon buys IR to reposition itself in chip industry
The German company is paying $3 billion in cash for Internal Rectifier, an acquisition that will expand its expertise in compound semiconductors, as well as facilitate a stronger market presence.
2014-09-10 Inertial-sensor chipset reduces power consumption
The LSM6DS3 chipset will improve the development of battery-powered smart sensor systems to be embedded in mobile and wearable devices and innovative objects for the IoT.
2015-10-26 Impact of wearables, IoT on electronic design
Today's IoT and wearable products must deliver ever-increasing capabilities in smaller packages with more aerodynamic shapes. Engineers will need all the help they can get.
2007-06-01 IBM gets on the road to 3D packaging
News that IBM Corp. this year will sample its first commercial devices to make direct metal connections between chips marks a small but significant milestone on the road to 3D packaging.
2005-05-03 Hynix, ST begin work on China memory fab
Work has begun on the construction of a memory manufacturing wafer fab in Wuxi City, Jiangsu Province, China; a joint-venture between STMicroelectronics NV and Hynix Semiconductors Inc.
2011-10-13 Home energy sol'n supports WiFi, Ethernet, HomePlug GP
Freescale teams up with Qualcomm Atheros to come up with a home energy management system using Smart Energy Profile 2.0.
2015-12-01 HMC, HBM gain wider appeal for computing networking apps
An expert said that while HMC and HBM products are rolling out along with DDR4, it's clear there's room for all three technologies to find market share as standards take time to settle into place.
2007-02-01 H.264 codec targets Japan, South Korea markets
Several IC firms are testing the waters for H.264 High Profile codecs in hopes of claiming design turf in high-definition DSCs, digital video camcorders and storage devices.
2014-07-28 Google, Facebook clash steps up in data centre networking space
Google and Facebook will share their visions of data centre networking, likely both similar and competing, at the Hot Interconnects event in August.
2014-05-02 Google exploits Apple's technology for its Project Tango
An iFixit teardown revealed that the Tango platform equips a 3D imaging chip from Apple-acquired PrimeSense to help execute the 3D motion tracking of Android-based mobile device, bringing to the fore the issue whether Google "beat Apple to the punch with their own technology."
2004-12-01 Getting inside the SiP
Design teams are taking a harder look at the SiP alternative to conventional SoC design as the advantages of combining multiple dice into one package have been well-documented.
2004-03-30 Fujitsu upgrades mobile gadgets with new media processors
Fujitsu Microelectronics has introduced two new advanced Mobile Media Processors for mobile phones and other handheld devices.
2006-09-22 Freescale partners with Elmos on ASSP development
Freescale Semiconductor and Elmos Semiconductor AG will team to develop application-specific semiconductor products combining Freescale's 16bit MCU architectures with Elmos' CMOS ASSPs.
2006-09-18 Freescale develops wireless push
Freescale Semiconductor is stepping up its wireless push, armed with innovations in magnetoresistive memory and packaging, and guided by a new general manager, Sandeep Chennakeshu, recruited from Ericsson's handset group.
2004-04-01 For mixed-signal, roll multiple MEMS dice
This article will comment on trends in partitioning between MEMS accelerometer sensing elements and control ICs.
2006-01-25 Flip-Stack packaging supports wirebond-to-flip-chip transition
Amkor announced the Flip-Stack package solution that is specifically designed to support emerging transition from wirebond to flip chip interconnect for high-performance DSPs, ASICs and RF chips.
2005-09-13 Fister 'passionate' about kits
In a keynote address kicking of Cadence Design Systems Inc.'s CDNLive! designer network conference here Monday (Sept. 12), company President and CEO Michael Fister detailed the company's strategy for packaging products with intellectual property (IP) and other components to form methodology kits.
2005-03-29 First 1Gb DRAM for mobile apps
Samsung Electronics unveiled a raft of products, including what the company claims is the world's first 1Gb DRAM for mobile apps.
2012-06-26 FEMs support multiple, emerging WiFi specs
RFMD's RFFM8200, RFFM8500, RFFM8202 and RFFM8502 FEMs claim exceptional dynamic error vector magnitude performance.
2008-06-30 Fast Cycle RAM aims at CE apps
Fujitsu Microelectronics Ltd has developed a 256Mbit consumer FCRAM product for digital consumer electronics, the MB81EDS256545.
2015-02-26 Fan-out wafer level packaging to reach $200 million, analysts say
Market researchers predict in a new report that the Fan-Out Wafer Level Packaging (FOWLP) market is likely to reach an estimated $200 million in 2015, expects 30 per cent CAGR in the following years.
2003-04-28 Epson licenses Tessera packaging technology
Seiko Epson Corp. has entered a technology license agreement with Tessera Inc. to utilize the latter's semiconductor packaging technology in ASICs and specialty memory products.
2011-11-16 Embedded die tech-based 3D package unveiled
ChipletT and ChipsetT enable packaging in the sub-250?m range, up to 50 percent less than alternative embedded die solutions, the companies claimed.
2004-01-08 Elpida RAM devices improve power consumption
Elpida Memory has released its 64Mb SDR Mobile RAM devices that deliver low-power consumption and high-bandwidth performance to cellular products.
2004-05-21 Elpida DRAM eyes digital consumer apps
Elpida Memory has announced that it now offers an expanded line of 0.11?m, high-speed consumer DRAM devices for use in digital consumer apps.
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